电子英语证书考试(PEC)-半导体词汇汇总.doc

电子英语证书考试(PEC)-半导体词汇汇总1号极限开关LS1(limit suitch 1)232 bus的使用寿命已到或线路短路或断路232 bus error488 bus的使用寿命已到或线路短路或断路488bus error5S(整理、整顿、清扫、清洁、修养)5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)5u之pp质滤心cartridge p.p 5uABC分类法ABC classificationAUTO模automatic molding systemA板A plateBT指示剂eriochrome black t indicatorB板B plateCO2气泡机CO2 bubblerDIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。The product is rejectable when pad support protrudes more than 0.25mm from the end of the package body.(sop:0.15mm).DIP：不符合脚量规之脚弯拒收。Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable.DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。Ejector marks more than above the surface or more than 0.5mm below the surface of the device is rejectable.DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾污。Package leads shall be free from attached foreign material except for foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter.DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.Driver board的使用寿命已到或线路短路或断路driver board errorEDTA-2NA 标准溶液EDTA-2NA standard solutionEprom的使用寿命已到或线路短路或断路eprom errorKBS 94 混床树脂筒leasing mix bed resin bottle, kbs 94L/F存放架stack loaderL/F放反将导致反弯脚。Lead frame reverse will cause reverse bending.L/F排放机Lead Frame Auto Loader MachineL/F用剥锡剂 TLS-85asolde stipper for plastic package,TLS-85aL/F用剥锡剂 TLS-85bsolde stipper for plastic package, TLS-85bL/F用剥锡剂 TLS-86solder stipper for plastic package,TLS-86L形尾塞end plug (L)L型尾塞end plug(L)MPU的使用寿命已到或线路短路或断路MPU errorN2流量nitrogen gas flow rateOC曲线poprtation curveP.P 打包袋P.P BandPDCA管理循环PDCA（Plan-Do-Check-Action)PIN1标示PIN1 identificationPIN1标示要有且与规格所订的尺寸一致。The PIN1 identification must be present and in accordance with the specified dimensions.PP材质阳极袋anode bag p.p.QA允收章QA markQFP用的塑胶承载盘QFP plastic trayRAM的使用寿命已到或线路短路或断路RAM read/write error即RAM errorSOP：不均匀的镀层表面，使得脚的宽度大于0.5mm或脚厚度大于0.25mm。Non-uniform lead finish such that a lead exceeds the specified dimensions 0.5mm or leadl thickness exceeds 0.25mm is rejectable.SOP：产品边缘上的裂角宽或深大于0.2mm，长大于0.6mm或露出体材料拒收。Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.SOP：顶出孔低于胶体表面0.2mm，或是高于胶体表面拒收。Ejector marks more than above the surface or more than 0.2mm below the surface of the device is rejectable.SOP：脚浮不得超过0.1mm。Lead coplanarity shall be within 0.1mm of one another in the vertical direction.SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于50脚宽为直径的圆面积。Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.SOP：离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body.SOP：由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.S形尾塞end plug (S)XX部门经理manager of XX departmentXX电子有限公司XX Electronics CO.LtdX管率X-ray yieldX射线X-rayX-射线检验X-ray inspection安全光幕safety curtain安全库存量safety stock安全眼镜safety glasses氨水ammoniam water按下紧急按钮。Press the emergency button.