CCM产品工艺知识培知识.ppt

Prepare by:civvy chenCCM产品工艺知识培训产品工艺知识培训日期日期日期日期:2011.8.202011.8.20Prepare by:civvy cheno 产品的应用产品的应用o 产品的类型产品的类型o 产品的构造产品的构造o 产品的制作工艺产品的制作工艺o 问与答问与答o 附录附录:专业名词介绍专业名词介绍2Prepare by:civvy chenPart I 产品的应用产品的应用3Prepare by:civvy chenPart I 产品的应用产品的应用拆解拆解手机摄像模组手机摄像模组手机摄像模组手机摄像模组4Prepare by:civvy chenPart II 产品的类型产品的类型 软板定焦模式(FF)1.B-To-B 2.Gold Finger5Prepare by:civvy chenPart II 产品的类型产品的类型 软板变焦模式 1.手动变焦(MF)2.自动变焦(AF)6Prepare by:civvy chenPart II 产品的类型产品的类型 插槽模式(Socket)7Prepare by:civvy chenPart II 产品的类型产品的类型 像素分类 CIF (352*288)10万像素(0.1M)VGA (640*480)30万像素(0.3M)SXGA(1280*1024)130万像素(1.3M)UXGA(1600*1200)200万像素(2.0M)8Prepare by:civvy chenPart III 产品的构造产品的构造 CSP(Chip Scale Package)ChipLensBarrelHolderIR FilterstiffenerFPCSolder BallGlass9Prepare by:civvy chenPart III 产品的构造产品的构造 COB(Chip On Board)ChipLensBarrelHolderIR FilterFingerGold WireFPCPCB10Prepare by:civvy chenPart III 产品的构造产品的构造镜头镜头(Lens)镜座镜座(Holder)芯片芯片(Chip)电路板电路板(PCB)连接器连接器(Con.)11Prepare by:civvy chenPart III 产品的构造产品的构造CMOS CHIPLENS HOLDERLENS BARRELThese 3 items come as an assembly1st LENS ELEMENT2nd LENS ELEMENTIR GLASSSUBSTRATEFPC12Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 材料 1.晶圆(Wafer)主要是由硅和锗组成,是摄像头模组的核心部分,称之为影像传感器。13Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 2.线路板 Printed Circuit Board印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.14Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 3.镜座(Holder)15Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 4.镜头(Lens)16Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 5.软板(FPC)Flexible Circuit Board软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路。17Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺 工艺流程 Wafer清洗Plasma清洗固晶固晶烘烤邦线金线检查DAM邦定DAM烘烤二流体清洗CCD检查Glass贴附CCD检查固化半成品测试18Prepare by:civvy chenProcessSupply WaferTrayOKOKOKOKN/AOKN/AOKIR Glass Attach ProcessCM800Barrel Insert ProcessCM800dispenseCMOS ChipdispenseIR Glassdispense+Lens BarrelDie Attach ProcessCM800Holder Attach ProcessCM80019Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺Die Bonding:使芯片 与PCB粘合。注意点：1.芯片方向 2.胶量 3.顶针和吸嘴印 4.芯片角度 5.芯片位置 6.芯片倾斜 20Prepare by:civvy chenPart IV 产品的制作工艺产品的制作工艺Wire Bonding:通过金线焊接使芯片与PCB线路导通。注意点：1.接线是否正确 2.线弧 3.金球大小 4.金球厚度 5.金线拉力 6.金球推力 21Prepare by:civvy chenSolder PasteScreen PrintPassive PlacementForDie AttachPassiveSolder PastePassiveSubstrate22Prepare by:civvy chenDie AttachWire BondingWet CleanChipSensorAreaAu WireChipSensorAreaAu Wire23Prepare by:civvy chenIR Glass MountIR Glass SAWWafer RingIR GlassIR Glass24Prepare by:civvy chenGlue DispenseIR Glass AttachHolderHolderGlueGlueIR cut GlassIR GlassCA800-IRCA800-IRCA800-IRCA800-IRCA800-IRCA800-IR25Prepare by:civvy chenGlue DispenseHolder AttachGlueGlueBarrel InsertBarrelHolderCA800-HACA800-HACA800-HACA800-HACA800-HACA800-HACA-800-BICA-800-BICA-800-BI26Prepare by:civvy chenSinglationcutcut27Prepare by:civvy chenFocus adjustBarrelBarrel FixationMotorLighting（Percolation Method)chartAchromatic LensND4（Adjustment of Light Quantity）Laser28Prepare by:civvy chenPart V 问与答问与答Q&A29Prepare by:civvy chenPart VI 专业名词介绍专业名词介绍30Prepare by:civvy chenENDENDThanks!Thanks!31Prepare by:civvy chenBonding ProcessBonding Process32Prepare by:civvy chenpadpadleadleadFree air