PCBA可制造性设计规范.ppt

良信文档，未经许可不得扩散良信文档，未经许可不得扩散密级：内部公开密级：内部公开SMT PCB/Panel layout SMT Team2015-03-22PCB Design GuidelineRevision record Rev.DateChange Description02015/4/17New release PurposelBased on the requirements of production process,In the layout and circuit board design process,There is a standard to follow,To achieve high efficiency in the production of assembly,Easy assembly,low cost,and high quality target.lThe content is only applicable to the related database,some are for reference only.contentlPCB layout ruleslText marking for silkscreen layerl PCB Fiducial Mark designlPCB fixed position holelSMT component PAD design lPTH component PAD designlThrough-hole(Via)designlTrace designlother limitationPCB layout rulesl V-Cut layout rule :l Chips to V-Cut line should be more than 1mm,otherwise will damage chips or will change to use Stamp Cut design,will add the PCB costl ThedistancetoPCBedge0.5mm,cannotlayoutthetrace,ThedistancetoPCBedge1.0mm,cannotlayouttheanycomponentl The distance to PCB edge 5mm,can not layout the components height over 25mm,otherwise cuter will damage components1mmChipsChips1mmV-CUT25mm5cmmDe-panel CuterPCB V-CUT PCBPCB layout rulesl V-Cut layout rules:l PCB trace to V-Cut should be more then S=0.5mm safety buffer,otherwise will have the risk to damage the trace.lWhen we use V-Cutl PCB thickness 1.0mm to 3mm(1.0mm to 0.5mm+SMT pallet)l PCB outline is square type or rectangle type,irregular shape can not use the V-CutSTHStamp Cutirregular shapePCB layout rulesl Stamp design :l Stamp design only for irregular PCB,PCB to PCB layout distance is 2mm,V-Cut only 0.3mml Stamp design parameters Stamp Cut Stamp Cut1.5mm2.0mm5.0mm2.8mm0.4mmNPTH hole 1.0mmPCBPCBPCBPCB1.5mm2.0mm5.0mm0.4mmNPTH hole1.0mmconveyor edgeconveyor edgePCBPCBPCB layout rulesl V-Cut VS Stamp layout :l PCS to PCS distance only 0.3mm for V-Cut,we can save the PCB layout costl Stamp Cut design,PCB PCS to PCS distance is 2mml Base on same PCS design with different Cut type(stamp/V Cut),the PCB cost will impact 10-25%l V-Cut PCB will be cut by machine,but Stamp Cut will broken by OP and have stress then damage the componentsV-Cut machinePCB/panel layoutl Why dont choose single PCB for SMT process:l We need to put the each single PCB on carrier when do SMT processl But carrier cave and single PCB have tolerance,so always happen solder paste printing misalignment then will get the shift/tombstone process issuel Sometimes will happen single PCB lift up from SMT carrier and will have the chips mounting shift/missing process issues PrinterMounterAOISPI/VIPCBReflow ovenAssembly FlowPut the single PCB on the carrierPCB/panel layoutl Factorsofimpact PCB Costl PCB layout l Fine pitch componentsl Panel V-Cut/Stamp Cut/PCB conveyor edge sizel PCB drill hole size/quantityl PCB material costl PCB process easy/complicated,process specl PCB surface finished process also impact cost,OSP/IMS/EING/IMTl PCB outline,regular shape is cheaper than irregular shape,TextmarkingforsilklayerThe current situation:l We received the gerber file for UK design team,no silk layer be found lWe can not directly confirm Polarity of component on the PCB ,can not confirm the location of