按需订货lot for lot昂球lifted bond昂楔lifted wedge凹模cavity plate,cavity block百万分之一PPM (parts per million)柏拉图Pareto chart板状模组模具plate mold半导体semiconductor半球insufficient ball size半自动框架输送机off loader包反wrong orentation molding包反wrong orientation molding包封molding包封molding 包封模具mold chase包封模具mold chase包封偏差molding mismatch包装packing包装packing 包装盒(内箱)packing box包装盒缺点packing defect criteria包装外箱shipping box保管费carrying cost保管费率carrying cost rate保险期safety time保压时间holdup time保质期shelf life报废scrap备注remark背金/银backside metal (Au/Ag)背面back side背面打印back marking崩角chip package崩碎chips比重specific gravity比重specific gravity比重计hydrometer闭环物料需求计划closed loop MRP闭模时间closing time边筋翘起bending side rail边晶edge die边晶reject die around slice edge边框side rail边沿芯片edge die编带Tape & Reel编带tape/real编带拉力测试peel back force test编织层braid扁平电缆flat cable,ribbon cable扁球flat ball变差variation变色discoloration变色（发黄，发黑，发花，水渍，酸斑）discolor(yellowish,blcken,water mark)变色、氧化、浮起discoloration/oxidation/lifting变形deformed变形deformed/distort标杆瞄准benchmarking标签label标签、封装、QA允收章defect criteria labelled boxes/seal/QA mark标签内容错误wrong contents on label标签内容与内盒产品不符合contents of label do not correspond with contents of box标签位置不对、标签贴反wrong location/orientation of label标准criteria标准操作程序（作业指导书）SOP（Standard Operating Procedure）标准产品成本standard product cost标准单位运转工时standard unit run hour标准工资率standard wage rate标准机器设置工时standard set up hour表面安装surface mounting表面粗糙dull finish / rough surface表面贴装式surface mount technology(SMT)表面污染surface contamination别忘了在不良产品上作记号Dont forget to mark at NG products.冰箱refrigerator冰柱状icicle丙酮acetone饼夹Pellet Tong波峰焊wave soldering玻璃棒glass rod玻璃转换温度grass transition temperature薄膜气泡tape bubbles薄片，锯齿状flake补焊rebonding补零remanence fill补足欠交fill backorder不得有任何金属层腐蚀ny metallization corrosion is rejectable不合格ninconformity不合格品ninconformance不活动报告no action report不良品reject unit (RJ)不良数管制图P N chart不相同盖印different marking不粘Non-Stick不正确的周期码incorrect date code布线错误wrong bonding布线图bond diagram步进夹子index cliper步骤process/step部分盖印partial marking擦痕scratches擦伤scratches擦锡solder scrape材料material材料清单BOM（bill of material）财务部financial department(FD)采购订单跟踪purchase order tracking采购订单价格price purchase order采购计划法vendor scheduling采购计划员vendor scheduler采购员buyer参数parameter残料率scrap factor残渣、废屑residues仓库库位类型inventoty location type仓位备注location remarks仓位代码location code仓位数量quantity at location仓位状况location status操作规程（操作说明书/操作手册）operation manual操作员operator测镀sputtering测浇口edge gate测克pull test测克拉力pull test测克拉力机pull meter测克异常报告书abnormal report of pull test测力计force gauge测量measurement测量内容measure item测量系统分析MSAmeasure system analysis测试test测试机诊断test diagnostic层level层流台lamina flow插孔socket contact查找和确认根本原因Define & Verify Root Cause差色剂colorant产量through put产品product产品（封装体）package产品长度packqge length产品结构树production tree产品控制product control产品宽度package width产品率production rate产品设计package design产品特殊特性special product characteristic产品外形测量measure for package out-line产品线production line产品在管中products in tubes产品在管中方向错误wrong orientation of products in tube产品质量先期策划和控制计划APQPadvanced product quality planning and control plan厂际需求interplant demand超波膜UV tape超薄型四周平面式封装ICTQFP thin quad flat pack超薄型缩小式海鸥翅膀型封装ICTSOP thin small outline package超期待烘产品烘烤及生产纪录dry for overdue prduct of wait for molding and production record超声波焊接ultrasonic welding超声波清洗机ultrasonic clearing