全球图像传感器(CIS)市场总结及趋势展望报告.pdf

2021-2022 全球图像传感器(CIS)市场总结及趋势展望Jun.2021 Sigmaintell Semiconductor Team2ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022技术趋势产能供应终端需求3ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022技术趋势产能供应终端需求4ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-20226563 7910 8152 8516 8761 8996 9353 3%Y2019Y2020Y2021FY2022FY2023FY2024FY2025F全球图像传感器出货量预测（单位：百万颗）同比增幅（%）全球图像传感器市场规模预测(含3D)（2019-2025F）(单位：百万颗，%)预计2021年全球图像传感器市场规模约216亿美金，同比增长约13%$168$192$216$240$262$283$302 13%Y2019Y2020Y2021FY2022FY2023FY2024FY2025F全球图像传感器销售额预测（单位：亿美金）同比增幅（%）终端需求 群智咨询（Sigmaintell）对全球图像传感器市场规模进行测算，预计2021年全球图像传感器终端需求约81.5亿颗（含3D），受上游产能限制及疫情影响，同比微增约3%。从终端需求金额测算，预计2021年全球图像传感器市场销售规模约216亿美金，预计2025年市场规模将达到约300亿美金。5ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022全球各应用产品图像传感器市场规模预测(含3D)（2019-2025F）(单位：百万颗，%)车载与安防将是继手机领域之后，下一个增量爆发的机会市场5013 6093 6206 6469 6617 6735 6807 357 452 494 537 581 622 753 300 289 315 338 361 386 467 208 271 332 393 424 475 537 Y2019Y2020Y2021FY2022FY2023FY2024FY2025FMobile PhoneSecurityAutomotivePCTabletDSC/Mirrorless/DSLR/CamcorderSmartphone 3DOthers$10,850$12,701$14,654$16,754$18,527$20,205$21,102$857$1,052$1,161$1,278$1,434$1,549$1,881$1,639$1,590$1,834$2,033$2,306$2,560$3,128$1,513$1,739$1,859$1,851$1,712$1,670$1,705 Y2019Y2020Y2021FY2022FY2023FY2024FY2025FMobile PhoneSecurityAutomotivePCTabletDSC/Mirrorless/DSLR/CamcorderSmartphone 3DOthers终端需求17.5%群智咨询（Sigmaintell）对全球图像传感器市场规模进行测算，预计2021年全球车载图像传感器终端需求约3.2亿颗（含3D），各国政策补助刺激新能源汽车快速增量，同比增长约8.8%。AI安防的应用场景广泛丰富，智能交通、智慧监所、工业安全、民用安防、智能楼宇等细分市场增量，预计2021年全球安防图像传感器终端需求约达到4.9亿颗，同比增长约9.3%。6ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022451 433 449 390 357 318 302 287 3,684 4,580 5,643 5,816 6,112 6,299 6,433 6,520-18%-4%4%-13%-9%-11%-5%-5%18%24%23%3%5%3%2%1%Y2018Y2019Y2020Y2021FY2022FY2023FY2024FY2025FFeaturephone CIS Shipment(untis:Mil.)Smartphone CIS Shipment(units:Mil.)Featuephone CIS Shipment YOY(%)Smartphone CIS Shipment YOY(%)预计2021年手机CIS出货量将达到约62.1亿颗，同比增长2%2018-2025F Worldwide mobile phone CIS shipment trends（Units：Mil.,%）备注：不含ToF及结构光。Source：Sigmaintell终端需求7ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-20223.28 3.77 3.78 3.80 Y2019Y2020Y2021FY2022FAverage units of Camera2019-2022F Worldwide Smartphone Multi-Camera CIS Structures Trends（Units：%）Source：Sigmaintell24%16%14%12%38%24%15%16%23%26%41%43%15%34%30%29%Y2019Y2020Y2021FY2022F01.Single02.Dual03.Triple04.Quad05.Penta终端需求后置多摄颗数升级意愿降低，转变成功能规格升级 在智能手机整体售价不变的情况下，尽可能压缩非必要的功能，例如：景深和微距功能。2000档位以内机型，逐步减掉一颗景深或者微距镜头。根据群智咨询（Sigmaintell）调查数据显示，自2021年一季度后智能手机搭载多摄的颗数逐步下降，2021年平均颗数只有约3.8颗。（此数据不包含3D sensor）。升级广角像素，提升整机售价：规格配置持续升级，冲击高端市场，增加市场份额。8ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022781 924 1,014 964 914 1,037 1,291 1,338 1,291 1,036 1,595 1,721 1,429 1,252 1,589 1,545 17%12%27%39%41%0%23%29%11%21%0%-10%18Q118Q218Q318Q419Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FWorldwide Smartphone CIS Shipment(Mil.)YoY%线性(Worldwide Smartphone CIS Shipment(Mil.)备注：不含ToF及结构光。2018-2021F Worldwide Smartphone CIS Shipment Trends by Quarter（Units：Mil.,%）21Q1缺货涨价影响，促使各终端加大库存备货量Source：Sigmaintell终端需求1,21Q1库存水位持续升高，直接影响下个季度的拉货节奏放缓。2,21Q2终端需求回调。9ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Shipment(Mil.)20Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY20Y21FY22F2020&2021FYoY%2021F&2022FYoY%Mini ChartsSamsung2292153263352723003272651105116311295.2%-2.9%Apple11115114929112514221930870379586213.1%8.4%Huawei*2012212141034639343773915636-78.9%-77.0%OPPO(+Oplus/Realme)1691462032722052272111917898349585.7%14.8%vivo12210012512612912613915047354463515.0%16.6%Xiaomi(+Redmi)13511515521421419219920261980790430.3%12.0%Honor -204161650187198-5.8%Others941311702051911671461545996586129.8%-7.1%Grand TTL106110801341154512031234133613715027514453322.3%3.7%Source：SigmaintellHuawei including Honor in 2020,备注：不含ToF及结构光。2020-2022F Worldwide Smartphone CIS Demand Trends by Vendors（Units：Mil.,%）终端商扩大备货计划，差异化升级高端产品摄像头规格，助力提升旗舰影像形象，冲击高端市场份额终端需求10ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Source：Sigmaintell备注：不含ToF及结构光。2022F Worldwide Smartphone CIS Demand Trends by SPEC（Units：Mil.,%）2022年主摄和超广角对超大底需求激增（1/1.5“），同比增长56%终端需求Company1/1.31/1.3-1/1.5 1/1.5-1/21/2-1/2.8 1/3-1/41/4Tatol1/1.31/1.3-1/1.5 1/1.5-1/21/2-1/2.8 1/3-1/41/4TatolHuawei1335131136-77%-78%-81%-74%-78%-76%-77%Xiaomi442977733435090452%29%-15%632%0%12%12%Others156631267242612-13%135%-21%42%-10%-7%-8%Samsung1011180219292417112952%-16%10%2%-9%-3%OPPO0339410433938995896%-5%50%10%14%15%VIVO218378226523163517%42%7%45%8%20%17%Honor 023111771761980%40%-11%40%-2%3%6%Apple09010265605086253%25%-31%8%8%Tatol1822459059921861715533271%41%-9%24%1%2%4%2022F2022F YoY%11ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022技术趋势产能供应行业大盘12ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-202202040608010012014016019Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021FY2022FSamsungOVTSK HynixGalaxyCore产能供应Source：Sigmaintell8-inch减产产能转移其他业务，迫使低阶CIS升级至12-inch生产2019-2022F Worldwide 8-inch CIS Foundry Cap.Trends by Design House（Units：K./M）减产36%1，晶圆厂减产低阶CIS芯片，产能被转移给其他业务代工（例如DDIC/MCU等）。2，SK Hynix搬厂影响产能减少。3，格科微部分低阶CIS转产至中国大陆12英寸晶圆厂生产。13ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-202205010015020025030035040019Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021FY2022FSonySamsungOVTSK HynixGalaxyCoreSmartSensSource：Sigmaintell2021年TOP3计划扩大高阶像素产品产能，加速高阶产品渗透率2019-2022F Worldwide 12-inch CIS Foundry Cap.Trends by Design House（Units：K./M）1，Sony新建日本长崎Fab5，2021年年底目标产能约30-35K/M。2，格科微与豪威科技，向武汉新芯及华虹扩产12英寸，增加高像素产能供应。3.Samsung向GlobalFoundries扩产，21Q2开始正式产出。21Q4新扩的UMC产能释放。