[经管营销]IC代工生产管理培训PPT课件.ppt

MPC 教育资料1：什么是PC2：什么是MPC3：MPC需要关注和解决那些问题4：MPC专业词汇解释1-什么是PCPC就是production controlPC 是着眼在公司层面，根据销售订单以及生产线产能进行制定生产投入产出计划职责：1.产品的投入计划2.确保产品交货期，以及产出计划。3.确认制品MOVE情况以及提醒交货期会有延迟的产品4.执行客户需求的产品释放以及停滞等等2-什么是MPCMPC 的客户是MPP,MPP客户是PC。也就是说详细的完成PC所下达的任务。1.按生产计划检查、跟踪并准确及时报告生产流程中的问题。2.依据WIP、制品交期、设备负荷、制程时间限制以及在制品及设备的运行状况等因素调整实时调度系统的运行3.提高人员及设备利用率制品流通率的管理及有关数据的提供 4.依据生产数据计算生产能力。3-MPC需要解决哪些问题The mission of a manufacturing fab:To satisfy customer and The mission of a manufacturing fab:To satisfy customer and maximize the capacity and wafer outputmaximize the capacity and wafer output What customer wants?What customer wants?On time delivery On time delivery Good wafer quality Good wafer quality Low unit price Low unit priceMFG indices indicates the performance of a MFG indices indicates the performance of a FabFab4-Index nameShort descCTCycle TimeTRTurn RatioMoveWafer movementWIPProduction wafer in processEngWIPEngineer wafer in processYieldFab YieldHoldHold WIPTerminateEngineer wafer scrapScrapProduction wafer scrapReworkRework waferWSWafer startWOWafer outKEY5-C/T C/T英文全名：Cycle/Time中文全名:运转周期定义:the average lead time which one wafer must pay for running,waiting,holding,and time on bank from wafer start to QC-Inspection计算方式:Cycle_Time_Waferi/Wafer_Output 计算频率/单位:天指标意义:1.考量FAB的硅片的运转速度2.衡量FAB的run货效率6-TR TR英文全名：TurnRatio T/R中文全名:在制品周转率定义:Average number of stages which one wafer can penetrate in one day 每片硅片平均每天跑过的Stage数计算方式:Stage Move/WIP WIP=(BOH+EOH)/2计算频率/单位:每日指标意义:1.由Turn Ratio可知硅片处理速度是否正常 2.此指标为Stage Move与WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品积压成本是否过高，以及生产流程是否顺畅 7-Move Move英文全名：Wafer Moves中文全名:硅片移动量定义:一片硅片完成一个Stage 称为一个Stage Move;一片硅片完成一个Step 称为Step Move计算方式:由Fab中实际操作的硅片数加总得到计算频率/单位:每日或每月指标意义:1.由各个移动量可以了解目前硅片之处理速度是否 正常 2.由移动量预估硅片是否赶上速度 3.籍此衡量各区域之生产绩效8-WIP WIP英文全名：广义上 Work in process 在半导体行业:Wafer In Process中文全名:在制品定义:从硅片投入到硅片产出，Fab内各站积压了相当数量的硅片，统称为Fab内的WIP计算方式:堆积硅片求和计算频率/单位:每日或每月/片指标意义:衡量一个FAB的生产能力的标志 PWIP:Production WIPEngWIP:Engineering WIP9-Yield Yield英文全名：Yield中文全名:良率定义:产出硅片良品数量与投入生产之硅片数量的比率计算方式:硅片产出量/（硅片产出量+硅片报废量）计算频率/单位:每月%指标意义:由良率可以显示所生产硅片之制造环境，制程，规格方面之综合表现，故其为最重要的品质指标10-英文全名:Hold中文全名:硅片搁置定义:在生产过程中因为控制或者工程原因暂时无法进行生产的硅片数量计算方式:所有hold WIP数量相加计算频率/单位:每日或每月 片指标意义:1.衡量工厂生产稳定度 2.衡量因工程原因对生产周期的影响 Hold Hold11-Terminate/Scrap Terminate/Scrap英文全名：Scrap中文全名:报废硅片定义:total wafer scrap quantity in FAB计算方式:所有Scrap求和计算频率/单位:每日或每月 片指标意义:1.衡量制程稳定度 2.衡量一个FAB的生产良率 3.Eng WIP terminate 用以衡量工厂研发或者保持制程稳定而用掉的cost12-Rework Rework英文全名:Rework中文全名:返工定义:Total rework count in Fab litho area计算方式:所有rework 数目累加计算频率/单位:每日或每月 片指标意义:1.衡量Litho制程稳定度 2.衡量litho无效 movement数量13-WS WS英文全名:Wafer start中文全名:硅片下线定义:Total wafer start count计算方式:所有下线数目累加计算频率/单位:每日或每月 片指标意义:衡量工厂生产规模14-WO WO英文全名:Wafer out中文全名:硅片出货定义:Total wafer out count计算方式:所有出货数目累加计算频率/单位:每日或每月 片指标意义:衡量工厂生产规模15-MFG indices introduction MFG indices introductionv What is a“Golden”Fab16-MPC需要关注哪些问题Wafer MovesWafer Step MoveLocation MoveWafer In Process(WIP)End On Hand&Begin On HandTurn Ratio(T/R)-Daily Equipment UP TimeWafer Per Hour(WPH)Equipment EfficiencyUtilizationManufacturing EfficiencyCycle Time Per Mask Layer(C/T)Wafer OutLine Yield Wafer Acceptance Test(WAT)Fab Yield 17-Wafer MovesDefinitionoWafer step Move=1 wafer moving from one Step to another.oWafer stage Move=1 wafer moving from one stage to another.Method of CalculationoSum of actual fab or section wafer stage moves to give fab wafers move,and section wafers move respectively.Purpose of Wafer Move IndexoFrom present amount of wafer moves,we can determine if the present production rate of the section or fab is normal.oUse as a measurement index to compare shift to shift or fab to fab18-Sample CalculationsScenario 1:Particular lot of 25 wafers completed 4 stages on the 1st of February 2000.Scenario 2:Particular lot of 25 wafers completed 70 stages in the month of January 2000.Scenario 1 Moves:On the 1st of February 2000,Wafer Move=25 X 4=100 Scenario 2 Moves:In the month of January 2000,Wafer Move=25 x 70=175019-Wafer Step MoveDefinitionoWafer STEP Move-1 wafer moving from one step to another.