安全投产过程中的供应商(课堂PPT).ppt

按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,*,Lite-On Supplier Safe Launch process,1,Safe Launch Model 模式,光寶供應商 safe launch 模式As volume increasesquality increases 產品品質與產量同步提升管理模式。,2,Occasions 時機,Development Cycle,ISO 9001(Design Input),Design Output,Design Verification,Design Validation,Lite-On,s NPI,EVT,DVT,MVT,(Phase Review Process),Sample build,Pilot Run,Pre-Mass production,Supplier,Safe Launch Process,R&D Sample approval,Pilot Build,Controlled Ramp,PPAP compliance,PPAP:Production Part Approval Process,3,Compare S.L.with Dell and Lite-On 戴爾 vs.光寶模式,Lite-On NPI,EVT,DVT,MVT,Lite-On,(Phase Review Process),Sample Run,Pilot Run,Pre-Mass production,PPAP approval,Dell,totally,7 gates,Lite-Ons NPI phases,Lite-On supplier 3 gates,Lite-Ons supplier adopt 3 gates:Component level,Pilot Initiatives,Supplier,NPI,EVT,DVT,MVT,Supplier,Safe Launch Process,Sample build,Pilot Build,Gate1,Controlled Ramp,Gate1+Gate2,PPAP compliance,4,Responsibility 權責,Commodity team:when part created,PM,R&D,and SQM involved the NPI as one commodity team,define yield/gates,RTS and MRB decision.產品小組：由PM,R&D與SQE共同組成，光寶RSQE與小組成員共同定義產品與製程的良率/階段要求、時程管理、與階段特採決議。,PM：RTS timing management,production quantity definition of DVT and MVT phases.產品管理：產品開發至上市總時程管理、DVT,MVT 生產數量定義。,Lite-On JQE:Involve the MRB decision making with commodity team.客戶JQE：與 commodity team 共同參與試產特採決定。,Lite-On SQE：Process review for each gate;is managing the product/program is responsible for implementation and adherence to this process.本程序之製程審查;管理本程序之供應商試產（Pilot build,Control ramp）、紀錄審查、與供應商製程改善活動。,R 定義產品重要功能特性（CTQ）、並描述於零件承認書圖面中；解決本程序中供應商生產所發現之設計面重大問題。,RTS:Ready to shipment,CTQ:Critical to quality,5,Yields/Gates 良率/階段的定義,Process yield-gates will be defined and documented for both the pilot and controlled ramp prior to the first pilot build.Lite-On commodity team defines these gates and targets.Gates are set with risk management in mind that is based on quality.See table below as an example.Goals will not be changed without the agreement of the commodity team.,本程序的各個階段良率由光寶commodity team共同定義之,，基本上是由品質風險的角度來設定，如下表案例。一旦各個階段良率目標定義後，就不再變更。目標變更，須經由產品小組同意。,Commodity Type,DVT,MVT,Pilot Build,Gate1,Controlled Ramp,Gate 1,Controlled Ramp,Gate 2,Quantity,FPY,Quantity,FPY,Quantity,FPY,PCB,32,80%,300,85%,500,90%,Plastics molding,50,85%,100,90%,300,95%,Metal stamping,120,80%,30%DM,85%,60%DM,90%,Quantity and FPY targets are recommendation.,DM:Demand of Market,6,Safe Launch Flow Chart 流程圖,Controlled Ramp,Gate 1+Gate 2,Pilot build,Gate1,MVT,Safe Launch Process,DVT,Flow Chart,Sample verification,EVT,NPI Phase,R&D,新零件開發:,P1(G1,G2),供應商,R&D new part development:P(G1,G2)supplier,樣品核准,Sample test&verification,供應商試產,Supplier pilot-run,Product,review,by LiteOn R&D,Process,review,by Lite-On SQM,發行零件承認書,Issue an approval sheet,供應商試產,Supplier Controlled Ramp,Corrective Action,Corrective Action,MRB,MRB,Fail,Fail,Pass,Pass,供應商樣品,Supplier sample build,Product,review,by LiteOn R&D,Process,review,by Lite-On SQM,*MRB,member:PM,R&D,JQE and SQE,*Product review,:By Lite-On R&D,Process review,:by Lite-On SQE,7,Content of Safe Launch process 內容,5.1.Safe Launch Model 光寶供應商 safe launch 模式,5.2.Occasions應用時機,5.3.Yields/Gates 良率/階段的定義,5.4.Safe Launch Gate Rules and Corrective Actions 規則與改善行動要求,5.5.MRB for failed Gate 特採,5.6.,Processes to be Monitored,Guidelines 製程監督與指引,5.7.Data Collection/Reporting 資訊蒐集與報告,5.8.Post Build meetings 生產後會議,5.9.Supplier NPRR compliance review,5.10.Control of