component,easily to confirm IC shift or not.lIn the production adjustment X,Y coordinate and confirmation the location completely rely on engineering drawings,Big waste of time.No silk layers in the gerber fileNo text mark on the pcbTextmarkingforsilklayer l As the icon text marking design we can accept.We can quickly inspection location where there are problems.silkscreenText markingTextmarkingforsilklayerComponent outline&polarity marking design definition:lText marking,keep away from Via Hole or Through Hole as far as possiblelText marking,Silk screen printing character,polarity and polarity signs can not components be coveredlText height25 mil,line width 5 millBeside the BGA/CSP,component outline should not smaller than actual component size.lThe text does not overlaplSMD/PTH component text marking include body outline,pin assignment,component name,polarity marking.as below:lComponentoutline&polaritymarkinga.Tantalumcapacitorordiode3PINb.SOP/SSOPc.QFPTextmarkingforsilklayerlComponentoutline&polaritymarkingd.QFNe.BGA,CSP marking-.outline size must the same as actual componentTextmarkingforsilklayerlPCBnumberandversion(i)PCBModel(ii)PCBPartnumberandversion(iii)textheight:80milPCB板號說明如下：西元年度後兩碼(06,07)全新PCB必需附予板號及-SA(SampleA)版本，爾後修改版本依序為-SB、-SC，或-1A、-1B、-1C.等，量產時版本必需為-1、-2、-3等TextmarkingforsilklayerPCB FiducialMarkdesignlThe current situation:Many projects did not design fiducial mark-in,the machine can not recognize to position,cause no high precision print/mounted PCB FiducialMarkdesignDd=1.0mmD=3.0mmd4.0mmHL5.0mmHLl Three fiducial mark-out located diagonally on board,and do follow related dimension requirement.fiducial mark dimension is 1mm(d)and solder mask is 3mm(D).The diagonal fiducial mark should not be symmetrical,it should be keep away at 5 mm.l Fiducial PAD edge keep 4mm distance from the edge of PCB lSingle board must have two fiducial mark in located diagonally on the board.Mark outMark inPCB fixed positionholelToolingholesonallboardsarecalledoutwithcorrectdimensions,tolerances,andarenon-plated.(3.55mm+0.075/-0or2.18mm+0.05/-0.05)lThereshouldbe3.81mmarclocatedat4cornersofPCBtoavoidstuckatconveyoranddamageofpackingmaterial.UniformfixedholesizeandconvenienttoolforpositioningToolingholes3.81mmarclNG symptom:0402 chip tombstonelFor example:D500+FN700054 chip 0402 chip tombstone defect rate:1.0%lNG picture:lAnalysis:PAD to PAD space is too big caused the tombstone after IR.PAD to PAD:16milPAD to PAD:22milSMTcomponentPADdesignSMTcomponentPADdesignlNon specifications within RLC Pad design according to the following principles(i)B=max of W1,to prevent the shift(ii)C=10+H(electrode width)+15 mil(iv)restricted area L2:A+10mil,W2=max:(W1+8+max of tolerance,B+10)TYPEBody Size(mil)Component body tolerance(mm)Pad Size(mil）L1W1ABCD0201(0603)24120.0336121480402(1005)40200.05562222120603(1608)63320.1834031210805(2125)79500.21036137291206(3216)123630.251607350601210(3225)1231010.217111055612010(5025)197990.25230110451402512(6432)2521260.2529013870150ref.L2=A+10；W2=max:(W1+8+max of tolerance ,B+10)(1)Resistanceandinductancecomponentssizelist22x22mil4mil fillet12mil57mil83614mil 12mil2mil fillet0201 PAD design0402 PAD designNote:besides the chip 0201/0402,the