(Note:1 Step is equivalent to 1 equipment move or 1 metrology step.)Method of Calculation oSum of actual fab,section or equipment wafer STEP moves to give fab wafers move,section wafers move and equipment wafer moves respectively.Purpose of Wafer Step Move IndexoFrom present amount of wafer moves,we can determine if the present production rate of the equipment or section is normal.oUse as a measurement index to compare equipment to equipment or performance of operator to operator.20-Sample CalculationsScenario 1:Particular lot of 25 wafers completed 6 steps on the 1st of February 2000.Scenario 1 Step Moves:On the 1st of February 2000,Wafer Move=25 X 6=150 Step Moves(Assuming the average number of steps per stages 3 steps/stage)Stage Moves on 1st of February 2000=150/3=50 Stage Moves21-Location MoveDefinitionoTotal number of Wafer Stage Move 1 wafer moving from one stage to another.Method of Calculation oSum of stage moves within process area(CVD,PVD,PHOTO,etc).Purpose of Location Move IndexoFrom present amount of wafer moves,we can determine if the present production rate of the process area is normal.oUse as a measurement index to compare day to day or month to month performance of a process area.22-Sample CalculationsScenario 1:Wafer Move in the CVD area for IMD=1200,PETEOS=800,SACVD=500,HDP=400 and BPTEOS=400.Scenario 1 Locaton Moves:CVD Location Moves=1,200+800+500+400+400=3,000 Moves23-Wafer In Process(WIP)DefinitionoNumber of wafers per step,stage,section,shift or fab.(ie running,wait,hold,etc)Method of Calculation oSum of all wafers in that step,stage,section,shift or fab respectively.Purpose of Work In Process IndexoFrom present amount of wafer moves,we can determine if the present capacity of the equipment,section or fab is sufficient.oUse as an indicator to possible bottleneck in the fab.oMovement of the WIP index will reflect the stability of the equipment/process and at the same time the capability(constraints)of the equipment.24-End On Hand&Begin On Hand(1)DefinitionoEOH-WIP per stage,section or shift or fab at the END of a shift.oBOH-WIP per stage,section or shift or fab at the START of a shift.Method of Calculation oSum of all wafers in that stage,section,shift or fab respectively at the end or start of a shift.25-End On Hand&Begin On Hand(2)Purpose of EOH and BOH IndexoBy comparing the EOH and the BOH of a shift,we can have a feel of the performance of the equipment and the shift.An increase in WIP from the BOH to EOH may indicate poor equipment status in the different fabs or sections or shifts,or poor dispatching skill of the shift if the equipment status is normal.26-Turn Ratio(T/R)-Daily(1)DefinitionoNumber of stages completed by each wafer per day.Method of Calculation oT/R=Total Stage Moves Per Day/Average WIP(Note:Average WIP per day=BOH+EOH/2)27-Turn Ratio(T/R)-Daily(2)Purpose of Turn Ratio IndexoFrom the T/R we can determine if the current wafer production rate is normal or too slow.oAs this indicator takes the ratio of Stage moves to Average WIP,therefore we could determine if:Current WIP is reasonable relative to bench marked quantity.Is the cost of WIP(inventory)relative to the cost of equipment lost time proportional.Current production flow is smooth with no bottleneckIs the stage target realistic.28-Sample CalculationsScenario 1:On the 1st of February 2000,Total Stage Move(CVD)is 10,000,the BOH WIP on that day is 5,500 and EOH WIP on that day is 6,000.Scenario 1 