Quality Records 品質紀錄管制,5.11.Supplier Safe launch程序更新,P1 of G1,G2 supplier list,22 Nov 2006,SOP and worksheet,Safe Launch project calendar,8,Purpose 目的,This procedure to establish a commodity safe launch process that will provide a phased approach towards process validation,a means of fine-tuning a process before volume ramp,process for building in quality and development of supplier processes that will help the Supplier to meet Lite-Ons quality expectations.,對光寶重點供應商，制定一供應商safe launch程序要求；本程序展現了光寶科技對供應商生產個別產品製程的階段性核可要求，也是在量產前的製程能力提昇要求，以達成本公司良好進料品質的期望。,9,Scope 範圍,This procedure will be applied for P1(Lite-On Design Parts:Plastic Injection,Metal Stamping,PCB)of G1(high risk,high spend)and G2(high risk,low spend)level key suppliers Safe Launch requirement,the key suppliers definition combined with spend and quality risk elements,the key supplier list integrated both 2 factors by SQM department.,本程序適用本公司供應商管理部所定義的P1(Lite-On Design Parts:Plastic Injection,Metal Stamping,PCB)供應商之G1(high risk,high spend)與G2(high risk,low spend)類型廠商之管理要求，重點供應商名冊會依照營業額與品質風險綜合評比後定義。,10,The supplier safe launch should be used in the following situations.下述情形供應商應導入本程序,5.2.1.1 New product 新產品,5.2.1.2 New Manufacturing facility,existing supplier 新生產設備導入,5.2.1.3 New Supplier 新供應商,5.2.1.4 Significant form/function changes to existing product 現有產品重要功能變更,5.2.1.5 Multiple Line qualification with existing product.現有產品之衍生生產線核可,Occasions-2,11,Safe launch time line 導入時間表,導入時間表,5.2.2.1 The pilot starts in the DVT phase.This phase will be completed and gates met/exceeded prior to the Controlled Ramp start of the MVT phase.,Pilot build 起自DVT階段，達成/超過既定目標後，才能進行MVT的Controlled Ramp階段。,5.2.2.2 In the MVT phase,RTS at the supplier site starts the controlled ramp process.Controlled Ramp will continue until all gates are met for 2 consecutive gates.,在MVT的Controlled Ramp階段，產品出貨品質要求，仍須符合controlled ramp 的量產管制的目標定義。,12,Applying Gates to safe launch,生產階段定義,本程序之生產階段定義,5.3.3.1 The Lite-On commodity team will determine the gates based upon experience,supplier inputs,quality history and the quality requirements for the next higher assembly.Lite-On R&D implements product review,Lite-On SQE implements process review.,光寶commodity team會依據經驗、供應商建議、品質履歷、與下階段組配品質要求、等，來定義生產階段與品質目標。,產品面審查由光寶R&D執行，製程面審查由光寶SQE執行。,5.3.3.2 Pilot gates will be set for at least 1 pilot phase.Meanwhile supplier shall comply with Lite-Ons PPAP procedure requirements（C-SQM-015）.,Pilot build 階段，至少進行一次生產評估。,除了FPY良率要求外，本階段供應商也必須符合光寶PPAP程序（C-SQM-015）相關要求。,5.3.3.3 Controlled ramp builds gates will be set(by 2 times)and will increase in increments as defined by the LITE-ON commodity team.Meanwhile supplier shall comply with Lite-Ons PPAP procedure requirements（C-SQM-015）.,Controlled ramp階段，至少進行連續兩次的生產評估。,除了FPY良率要求外，本階段供應商也必須符合光寶PPAP程序（C-SQM-015）相關要求。,13,Safe Launch Gate Rules and Corrective Actions,規則與改善行動要求,5.4.1 In-process and after each Pilot Phase or Controlled Ramp build phases(typically production days),the required yields and PPAP are evaluated vs.the established gates.A formal daily review of results will be completed after all builds.The LITE-ON JQE shall host this meeting,SQE may attend it as required.不論在Pilot build或是Controlled Ramp階段進行中、或是在完成後，都須進行良率與目標，以光寶相關要求（PPAP）的評估。光寶JQE 必須主導每日的正式檢討會議,，,SQE 適時參加。