machine超音波功率bond power超音波清洗F/S finesonic clean车床engine lathc车间作业管理shop floor control尘粒particle 尘粒计数器particle counter尘流台laminar flow沉淀物precip itate成份composition成型forming成型角度foot angle承载架carrier承载架剥锡剂 BS-89belt stripper,bs-89程序procedures尺寸控制计划（动态控制计划）DCP dimension control plan(dynamic control plan)齿条anti bar充压air compressed冲床punch machine冲杆头plunger tip冲杆压强transfer pressure冲胶D/J冲胶杆plunger 冲胶劲transfer pressure冲胶时间transfer time冲胶式transfer type冲胶套筒pot冲胶压力transfer pressure冲切，成型模具dieset冲切不对称dam bar dimension冲塑degate/dejunk冲塑切中筋dejunk trim冲弯率wire deflection rate冲压车间stamp workshop,press workshop冲压模具die冲压速度injection setting冲圆fan out抽样sampling抽样计划sampling plan抽样数sample size抽样数SS（Sample Size）出货shipping出货shipping出货标签shipping label出货标签shipping label出货品管OQC（Out-going Quality Control)初始过程能力preliminary process capability除非共同的接点，否则焊线与焊线不可相交Broken wire is rejctable.储存干燥箱store dry box传统摸（单缸模）conventional mold die传位不良index error吹气位blow position吹气延时high pressure blow time纯水deionized water (DI water)纯铜散热片Copper Heat Sink次品率yield lost次要缺点minor defect次要缺陷minor failure粗糙面rough surface粗能力计划rough-cut capacity planning催化剂curing agent存储干燥箱store dry box措施信息action message错方向wrong orientation错模offset错模offset mold错位molding mismatch错字wrong marking达到库存available stock打凹down set打包带太松P.P Band too loosen打包机packing machine打不粘Non-stick打次defect打火棒E.F.O.touch打线速度bonding speed打线图bond diagram打印marking打印marking打印不良illegible marking打印偏移marking off-center打印字间距mark character distance大脚上镀不全面积大于小脚宽为为直径之圆面积，拒收Non-wetting above seating planelead width is rejectable.呆滞材料分析excess material analysis待检验产品waiting for inspection戴粉红色帽子的人就是领班The foreman is the person who wears the pink hat.单列直插式single side lead insert单面板single sided board单腔模具single cavity mould单位成本unit cost单元式制造cellular manufacturing单值individual弹坑crater弹匣cassette/magazine弹匣组cassette set弹性强度flexural strength弹性系数flexural modulus氮气N2 /nitrogen氮气柜N2 cabinet当一个产品其正面及反面分别表示不同类型时拒收。When a device has top and bottom marking indicating different product type, it is rejectable.刀痕毛刺kerf chipping刀片punch刀片punch导电袋conductive bag导电地垫conductive floormat导电管conductive tube导电海绵conductive sponge导电胶epoxy导电胶epoxy导电胶不足insufficient epoxy导电胶不足insufficient epoxy导电胶裂缝epoxy crack导电胶气孔epoxy void导电性conductive导电桌垫conductive table mat导轨（流道）workholder导套bushing导线wire导柱guide pin导柱post导柱（标杆）post倒冲法back flush倒角chamfer / touch up倒序计划back scheduling倒装芯片FC（Flip Chip）倒装芯片flip chip登陆标志MPS book flag MPS低位码low level code低应力添加剂low stree additive滴定分析titration analysis底针板ejector plate地板building floor第1脚记号pin 1 dot第二点球焊功率2nd bond power第二点球焊时间2nd bond time第二点球焊压力2nd bond force第二点脱落second bond peel off第一点球焊功率1st bond power第一点球焊时间1st bond time第一点球焊压力1st bond force第一点虚焊1st bond non-stick第一只脚pin 1 indicator点焊不完全在焊接脚的焊接区内（点斜边）Bonds on thepackage post that are not completely within the boundaries of the package post is rejectable.点焊尺寸（第二点焊球尺寸）Tailless bonds on the die or package post that are less than 1.2 times or greater than 5.0 times the wires the wire diameter inwidth or are less than 0.5 times or greater 3.0 times the wire diameter inlength is rejectable.