wafer_saw_Standard_Operation_Procedure_final.pdf

Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 1 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.1.0 Purpose 目的目的 The purpose of this procedure is to establish wafer saw standard operation for SDSS products.本规范的目的是建立 SDSS 晶圆切割工序程序书。2.0 Scope 范围范围 This procedure is applied for SDSS products.本规范仅适用于所有 SDSS 的产品。3.0 Roles and Responsibilities 角色角色和职责和职责 3.1 Primary owner department:Process Engineering 拟定部门:工艺工程部 3.2 Review,approval and implementation department(s):Q&R Department,Process Engineering,Production Department,Equipment Maintenance Department.评审，批准和执行部门：质量部，工艺工程部，生产部，设备维护部 4.0 Reference Documents 参考文件参考文件 No.编号编号 Source 来源来源 Title/Description 标题标题/描述描述 1111-02-20001 Agile Process Control Plan 3712-02-00017 Agile Internal Visual Inspection Criteria 3715-01-00003 Agile ESD Control Procedure 2041-02-00017 Agile Indirect material spec 0000-02-00002 Agile Process FMEA-Die Preparation 3743-02-00006 Agile Direct material&key supply control work instruction 3712-01-00006 Agile QDN Procedure 3745-02-40005 Agile OCAP of wafer saw process 5.0 Materials,Equipment,Tools and Safety 材料、设备、工具和安全材料、设备、工具和安全 5.1 Equipment and material 设备、材料和工具 Wafer Dicer 晶圆切割机 DAF Laser grooving 激光切割机 DAF expanding 晶圆分离机 CO2 BUBBLER 二氧化碳发生器 Saw Blade 划片刀 Low Power Microscope 低倍显微镜 High Power Microscope 低倍显微镜 Measurement scope 500X 500 倍测量显微镜 Frame 铁圈 Frame Cassette 提篮 Finger Coats 指套 Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 2 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.Conductive Shoes 导电鞋 Grounded Work Table 接地工作台 Mark Pen 记号笔 Mask liquid 保护液 Laser grooving for Low-k wafer 激光切割机 5.2 Safety 安全安全 5.2.1 Always keep all tables,shelves and machine cover clean.所有工作台，架子和机台外壳，必须保持清洁.5.2.2 All operators should wear conductive shoes and finger cots on all fingers,mask while handling products.所有操作工在加工产品时必须穿戴导电鞋和指套(所有的手指都戴上)以及口罩.5.2.3 The revolution of dicer spindle is quite high,be careful no any operation with machine cover opens allowed 切割机主轴高速旋转，不允许在机器盖板打开的状况下进行任何操作 5.2.4 Emergency case 紧急情况 5.2.4.1 In case of emergency power fail,turn off all the switch,take out material,then contact with facility to confirm the power and air pressure.After getting facilitys confirm,power on the machine again.如遇紧急停电,首先应将机台的开关全部关闭,将物料清点,各自放到相应的位置,来电后直至厂务确定没有问题.电压,气压都稳定后方可重新开机生产 5.2.4.2 In case of fire,turn off machine,go to safety place(followed the escape way)as quickly as possible.After the fire alarm,return to onsite,and check the machine and material 如遇火警,把机台的电源关闭,随同所有人员迅速离开,到安全地点集合,火警解除后进入厂内检查机台的情况及物料的情况 5.2.4.3 Any abnormal case,to stop machine.任何异常情况请首先停机，等待技术员和工程师做确认。5.2.5 Should be careful to prevent machine electrical&mechanical injury when use machine.In normal production,dont open the machine cover.使用机器时请注意防止电气和机械伤害。正常生产时，请不要打开机器的盖子 5.2.5.1 Should turned off,when make maintenance 当需要做设备维护时须关闭电源 5.2.5.2 Should make the interlock opened when make maintenance,if should keep power on 在必需开机状态下做维护时,须确保互锁装置工作 5.2.5.3 Make sure the electricity has been terminate when touch machine electrical part 接触机器的电气部件时请确认电路已经中断 5.2.5.4 Be careful for rotation parts including blade cutter 注意机台的旋转部件包括 blade cutter 5.2.6 Operator and equipment maintenance technician should read and know MSDS of DC1190 and XeF2 作业员和设备维护技术员必须熟读所接触化学品（DC190 和 XeF2）的 MSDS.5.2.7 Operator and equipment maintenance technician need press urgent stop button in any urgent circs,and leave room immediately at the time;then inform supervisor,Equipment engineer and EHS person.Supervisor is responsible for separating laser saw room.Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 3 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.任何紧急情况，立即按下机器的急停按钮。同时撤出房间，立即通知主管、设备工程师及 EHS。主管负责隔离 laser saw 区域。6.0 Definitions and Acronyms 定义和缩写词定义和缩写词 Term 术语术语 Definition 定义定义 SDSS SanDisk Semiconductor Shanghai Co.LTD.晟碟半导体上海有限公司 DAF Die Attach Film 贴片胶带 BG Back Grinder 晶圆研磨机 DS Die Saw 芯片切割 QC Quality Control 质量控制 BOM Bill of Material 材料清单 UV Ultraviolet 紫外线 DP Die Preparation 芯片准备 DI Water Deionization Water 去离子水（纯净水）N/A No Application 不使用，无 2VM 2nd Visual Measurement 第二次目检 ESD Electro-Static Discharge 静电去除 DBG Dicing Before Grinding 研磨前切割 Hybrid Dicing Laser Grooving add blade saw 混合切割 7.0 Requirements 要求要求 7.1 Operation requirements 操作要求 7.1.1 Check materials before operation 材料作业前数据检验 7.1.1.1 Check weather Travel Card fill clearly and completely If the data is error,should inform production line leader in time.流程卡填写是否清晰完整，如有问题，则应立即反应到生产线领班处理。7.1.1.2 Check material quality(distortion,damage,etc.),if have any issue,put the material with the travel card and inform the process engineer.检查物料质量（是否有变形，损坏等），如有异常，连同流程卡一起将该批产品置留下来，并通知生产线领班和制 造工程师。7.1.1.3 Check if material quantity is match with travel card showed.检查物料数量是否与流程卡相符.7.1.1.4 If anything abnormal,inform production line leader and process engineer 物料如有任何不符,反应 生产线领班及工艺工程师.7.1.2 Confirm items before production Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 4 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.作料前确认 7.1.2.1 Equipment maintenance technician check machines setting condition with POSITROL LOG GUIDE LINE(No.:3745-02-40002),and confirm any RMS alarm about parameter mismatch with golden recipe 设备维护技术员根据 POSITROL LOG GUIDE LINE（编号：3745-02-40002）确认机台设定，并确认 RMS 有无参数跟 golden recipe 不匹配的报警。7.1.2.2 Operators check up and confirm machine and materials device are same.操作员检查机台状态与作业型号，是否一致。7.1.2.3 For controller wafer,must using special cassette(2 slot and color is blue)针对 controller wafer，必须使用专门的 cassette（蓝色的只有两个槽）7.1.3 New/Change device/machine set up 新/更改作业机种/调试机器 7.1.3.1 If currently machine program is not match with travel card showed,Operator should inform equipment maintenance technician to change device,and operator record on Production log sheet(No.:3745-02-40004)操作员检查程序名是否与流程卡一致，若有不符，操作员通知设备维护技术员改机或更换材料，操作员填写作业记录表（编号：3745-02-40004）7.1.3.2 When device change/machine set up,equipment maintenance technician should load correct program according travel card 当产品更换/机器设定，设备维护技术员必须使用流程卡上注明的程序。7.1.3.3 The operator confirms if the saw blade match with travel card defined,if not match,inform equipment maintenance technician to change right blade and record on Production Log Sheet(No.:3745-02-40004).操作员依据流程卡上信息来确定划片刀的型号，如有不符，通知设备维护技术员换刀，并填写作业记录表（编号：3745-02-40004）。7.1.3.4 After set up machine,operator need check the 1st wafer,after the 1st to 3rd line should stop cutting and check if the kerf is just in the middle of the street,and move the camera to final line by index step to check if the cut position is in the middle of the street too,check saw quality according to internal visual inspection 3712-02-00017.改机或机台于调整后，操作员在第一片晶圆切割时，需要检查每一面前三行切割位置是否在切割槽中央，参考目检标准 3712-02-00017 来检查切割质量。7.1.3.5 Only for non-Half cutting lot,Equipment maintenance technician,operator should check the 1st wafer quality after change device using micro scope and record on Production Log Sheet(No.:3745-02-40004).The checking item and sample size follow related Process Control Plan(No.:1111-02-20001).