rest of database is for reference only unit:milSMTcomponentPADdesignTYPEBody Size(mil)Component body tolerance(mm)Pad Size(min)Placement SizeareaL1W1ABCDL2W20201(0603)24120.033612148512211220402(1005)40200.0556222212753425500402(1005)40200.10.2602824120603(1608)63320.2834031211054648300805(2125)79500.2510361372914076106401206(3216)126630.316073506018286156521210(3225)126990.31711105561190130247001808(4520)189800.32109050110230120276001812(4532)1821260.3207136608723716639342ref.L2=A+10；W2=max:(W1+8+max of tolerance ,B+10)(2)capacitancecomponentsizelistNote:besides the chip 0201/0402,the rest is for reference only unit:milSMTcomponentPADdesignTYPEBody SizePad SizePlacement SizeareaL1W1ABCDL2W232161246617666507622711225424352814211324090906028316446412603223213033410590154380180684007343282173338959015839020078000ref.L2=A+30；W2=component body width+20；D=A-2 x C;SMTcomponentPADdesign(3)STC32167343unit:milNote:Nochipscomponentthatsizebelow0603locatedbeside7347and6032tantalumcapacitorwithin2.6mmpadtopaddistance.Ifun-avoidable,thechipcomponentsshouldbeverticalwiththetantalumcapacitor.TYPEBodySizePadSizePlacementSizeL1W1abcL2W2SE31168.06.33.11.62.29.47.0SE28116.35.02.81.61.48.05.7SE27166.05.02.71.61.47.85.7SE25165.54.02.51.61.07.04.7unit:mm(4)ElectrolysiscapacitorpartssizelistSMTcomponentPADdesign(5)Diode-3PINTYPEBodySizePadSizePlacementSizeL1W1a1a2bcdeL2W2SOT-2348404012040136136156Diode-3PIN48404012040136136156ref.W2=e+20,L2=max(c+16;L1+16)e=E+30d=D+6b=B-A2-6a1=(e-d)/2a2=A2+6DA1A2EBA18mil R角A3a3=A3+6unit:milSMTcomponentPADdesign(6)ConnectorpinforSinglesidePitch,bBodySizePadSizePlacementSize(mm)(mil)L1W1acL2W20.519.68512A+30L1+30W1+500.6350.65025.0025.5914A+30L1+30W1+500.6525.59B+4A+30L1+30W1+50Note*Ifthecomponentpitchbedefinedbythemetricunit,InEnglishunitsshouldbeconsideredforthecalculationofthecumulativeerrorofPitch*Thedistancebetweenconnectorsshouldatleasthave2mmspacefromtheoutlineedgeofthePadorBody.*Forcomponenthigherthan5mm,needtokeepsamedistance/clearanceonpcbsurfacefreefromcomponenttoavoidshadoweffectandcausingAOIlimiation.*Thedistancebetweensmdtypeconnectorandchipshouldatleasthave2mmspacefromtheoutlineedgeofthePadorBody.*Bosspinholesize(NPTH)=Connectorbosssize+0.15mmunit:milSMTcomponentPADdesignPitch,bBodySizePadSizePlacementSize(mm)(mil)L1W1acdL2W20.519.68512A+30W1+40L1+30d+300.6350.65025.0025.5914A+30W1+40L1+30d+300.6525.59B+4A+30W1+40L1+30d+30Note*Ifthecomponentpitchbedefinedbythemetricunit,InEnglishunitsshouldbeconsideredforthecalculationofthecumulativeerrorofPitch*Thedistancebetweenconnectorsshouldatleasthave2mmspacefromtheoutlineedgeofthePadorBody.*Forcomponenthigherthan5mm,needtokeepsamedistance/clearanceonpcbsurfacefreefromcomponenttoavoidshadoweffectandcausingAOIlimiation.*Thedistancebetweensmdtypeconnectorandchipshouldatleasthave2mmspacefromtheoutlineedgeofthePadorBody.