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LN9901-R力生美x电容泄放芯片-LN9901规格书参数_骊微电子.pdf

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1、 LiiSemiconductorInc.1 DS-02051-B-EN LN9901 X-capacitor Automatic Discharge Controller IC http:/ 1.Feature Designed for 0 power consumption X capacitor discharge circuit*Built-in bidirectional current automatic exhaust passage The application system supports 0.16.8uF X capacitor High isolation struc

2、ture design,pin redundancy Self-safe isolation distance exceeds 4mm Self-powered design,no external equipment dependencies required No need for high common mode capability without additional ground connection Internal integrated switch withstand voltage up to 950V The circuit can be directly connect

3、ed in parallel with the X capacitors on both sides.Can be safely applied before or after the fuse Meet global X capacitor discharge safety requirements The ideal choice for energy efficient systems Power consumption is less than 5mW for all applicable X capacitors TUV and CB IEC62368 certified and c

4、ertified 2.Application Switching power supply Household appliances Various systems with X capacitors 3.Description The LN9901 is an automatic discharge controller IC specifically designed for X-capacitor systems.The chip has a highly reliable AC power calibration system that automatically discharges

5、 the X capacitor after the system is powered down,making it a safety requirement.The voltage is discharged below the allowable voltage,and automatically remains off during normal operation,and the power consumption is maintained at no more than 5mW to realize a zero-power X-capacitor system.The buil

6、t-in high-voltage switch supports up to 6.8uF X-capacitor discharge operation.In use,it is only necessary to use the corresponding resistors in series on both sides of the chip,so that a larger X capacitor can be used in a general system to reduce the use.Large inductance reduces system cost.The red

7、undant pin design keeps the system effective when either pin is open,ensuring robust safety.A safe isolation distance of up to 4mm does not limit the safety features of the system design and meets various altitude requirements.Halogen-free SOP8 green packaging is available.*:IEC 62301 clause 4.5 def

8、ines standby power below 5 mW as zero power.LiiSemiconductorInc.2 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 4.Internal functional block diagram 5.Pin definition 6.Pin function description Pin No.Pin Name Pin Function Description 2/3 X1 Discharge switch pin 1,Non-directional with 6/7,but according to s

9、afety regulations,2/3 must be connected at the same time 6/7 X2 Discharge switch pin 2,Non-directional with 2/3,but according to safety regulations,6/7 must be connected at the same time 1/4/5/8 NC Empty foot,no connection internal,1/4 can be connected with 2/3,5/8 can be connected with 6/7 Fig2.Pin

10、 definition Fig1.Internal functional block diagram SOP8 LiiSemiconductorInc.3 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 7.Typical connection diagram Note:For X capacitors from 0.1uF to 6.8uF,the recommended total resistance of R1R4 is 6.8M120K,so that the discharge time constant is less than 1s*.Warni

11、ng Must strictly observe the following two points when using:1)When installing this component,all requirements of the mentioned standard must be fulfilled;2)It is built-in component and suitable enclosure should be provided in end system.Note*:1.Article 4.5 of IEC 62301 specifies that the standby po

12、wer is less than 5 mW is zero power consumption.2.General requirement.The RC time constant needs to be less than 1 second.Fig3.Typical connection diagram LN9901 LiiSemiconductorInc.4 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 8.Maximum parameter*Parameter Rating Unit Pin input voltage+950V -950V*V Pin

13、maximum current 5 mA Min/Max Operation Junction Temperature TJ -40 to+150 Min/Max Operating Ambient Temperature Ta-10 to+105 Min/Max Storage Temperature Tstg-55 to+150 PD allows average power dissipation 600*mW Note*:Stresses beyond those listed under“absolute maximum ratings”may cause permanent dam

14、age to the device.These are stress ratings only,functional operation of the device at these or any other conditions beyond those indicated under“recommended operating conditions”is not implied.Exposure to absolute maximum-rated conditions for ex tended periods may affect device reliability.*:with 1m

15、A limit.*:with SOP8 package soldering to an area of 100mm2 on a 2oz copper for use 6.8uF Xcap at AC=300V.9.Recommended operating conditions Symbol parameter Min.Typ.Max.unit VAC AC input voltage 50-300 Vac C X capacitor 0.1-6.8 uF R Series resistance 0.12-6.8 Meg.TA Operating Ambient Temperature-10

16、105 10.Electrical Characteristics(Ta=25,if not otherwise noted)Symbol Parameter Test Conditions Min.Typ.Max.unit BVDSS Switch breakdown voltage I|X1-X2|=2mA 950 1000 V IQ Quiescent Current AC=240V,50Hz,CEXT=OPEN 20 uA ISAT Switching saturation current X1-X2=100V,R1+R2=10K 2.5 3.5 mA tDET Power failu

17、re detection time AC=100240V,4763Hz 45 55 ms LiiSemiconductorInc.5 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 Thermal Data Thermal Data Symbol Description Parameter Unit JA1 Semiconductor junction to ambient thermal resistance 160/W JC2 Semiconductor junction to package thermal resistance 40/W Notes:1.