只有对非半切割产品，改机或机器调整后，设备维护技术员和操作员需在显微镜下检查第一片晶圆的切割质量，并填写作业记录表（编号：3745-02-40004）。检验项目及频率参照相应的制成控制计划（编号：1111-02-20001）。7.1.3.6 For Half cutting product,pls run 1piece of dummy wafer after setup machine or device change,and check the dummy wafers quality using micro scope and record on Production Log Sheet(No.:3745-02-40004).只有对半切割产品，改机或机器调整后，设备维护技术员和操作员需做一片 Dummy 在显微镜下检查晶圆的切割质量，正式产品不需要做检查，并填写作业记录表（编号：3745-02-40004）。7.1.4 Normal operation 一般作业 7.1.4.1 Operator should check if currently program match with travel card required before lot start and fill the information on the main and slave travel card.操作员在开始生产前必须要检查当前程序是否与流程卡上的要求一致并填写主副流程卡。7.1.4.2 Operator should check if material type are match with travel card required,and if the material are within life time control before lot start.if need to change the material,follow 7.1.5 Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 5 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.在开始生产前，操作员必须确认使用流程卡上要求的材料，并确保材料在有效期内，如需更换材料，请参照 7.1.5。7.1.4.3 The operator of wafer saw only does with one wafer lot one time and one cassette wafer only product on 1-2 machine,should check whether the incoming wafers lot size and cassette No.information accord with Travel Card and practicality.If any abnormal wafer should be hold then inform leader to deals with.在本工序，一次只能处理一个批次的晶圆且一个晶圆载物盒中的产品只能放在 1-2 个机台上作业不可以分机台，操作员必须核对来料批次的片数和晶圆载物盒的号码跟流程卡信息是否相符，将有问题的晶圆停止作业，同时通知生产线领班。7.1.4.4 Before Half cutting,operator should check whether there are cracks,scratch and obvious discolor on the surface and back of wafer or not.If there are,production should be stop and inform equipment maintenance technician,production line leader and process engineer.If it needs to be hold and analysis,keep it in N2 cabinet;if theres any particle or foreign partial on wafer,need clean them by using air gun.And need check the wafer surface orientation before taping.半切割之前，操作员应该检查晶圆正反面有无裂纹、划伤及明显变色等，如有，则要停止这片晶圆的生产，并通知设备维护技术员、生产线领班和工艺工程师。如需保留分析，晶圆应保存在氮气柜中。如有晶圆上异物，须用气枪吹干净.7.1.4.5 The resistance of incoming water of the saw machine should not less than 10M ohms.If the resistance is less than 10M OHMS,stop the production and inform facility 供给晶圆切割机的 D.I.水的电阻值必须大于或等于 10M ohms，当 D.I.水电阻值小于 10M ohms 时，停止生产，并应立即通知厂务进行处理。7.1.4.6 After mix with CO2 BUBBLER,the resistance of DI water shouldnt exceed 1M ohm.有二氧化碳发生器的，DI 水阻值应调整至不大于 1M ohm。7.1.4.7 If saw machine stop above 30 minutes and not drain water in these times.operator need drain water for 2 minutes before Production 如果晶圆切割机待料停机超过 305 分钟，而且这 305 分钟内没有放水，则在开始生产前操作员应将机器放水 23 分钟后再开始产品生产。7.1.4.8 Run dicing process and observe defects chipping,fly die and etc Then fill in Travel Card and Production Log Sheet(No.:3745-02-40004).And sample size and frequency should be follow related Process Control Plan(No.:1111-02-20001).进行切割操作时，操作员应检验切割质量并填写流程卡及作业记录表（编号：3745-02-40004），检验频率及抽样数量请参照相应的制成控制计划（编号：1111-02-20001）。7.1.4.9 If alarming when doing dicing saw operator need note equipment maintenance technician in time,and operator should check the cutting quality，if there are no problems,continue to production.在切割过程中，如果出现不懂的报警，操作员应及时通知给设备维护技术员，这时操作员要仔细检查切割质量，确认没问题才能继续工作。7.1.4.10 To saw controller wafer or charge pump wafer,should add si cleandice in cutting water(add one barrel cleandice,and will add two barrels water).切 controller wafer 或者 Charge pump wafer 时，应在切割水里加入硅粉清洗液(硅粉清洗液比例是：一桶清洗液加两桶水)。Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 6 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.The switch should be on.The mode should switch auto.模式需要选择到自动状态，所有机台都要选择 on 的状态。