T/R:On the 1st of February 2000,T/R=10,000/(5,500+6,000)/2=1.74(Note:An average T/R of 2.1 to 2.2 is reasonable for a fab)29-Equipment UP Time(1)DefinitionoTime when equipment is fit-for-production.Method of Calculation oUP Time=Run Time+Lost Time+Test Time+Backup TimePurpose of UP Time IndexoFrom the UP Time we can determine the total amount of time available for production.oThe ratio of Lost Time to Available Time is used to determine the room for improvement in terms of utilization for a particular equipment.30-Equipment UP Time(2)31-Sample CalculationsScenario 1:In February 2000,Run Time=700 hours,Lost Time=100 hours,Test Time=100 hours,and Backup Time=50 hours for WCVD equipment.Scenario 1 WCVD Available Time:In February 2000,Avail Time=950 hoursLost Rate=100/950=10.5%32-Wafer Per Hour(WPH)(1)DefinitionoNumber of wafers processed per hour.Method of Calculation oWPH=Wafer Move/Run TimePurpose of Wafer Per Hour(WPH)Index(1)oFrom the present equipment WPH we can determine whether the current equipment rate of production total is normal.oThe equipment WPH can be used to derive the equipment capacity,which can be in turn used to determine if the total capacity for a particular capability is sufficient.33-Wafer Per Hour(WPH)(2)Purpose of Wafer Per Hour(WPH)Index(2)oThe ratio of the current equipment WPH to the Theoretical WPH(T WPH)can be used to determine if the equipment is presently operating in the optimum conditions.oWPH index can also be used to measure individual MA or shift performance,especially so in manual operations.oRelative WPH between equipment running the same recipe can be used to determine the individual equipment34-Sample Calculations(1)Scenario 1:On 1st of February 2000,Run Time=20 hours and Wafer Moves=1700 wafers for WCVD equipment.Scenario 2:The same equipment for the month of February 2000,Run Time=600 hours and the total Wafer Moves=54,000 wafers.Scenario 3:Run Time=12 hours,Wafer Moves by Operator A=500 and Operator B=400 on the same equipment.35-Sample Calculations(2)Scenario 1 WCVD WPH:On 1st of February 2000,WPH=1,700/20=85 wafers/hourScenario 2 WCVD WPH:In the month of February 2000,WPH=54,000/600=90 wafers/hourTherefore,we can say that the current equipment rate of production is lower than the average for the whole month.Scenario 3:Operator A has a WPH=500/12=41.67 wafers/hour Operator B has a WPH=400/12=33.33 wafers/hour36-Equipment Efficiency(1)DefinitionoPercentage of the actual wafer moves per hour to the ideal wafer moves per hour.Method of Calculation oEquipment Efficiency=(Total Actual Wafer Moves/Total Run Time)/(Average Ideal WPH)X 100%Note:As the“Ideal WPH”is dependent on the recipe of the lot processed,the“Average Ideal WPH”is the sum of the“Ideal WPH”multiple by the proportion of the number of lots(during the period of time)with that recipe divided by the Total Run Time.37-Equipment Efficiency(2)Purpose of Equipment Efficiency IndexoThe equipment efficiency index show how much deviation from the optimum performance is the equipment being operated in.oDetermine if there is any weakness/abnormality with an equipment capabilities/fab WIP profile/process capability.oBase on the efficiency of the equipment,we are able to look into methods to optimize the equipment and increase the throughput of the equipment.38-ExamplesExample of some situations that LOWERS the equipment efficiency:oOnly 1 SMIF Arm is in working condition.oTakes a longer time than usual to achieve required vacuum for the load lock equipment problem.oSMIF Arm unable to unload automatically therefore status remains“Run”(Run Time increases without increase in output)even when wafers already completed its process.oThe bottleneck chamber of the equipment is down and therefore the impact deducted is