18、All pins are soldered on a 200mm2 area,2OZ thick copper foil;2,measured on the surface of the package near the center.LiiSemiconductorInc.6 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 11.This is a blank page.LiiSemiconductorInc.7 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 12.Application and Information 12.

19、1 R1R4 series resistance selection 12.1 R1R4 series resistance selection The IC will maintain an approximate open state of very small quiescent current when the system is powered on.When the system is powered down,it will turn into an approximate short-circuit state.Therefore,the X capacitor bleeder

20、 time is determined by the external series resistance,just according to the external The size of the X capacitor capacity can be reasonably selected in series with the corresponding R1R4 resistors on both sides of the chip.The total resistance of the series resistor should meet the requirements of t

21、he safety regulations for the discharge time constant less than 1 s.The typical common series resistance can be referred to.The following table:X Capacitor R1R4 Total Resistance 0.1uF 6.8M (6.8M/6.8M+6.8M/6.8M)0.22uF 4M 0.33uF 2.4M 0.47uF 1.82M 0.68uF 1.22M 0.82uF 1.02M 1uF 980K 2.2uF 400K 3.3uF 240

22、K 4.7uF 182K 5.6uF 150K 6.8uF 120K (120K/120K+120K/120K)In addition,the power consumption of the resistor should also be considered to affect the type of resistor.In particular,when a short-circuit fault occurs across the IC,ensure that the resistor does not overheat.If necessary,use more resistors

23、in series to reduce its power loss;for example,In 60K+60K applications,the resistor will consume approximately 220mW+220mW at 230Vac input.12.2 Varistor selection 12.2 Varistor selection When the system requires lightning protection level higher than 1.5KV,the necessary varistor(MOV)device should be

24、 used at the input end.The varistor specification should be reasonably selected according to the lightning strike level.When the IC is placed at the input front end,the varistor should be Parallel in front of the IC.12.3 External bypass shunt capacitor 12.3 External bypass shunt capacitor In the fin

25、al lightning test verification,it should also ensure that the voltage spikes on both sides of the IC do not exceed the allowable voltage withstand capability,and reserve a margin of not less than 50V.When the margin is less than 50V,it should be paralleled between the pins at both ends of the IC.A c

26、apacitor of no more than 47 PF,such as 33 PF/1 KV.See Figure C1 below:LiiSemiconductorInc.8 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 13.Typical Layout Reference The PCB should be properly arranged so that the system meets the safety requirements and avoids accidental discharge due to too close distan

27、ces on both sides of the IC.The reference layout is shown below:Fig4.External bypass capacitor setting Fig5.Reference PCB layout LiiSemiconductorInc.9 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 14.Package information SOP8 Fig6.Package information LiiSemiconductorInc.10 DS-02051-B-EN LN9901 http:/ 澎湃驱动力

28、 源于力生美 Tape/Reel Fig7.Tape packaging diagram LiiSemiconductorInc.11 DS-02051-B-EN LN9901 http:/ 澎湃驱动力 源于力生美 15.Ordering Information Part Number Marking Package Packaging LN9901-R LN9901 SOP8 4000PCS/Reel LN9901-T LN9901 SOP8 100PCS/Tube 16.Important Notice 力生美、Liisemi、等均为力生美半导体的商标或注册商标,未经书面允许任何单位、公司

29、、个人均不得擅自使用,所发布产品规格书之著作权均受相关法律法规所保护,力生美半导体保留全部所有之版权,未经授权不得擅自复制其中任何部分或全部之内容用于商业目的。产品规格书仅为所描述产品的特性说明之用,仅为便于使用相关之产品,力生美半导体不承诺对文档之错误完全负责,并不承担任何因使用本文档所造成的任何损失,本着产品改进的需要,力生美半导体有权在任何时刻对本文档进行必要的修改,并不承担任何通知之义务。英文规格书皆由中文规格书翻译而来,相关内容均以中文规格书为准。力生美半导体系列产品均拥有相关技术之自主专利,并受相关法律法规保护,未经授权不得擅自复制、抄袭或具有商业目的的芯片反向工程,力生美半导体保留相关依法追究之权利。力生美半导体不对将相关产品使用于医学、救护等生命设备所造成的任何损失承担责任或连带责任,除非在交易条款中明确约定。最新信息请访问:

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