7.1.4.11 For controller laser grooving,mask liquid must be used before grooving.Controller 激光开槽必须使用保护液。7.1.4.12 Out of control handling procedure refer to saw operation OCAP(No.:3745-02-40005).失控处理办法参考本工序 OCAP（编号：3745-02-40005）。7.1.5 Change saw blade 更换划片刀 7.1.5.1 Blade and its type standard please refer to the following matrix for information:刀片型号和相关规格参数请见下表：P.N.材料编号 Description 描述 Thickness 厚度 Exposure 暴露量 ID 内径 OD 外径 C00-BLD000-0142 27HABB 0.0200.025mm 0.5100.640mm 19.05mm 55.56mm C00-BLD000-0141 DD 3500 0.0300.035mm 0.7600.890mm 19.05mm 55.56mm C00-BLD000-0233 DD 2500 0.0300.035mm 0.7600.890mm 19.05mm 55.56mm C00-BLD000-0381 DD 4000 0.0300.035mm 0.7600.890mm 19.05mm 55.56mm C00-BLD000-0383 DD 3000 0.0300.035mm 0.7600.890mm 19.05mm 55.56mm C00-BLD000-0193 ED 3500 0.0300.035mm 0.8901.020mm 19.05mm 55.56mm C00-BLD000-0240 FF 3500 0.0400.050mm 1.0201.150mm 19.05mm 55.56mm C00-BLD000-0314 CB 2000 0.0200.025mm 0.6400.760mm 19.05mm 55.56mm 7.1.5.2 When machine alarm that saw blade reach life limit,operator should note equipment maintenance technician on time,and exit full auto system and finish the current wafer.Equipment maintenance technician change saw blade after checking the blade type.当机台报警划片刀使用寿命将到时，操作员将机器退出全自动切割模式，切完当前这片 wafer，然后及时通知设备维护技术员更换。换刀前，设备维护技术员应确认刀片型号是否与流程卡上记录相匹配。7.1.5.3 Equipment maintenance technician change the blade,Full cuts blade(for DAG product)should dress the blade with dressing program on 12 inch dummy wafer for at least 30m,half cuts blade(for DBG product)should dress the blade with dressing program on 2pcs 12 inch wafer for at least 40m;and operator and equipment maintenance technician should record SAW blade information(No.:3745-02-40008)according to file.it can release production after operator check saw blade type and saw quality.And dressing parameters for new blade DD and 27HABB as below,27HABB is fine griter size blade,need set up cutting depth 60um.The recipe is according to the below:Title:Wafer Saw Standard Operation Procedure Document Number:3745-01-40001 Revision:31 SanDisk Confidential Page 7 of 27 Warning:This document is UNCONTROLLED and should not be relied upon unless obtained directly from the Agile Document Control System TODAY.设备维护技术员更换划片刀后，对于 Full cut 刀片产品（DAG），必须先使用预切割程序(程序名：Full Cut)对一片 12 英寸的 dummy wafer 切割至少 30m 以磨刀,对于 Half cut 刀片产品，必须使用预切割程序(程序名：half Cut)对两片 12 英寸的 dummy wafer 切割至少 40m 以磨刀;磨刀好后维护技术员填写换刀记录表（编号：3745-02-40008），操作员在作业记录表上记录。操作员确认刀片型号和质量无问题后，方可开始正常作料。对于 DD 和 27HABB 的刀，必须用 DD and 27HABB 的程序名，对于 27HABB 刀的金刚粒子比较细，需要切割深度设成 60um 厚度进行磨刀。7.1.5.4 Change the blade(dressed blade)when it was damaged and working life ends,it should exit auto saw mode before changing saw blade,then do kerf position calibration by cutting a blank tape and change the blade into semi auto to finish cutting.Notice:To avoid water corrosion,move wafer far away from DI water and dry wafer with air gun during blade changing;and searching for the middle of street before you define the first cut line.With in the third cut lines you need confirm the cutting position whether in the middle of street and check saw quality.For the wafer which has blade broken issue,operator must remark at T-card and do 100%inspection at 2VM,reject before and after 2 lines around the blade broken area.在作料中遇到崩刀或设备维护技术员在换刀时，如有产品在机台中，为避免晶圆长时间浸泡在加入二氧化碳的去离子水中，应将晶圆移开到一旁。更换好刀片（刀必须是磨好的刀）后，必须在空薄膜上做刀痕校准，然后进入半自动切割模式切完此料。注意定义第一刀时必须先找到切割槽，前三刀每刀都需确认切割位置是否在街区中央，并检查切割的质量。对于有过崩刀的晶圆，操作员必须在流程卡上做备注，2VM 做 100%全检，并把崩刀区域前两行和后两行都 reject。7.1.5.5 After change the blade,operator should be check 1st wafer qu