,5.4.2 Violation of a Gate 階段未達目標時5.4.2.1 During any build,if a gate is violated the build must stop.The Supplier will ensure that root-cause and corrective actions are defined/implemented for all issues identified,LITE-ON commodity team approval is required prior to DVT phase.Corrective actions that are implemented will be verified by Lite-On SQE/JQE to re-initial or continue next build.,在每一個生產階段中，一旦良率不符目標，則本階段生產即停止。供應商對每一件確認的品質問題都須提供改善措施的定義與執行，光寶commodity team 必須在 DVT階段完成前核准供應商所有的品質狀況與改善績效。,改善行動的執行的情形，必須在經由光寶SQE/JQE 確認後決議再次生產或是逕行進入下階段。,14,5.4.2.2 The pilot phase will be repeated until all of the phase gates are achieved or exceeded.The controlled ramp may also be extended if gates are not met(at the discretion of the LITE-ON commodity team).在生產良率目標達成前，Pilot build階段將會重複進行與延長。須由光寶commodity team審慎考量後決定之。5.4.2.3 Corrective actions that are longer term and cannot be implemented in the appropriate time period may be left open.The next build may proceed as long a containment plan is defined/validated and approved by the LITE-ON SQE.有關長期的改善措施，在短期間可留下未結案事項。在下生產階段時SQE 仍需持續監控、結案。5.4.2.4 Gate violation will be coded RED on the Safe Launch report/data collection template.未達目標的生產階段將會在工作表中標註為,紅色,，以為警示。,5.4.3.4 Gates that are achieved or exceed the will be coded as GREEN on the Safe Launch report.每一階段達成或是超越目標時，工作表上就會以,綠色,顯示良好狀態。,15,Green/Red code of Gates review,Green code,Red code,Green code,Green code,16,MRB for failed Gate 特採,According to the RTS management,if the production build doesnt meet FPY requirement,C,ommodity team could hold a MRB review.the MRB disposition making would be done by commodity members and customer JQE.,產品小組可依照產品開發上市時程，對於未達目標的生產階段，進行特採管理，需經過產品小組與客戶JQE共同決議之。,MRB review shall adopt worksheet of this procedure.特採作業需保留書面審查紀錄，依照附表格核准之。,Waive record shall be recorded in Pilot Controlled builds Plan.特採作業需在 Pilot Controlled builds Plan 中註記特採紀錄，與核准人員。,After waive decision making,The Supplier shall follow chapter 5.4.2 ensure root-cause and corrective actions are defined/implemented,LITE-ON commodity team approval is required prior to DVTMVT phase,and Corrective actions that are implemented will be verified by Lite-On SQE/JQE to re-initial or continue next build.特採作業決定後，仍需要依照 5.4.2 章節要求，進行改善措施的執行，在 DVT階段完成前核准供應商所有的品質狀況與改善績效，改善行動的執行的情形，必須在經由光寶,SQE/JQE,確認後決議再次生產或是逕行進入下階段。,17,Data Collection/Reporting,資訊蒐集與報告,5.7.1 The supplier is required to monitor each of the processes identified during each of the builds per the gates established.This can be completed through automated shop floor control systems or manual collection/reporting.The supplier will stop building immediately when the gate is violated.The supplier shall capture the data/results as real time as possible.供應商必須在生產階段定義後，監督每一個生產步驟；可以SFIS 系統、或是人力進行蒐集生產資訊與報告。供應商必須在無法達成良率目標時，立即停止生產，此時供應商無法完成生產作業，進而獲得生產資訊，供應商必須儘可能的即時的進行生產資訊蒐集。,5.7.2 Safe Launch Pilot and Controlled Ramp Data Collection Template and Action Plan Register worksheet（C-SQM-023-01）will be used for all builds.供應商必須以附表進行生產結果記錄。,5.7.3 The supplier JQE will provide a daily summary report for each build/phase immediately after it is completed through the safe launch period.It will contain all of the appropriate yields vs.gates,all issues identified and corrective action plans.See template noted in section 5.8.2 for complete data collection details.供應商,JQE,即時提供的每日生產總結報告，並應包含良率資訊、問題與改善計畫，參照5.8.2 節進行。,18,Post Build meetings&SQRC compliance review,5.8 生產後會議,JQE Lite-On shall organize a daily post build meeting after every build/phase.LITE-ON SQE may attend this as required.光寶JQE必須主導在每生產階段期間召開每日生產後會議，光寶SQE適時參加。,5.9 SQRC 審查,Lite-On SQE will implement SQRC(supplier quality report card)review as a product readiness compliance review before mass production which based on Lite-On PPAP requirement.