less than the actual impact.oTime require for achieving vacuum is the same for a lot with 25 wafers and one with only 1 wafer.Therefore the time per wafer is increase significantly when lot with only 1 wafer is processed.39-Sample CalculationsScenario 1:On 1st of February 2000,shift A,WCVD equipment,Wafer Moves=375 wafers,Run Time=12 hours.The lots consist of 5 lots of recipe A and 10 lots of recipe B.Recipe A:Ideal WPH=30,Recipe B:Ideal WPH=45.Scenario 1 Efficiency:Average Idea WPH=(5/15 X 30)+(10/15 X 45)=40 wafer per hourEquipment Efficiency=(375/12)/(40)X 100=78.13%40-Utilization(1)DefinitionoThe amount of time demanded of an equipment for production,versus the total amount of time available.oDemand/CapacityMethod of Calculation oUtilization=(Run Time+Test Time+Back Up Time)/Total Time X 100%41-Utilization(2)Purpose of Utilization IndexoFor a Utilization Index greater than 100%for certain equipment,we can safely say that the present equipment capacity is not sufficient for the present demand.oIf the utilization is low for certain equipment,but the WIP is high,it could be due to the equipment not having the capability to run the recipes required by the WIP.42-Sample CalculationsScenario 1:In a day(24 hours),WCVD equipment has Run Time=12 hours and Back Up Time=6 hours.Scenario 1 Utilization:Utilization=(12+6)/24 X 100%=75%43-Manufacturing Efficiency(1)DefinitionoPercentage of the equipment available time used for production(Run Time,Test Time and Back Up Time)over the total equipment available time(Run Time,Test Time,Lost Time and Back Up Time).Method of Calculation oManufacturing Efficiency=(Utilization/Availability)X 100%44-Manufacturing Efficiency(2)Purpose of Manufacturing Efficiency IndexnThe manufacturing efficiency index compares the performance of the operator under a high WIP situation.The higher the efficiency index the better the performance.nOne of the indicators for low WIP for specific equipment,section or fab.nA high WIP and low manufacturing efficiency index could be due to equipment constraint and its capabilities.45-Sample CalculationsScenario 1:Operator As equipment has Run Time=8 hours,Test Time=1 hour,Back Up Time=0 and Lost Time=3 hours.Scenario 1 Operator A:Manufacturing Efficiency=(8+1+0)/(8+1+0+3)X 100%=75%46-Cycle Time Per Mask Layer(C/T)(1)DefinitionoAverage number of days required for processing between two photo stages.(1 layers.one photo stage to another)oAs each individual layer is defined by a photo stage,therefore the number of layers of a product is equivalent to the number of photo stages.Note:For 0.25 micron technology,there is an average of 25 layers.Method of Calculation C/T=(Time which wafer passes the QC test Time at wafer start)/Number of photo stages.47-Cycle Time Per Mask Layer(C/T)(2)Purpose of Wafer Move IndexoBase on the number of layers of the product,and the use of the average cycle time of the fab,we are able to determine the average time required for the product from start to completion.Thereby,enabling us to decide on the date for the product wafer start in order to meet the delivery schedule.48-Sample CalculationsScenario 1:A particular product has 16 layers,and the time required from wafer start till QC testing is 40 days.Scenario 1 C/T per layer:C/T per layer=40/16=2.5 days per layer49-Wafer OutDefinitionoTotal quantity of wafers that passes the QC test.Method of Calculation oProduction Controller(PC)will announced the official Wafer Out quantity.Purpose of Wafer Out IndexoThe Wafer Out Index will indicate the fab output status.50-Sample CalculationsScenario 1:In the month of February 2000,quantity of wafers that passes QC test=15,000 wafers.Scenario 1 Wafer Out:In the month of February 2000 Wafer Out=15,000 wafers51-Line YieldDefinitiono