(7)Connectorpinfortwosideunit:milSMTcomponentPADdesign(8)ICtypesa.SSOP,SOPTypePitch,bBodySizePadSizePlacementSize(mm)(mil)L1W1acdW2L2SSOP0.415.748860W1+30d+30L1+20SSOP0.519.68512SSOP0.6352514SSOP0.6525.59SSOP0.831.49616SOP1.275025Note*Ifthecomponentpitchbedefinedbythemetricunit,InEnglishunitsshouldbeconsideredforthecalculationofthecumulativeerrorofPitchunit:milSMTcomponentPADdesign(8)ICtypesb.QFPPitchBodySizePadSizePlacementSizebW1L1acd1d2W2L219.485(0.5mm)1260W1+40L1+40d1+20d2+2025.59(0.65mm)1690W1+50L1+50d1+20d2+2031.496(0.8mm)1890W1+50L1+50d1+20d2+20NoteIfthecomponentpitchbedefinedbythemetricunit,InEnglishunitsshouldbeconsideredforthecalculationofthecumulativeerrorofPitchunit:milSMTcomponentPADdesignICtypes(9)QFNPitchBodySizePadSizePlacementSizebDEacd1d2L2W219.485(0.5mm)1260E+40(Onbothsidesofthe20)D+40(Onbothsidesofthe20)d1+30d2+3025.59(0.65mm)1460E+40(Onbothsidesofthe20)D+40(Onbothsidesofthe20)d1+30d2+30Note Ground pad at the bottom of the QFN:A-D2=0.4 mm;B-E2=0.4 mmunit:milSMTcomponentPADdesignBGA,CSPPitch,bBodySizePadSizePlacementSize(mm)(mil)L1W1aL2W2CSP=5mm5mm5mmL1+120W1+120Note*Dontoverlapwithanycomponent.*DontputtherangeofConnector,BGAandotherlargeeasytoheatparts.AlloftheViaHoleshallbedoublecoverageofsoldermasklayersunit:milSMTcomponentPADdesignPTHcomponentPADdesignl Inordertosimplifyandimprovetheprintingcircuitwelding(soldering)process,Thespecialdevelopmentofthrough-holereflowtechnology(Pin-in-Paste)Thethrough-holetypeconnectorfromDippingprocess,changetoSMTprintingsolderpasteandreflowreplaced.Placeallthru-holepartsontopsideoftheboard.(Avoidmanualsolderingprocess)l B:aperture sizepin diameter size+0.25 mm(10 mil)l A:The outer layer of the minimum pad size aperture size+0.36 mm(14 mil)l According to the manual soldering parts:Pad size(A)=Hole size(B)+40 millPTH design guidelinelPartsofpindiameterandthroughtheapertureratio(PH)principle:Pintoholerate(P/H)shouldfallwithin0.60.8,shownasdiagram:PH=0.60.8thebest;PH=0.40.5Acceptable;PH320.Other limitationlPIP parts limitlAllofthethroughholepartmustbedesignedinsecondtoavoidtheuseofhandsolderingprocessThefirstsurfaceisnecessarytousetheSMDTYPEpartorthroughholepartspinandpartsbodycannotoutstandPCBsecondsurfacelThespecofpinoutofpcbsurfaceinPIPprocess:pinlengthPCBthickness+0.30.6mmTheinsertpartsinPCBcannottilt,dumpingoreasytoloosestate.Other limitationOther limitationlChoose the component:The use of chip components in the SMT stage as far as possible,reduce the waste of human action.PTH parts to SMDPTH parts to SMDPTH parts to SMDPTH parts to SMDOther limitationlNotracecuttingorjumpwiresprocessonmassproductionmodels.Cut traceCut traceJump wireslPCBpadsizeshouldbematchwiththesizeofcomponents,Ifthesamepartshavedifferentappearancesize,theLayoutoraccordingtoprocessproposalstospecialLayout,mustconformtherule。Allofpaddesignneedtonon-soldermaskdesign.lPassivecomponentpadsizelThegeneralRLCcomponent：placeoutlineareadonotoverlapDonotoverlapOther limitationlForcomponenthigherthan5mm,needtokeepsamedistance/clearanceonpcbsurfacefreefromcomponenttoavoidshadoweffectandcausingAOIlimiation.D=HOther limitationGerber file layers requirementSMD layer:component PAD,reference this layer to design stencil aperture Gerber file layers requirementSilk layer:SMDcomponenttextmarkingincludebodyoutline,pinassignment,componentname,polaritymarking Gerber file layersrequirementSolder mask layer Gerber file layers requirementPlace layer:check the component location Gerber file layers requirementDrill layer:confirm the through-hole size whether it match with the componentThank You!