光寶SQE將進行SQRC 審查,以為產品量產前查核,此審查以光寶供應商的PPAP要求為基礎.,19,Supplier NPRR Performance Review,NPRR:New product readiness review,20,Safe Launch project calendar,item,Project step,2007 Target,Mar,Apr,May,Jun,Jul,Aug,1,Develop draft version SOP,40 Suppliers of P1(G1,G2):Plastic Injection,Metal Stamping,PCB,V,2,SOP cross function approval,V,V,3,Internal training:PM,R&D and SQE,V,4,Supplier Kick Off meeting:,Lite-On SQE vs.supplier list,V,5,Project monthly review,RSQM assist visit,V,V,V,V,21,supplier list Apr 2007,42 Suppliers adopt Lite-On safe launch process.,Supplier selection principles,P1 suppliers(Lite-On design parts),G1,G2,G3 suppliers,Related with BU serve Key customer,重點客戶的供應商,如:Dell,HP,此標準則不侷限供應商G1,G2類別,G3也可以.,Therere new products development at coming 36 months,would like to co-work with Lite-On,有配合意願,光寶能主動要求的供應商.(低配合度供應商,請協助刪除.),22,Document and worksheet,Safe Launch SOP,Worksheet,Safe Launch gate review checklist,Work on it.,23,Thank You,24,PPAP key supplier definition,This procedure shall be applied for P1 type suppliers(Lite-On Design Parts:Plastic Injection,Metal Stamping,and PCB).and suited for G1,G2 level suppliers.,High,High,Low,Low,SPEND,RISK,Group II(34 Suppliers),Performance is important to product,performance,One or more restricted sources,Few Options,Temporary or inherent risk,High Risk,Low Spend,Group I(49 Suppliers),Group III(255 Suppliers),Many Options,Many Sources,Little brand preference,Low Risk,Low Spend,Critical to product performance,technically irreplaceable,Loss or delay has major impact,Few alternatives or cost to change,suppliers is high,High risk,High spend,Common designs,Loss or delay has,less,impact,Many alternative sources,Many sources,Large market capacity,Low Risk,High spend,Surveillance,Partnership,Contractual,Transactional,Group IV(1,716 Suppliers),“Key Supplier”,“Key Supplier”,“Key Supplier”,25,Procurement type definition,Procurement Type,Definition,Lite-On Quality Assurance,P1:Lite-On Design Parts,Plastic Injection,Metal Stamping,PCB,Lite-On Process 100%Testing and Inspection,P2:Industry Standard Parts,EE,ME,EM Parts Purchased from Supplier Product Catalog,Lite-On Process 100%Testing and Inspection,P3:Raw Material,Plastic Resin,Sheet Metal,Lite-On Process 100%Testing and Inspection,P4:Accessory Parts for Packing,Adapter,Headset,Cable,Battery Set,Carry Bag,Without 100%Testing and Inspection and Directly Shipping,P5:Packing Materials,Carton,Cover,Box,Partition,Corner Board,PE Bag,Label,Lite-On Process 100%Testing and Inspection,P6:Documentation for Packing,CD,Manual,Handbook,.,Without 100%Testing and Inspection and Directly Shipping,P7:Semiconductor and Manufacturer thru Distributor,Inbound and Outbound Semiconductor Suppliers,Lite-On Process 100%Testing and Inspection,26,CTQ defined at diagram in approval sheet,CTQ(Critical to Quality)definition,Part diagram,SPEC.CHAR,Nominal,+TOL,-TOL,Cpk requirement,Location 1,as approval sheet,Location 2,as approval sheet,Location 3,as approval sheet,Location 4,as approval sheet,Location 5,as approval sheet,as approval sheet,as approval sheet,as approval sheet,as approval sheet,as approval sheet,27,PPAP Requirements,PPAP,應用時機,個別的產品專案,/,光寶料號之,零件承認,管理要求。,對象,G1(high risk,high spend),G2(high risk,low spend),重點供應商,使用工具,產品規格定義（,RSV,CTQ,）,試產首件檢查報告（,FAI,）,製程能力分析、,GR&R,、,材質成分證明、,製造流程圖、,製程,FMEA,、,製程管理計畫（,PMP,）與,圖面生產組裝、檢測工作說明書。,PPAP:Production Part Approval Process,28,