ball is captured in the chamfer33Prepare by:civvy chenpadpadleadleadFree air ball is captured in the chamferSEARCH HEIGHT34Prepare by:civvy chenpadpadleadleadFree air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 135Prepare by:civvy chenFree air ball is captured in the chamferpadpadleadleadSEARCH SPEED1SEARCH TOL 136Prepare by:civvy chenFree air ball is captured in the chamferpadpadleadleadSEARCH TOL 1SEARCH SPEED137Prepare by:civvy chenFree air ball is captured in the chamferpadpadleadleadSEARCH TOL 1SEARCH SPEED138Prepare by:civvy chenFree air ball is captured in the chamferpadpadleadleadSEARCH TOL 1SEARCH SPEED139Prepare by:civvy chenFormation of a first bondpadpadleadleadSEARCH SPEED1SEARCH TOL 140Prepare by:civvy chenFormation of a first bondpadpadleadleadSEARCH SPEED1SEARCH TOL 1IMPACT FORCE41Prepare by:civvy chenFormation of a first bondContact padpadleadleadheatPRESSUREUltra Sonic Vibration42Prepare by:civvy chenFormation of a first bondBase padpadleadleadUltra Sonic VibrationheatPRESSURE43Prepare by:civvy chenCapillary rises to loop height positionpadpadleadlead44Prepare by:civvy chenCapillary rises to loop height positionpadpadleadlead45Prepare by:civvy chenCapillary rises to loop height positionpadpadleadlead46Prepare by:civvy chenCapillary rises to loop height positionpadpadleadlead47Prepare by:civvy chenCapillary rises to loop height positionpadpadleadlead48Prepare by:civvy chenCapillary rises to loop height positionpadpadleadleadRHRH49Prepare by:civvy chenFormation of a looppadpadleadleadRD(Reverse Distance)50Prepare by:civvy chenFormation of a looppadpadleadlead51Prepare by:civvy chenpadpadleadlead52Prepare by:civvy chenpadpadleadleadCalculated Wire LengthWIRE CLAMP CLOSE53Prepare by:civvy chenpadpadleadleadCalculated Wire Length54Prepare by:civvy chenpadpadleadleadSEARCH DELAY55Prepare by:civvy chenpadpadleadleadTRAJECTORY56Prepare by:civvy chenpadpadleadleadTRAJECTORY57Prepare by:civvy chenpadpadleadleadTRAJECTORY58Prepare by:civvy chenpadpadleadleadTRAJECTORY59Prepare by:civvy chenpadpadleadleadTRAJECTORY60Prepare by:civvy chenpadpadleadleadTRAJECTORY61Prepare by:civvy chenpadpadleadleadTRAJECTORY62Prepare by:civvy chenpadpadleadleadTRAJECTORY63Prepare by:civvy chenpadpadleadleadTRAJECTORY64Prepare by:civvy chenpadpadleadleadTRAJECTORY65Prepare by:civvy chenpadpadleadlead2nd Search HeightSearch Speed 2Search Tol 266Prepare by:civvy chenpadpadleadleadSearch Speed 2Search Tol 267Prepare by:civvy chenpadpadleadleadSearch Speed 2Search Tol 268Prepare by:civvy chenFormation of a second bondpadpadleadleadheat69Prepare by:civvy chenFormation of a second bondContactpadpadleadleadheatheat70Prepare by:civvy chenpadpadleadleadheatheatFormation of a second bondFormation of a second bondBaseBase71Prepare by:civvy chenpadpadleadlead72Prepare by:civvy chenpadpadleadlead73Prepare by:civvy chenpadpadleadlead74Prepare by:civvy chenpadpadleadleadTail length75Prepare by:civvy chenpadpadleadlead76Prepare by:civvy chenpadpadleadlead77Prepare by:civvy chenpadpadleadleadDisconnection of the tail78Prepare by:civvy chenpadpadleadleadDisconnection of the tail79Prepare by:civvy chenpadpadleadleadFormation of a new free air ball80此课件下载可自行编辑修改，供参考！感谢您的支持，我们努力做得更好！