点火器spark gun点浇口pin-point gate点胶die coating点胶步骤procedure for chip coating点胶机chip coating machine点胶缺点chip coating defect点胶污染Dimensions contamination.点胶一般缺点Chip coating general defect.点脱lift stitch点温计digimite碘标准溶液iodine standard solution 电镀plating电镀plating 电镀处理槽plating tank电镀流量plating current电镀线plating line电镀液添加剂 solderluxplating solution additive,solderlux电镀子良品defective plated parts 电极element电加工设备electron discharge machining电解脱脂electroltic degrease电介质dielectric电控柜control panel / electrical cabinet电缆夹cable clamp电缆中导线的头数ends电流electrical current电脉冲车间electric discharge process workshop电脑辅助设计CAD电脑监控式压模机PC control molding press电性检验EQC (electrical quality control)电压electrical voltage电压voltage电源power电子档保存e-copy / soft copy电子可程式唯读记忆体EPROM (erasable-programmable rom)电子天平micro balance电阻的温度系数temperature coefficient of resistance电阻质volume resistivity垫块真空孔vacuum spacer玷污（外来材料）Contamination(foreign material)淀粉指示剂starch indicator吊车hoist调机machine buy off调整现有库存量adjust-on-hand顶出孔ejector marks顶杆ejector pin顶孔ejector pin hole顶针ejector needle/pin顶针ejector pin顶针孔E-pin hole(ejector pin hole)顶针延时ejector up delay订单PO（Purchase Order）订单输入order entry订货备注order remarks订货承诺order promising订货点order point订货方针order policy定模stationary mould,fixed mould定模座板top clamping plate,top plate,fixed clamp plate定位，对准alignment定位不准misalignment定位环locating ring定位基准datum reference定位孔location pin hole定位孔positioning hole定位块locator block定位销dowel定位销孔dowel hole定位针location pin定型装置sizing system董事长president动模movable mould,movable half动模座板bottom clamp plate,moving clamp plate动态静态随机记忆体DRAM,SRAM动态试验dynamic test洞之直径大小，其允收的判定标准同与气泡（28.1)For diameter requirements see table 28.1.独立需求independent demand镀层剥落solder peel off镀层测厚solder thickness test镀层测厚仪solder thickness meter镀层厚度plating thickness镀层膜厚测试仪coatign thicking gauge镀层偏厚或偏薄thick or thin plating镀层气孔solder void镀层气泡solder bump镀架（挂具）plating rack端子terminal断刀检测blade breakage detector (B.B.D)断脚broken lead断脚lead broken 断脚broken lead断丝broken wire断丝broken wire断线wire broken断字broken character断字broken symbol队列queue对300/400mil的产品在注入孔处的缺空,宽和深同时大于1.25mm时拒收;而600mil的产品,宽不得大于2.5mm,深不得大于1.25mmThe 300/400 mil devices having voids greater than 1.25mm in width and 1.25mm in depth on the injection gate area are rejectable.any 600 mil devices having voids greater than 2.5mm in width ang 1.25mm in depth on the injection gate area rejectable.对不起，可以讲慢一点吗？Excuse me,would you speak moe slowly?多层印制电路multilayer printed circuit多方论证小组CFT cross function team多缸模MGP(Multi Gang Pot) mold die多浇口multi-gating多胶excess expoxy多晶模组D型种类ICMCM-D mult chip module-D多腔模具multi-cavity mould多余字extra charactes多重仓位multiple location额定电流rated cuttent额定电压rated voltage二极管diode发货delivery发货单ship order发货单联系人ship contact发货地址ship address发货零件ship date发货日期date to pull发料单disbursement list发票价格price invoice发送订单issue order发送零件send part阀门开关valve法兰、凸缘flange反查pegging反常需求abormal demand反面bottom surface反切wrong orientation forming反推杆stopper反应计划rfaction plan返工rework返工rework返修repair方差分析法ANOVA analysis of variance方铁spacer plate方向高度reverse