产能供应+23%+12%14ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Source：Sigmaintell21Q1中低阶像素需求旺盛，带动格科微出货高涨2019-2022F Worldwide mobile phone CIS Shipment Structure by Makers（Units：%）*Others including BYD/Superpix,Himax,HiDM,SmartSensetc.33%30%25%24%25%23%21%22%16%20%23%26%27%23%22%21%26%26%27%27%24%21%22%20%20%22%21%22%27%22%21%21%12%14%13%13%12%16%17%17%17%17%16%14%13%16%16%16%12%11%9%9%9%10%11%13%11%11%10%10%10%11%11%11%15%18%25%25%29%29%29%27%34%29%28%28%22%28%30%29%2%2%1%1%1%1%1%0%1%1%1%1%1%0%1%2%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021FY2022FSonySamsungOVTSK HynixGalaxyCoreOthers1003 1139 1412 1459 1411 1130 1706 1838 1552 1345 1687 1622 5013 6085 6206 6469 产能供应15ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-202263%59%51%50%51%50%41%44%35%37%43%47%55%46%41%43%23%26%32%33%32%27%36%32%35%37%34%33%29%32%34%34%7%7%7%9%7%10%9%11%15%13%11%9%8%9%12%11%4%4%3%3%4%6%6%7%5%5%5%4%4%6%5%4%3%4%6%5%6%7%7%7%10%7%7%6%5%7%7%7%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021FY2022FSonySamsungOVTSK HynixGalaxyCoreOthersSource：Sigmaintell2021年三星积极的高像素策略，促使其市场份额快速提升2019-2022F Worldwide mobile phone CIS Revenue Structure by Makers（Units：%）*Others including BYD/Superpix,Himax,HiDM,SmartSensetc.$2,153$2,500$2,906$3,291$3,202$2,288$3,482$3,728$3,008$2,994$4,196$4,455$10,850$12,700$14,654$16,754 产能供应16ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Source：Sigmaintell21Q1Sony手机CIS出货量将达到约2.5亿颗，同比下降约27.5%2019-2022F Sony mobile phone CIS shipment Structure by Resolution（Units：%）13691337Y2020 Y2021F17%13%14%10%12%12%8%8%15%19%17%12%14%10%16%48%48%51%49%54%58%71%72%58%57%64%73%49%64%63%15%17%11%9%4%3%2%2%7%6%4%4%13%3%5%6%8%9%11%7%4%3%4%4%3%3%3%8%5%3%7%10%10%16%17%16%11%10%8%6%4%2%11%13%5%0%0%0%1%4%6%5%5%8%9%7%7%0%5%8%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021F2M5M7-8M10-13M16M20-25M32M40-48M50M+1374Y2022F50M(1.0u):30mil.-2.3%+2.7%产能供应17ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Source：Sigmaintell21Q1年Samsung手机CIS出货量将达到约13.1亿颗，同比下降9.6%2019-2022F Samsung mobile phone CIS shipment Structure by Resolution（Units：%）13221311Y2020 Y2021F0%0%14%9%6%7%7%11%8%8%6%6%5%4%9%8%5%26%27%24%24%24%24%20%22%22%20%19%18%25%22%20%36%30%29%28%23%21%23%26%29%27%25%23%31%23%26%15%14%16%13%15%13%6%5%6%4%3%4%14%10%4%1%3%6%6%7%8%8%7%5%8%8%9%4%7%7%4%8%11%12%11%13%15%16%15%13%9%9%9%14%11%0%0%2%5%8%7%16%14%11%17%26%31%2%11%21%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021F2M5M7-8M10-13M16M20-25M32M40-48M50M+1346Y2022F-0.8%+2.7%108M:60-70mil.产能供应18ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-202296499121Q1年OVT手机CIS出货量将达到约2.7亿颗，同比增长54.9%2019-2022F OVT mobile phone CIS shipment Structure by Resolution（Units：%）Source：Sigmaintell21%22%23%23%26%29%29%27%38%34%37%37%22%27%36%17%15%12%9%9%10%9%9%4%5%5%5%13%9%5%27%26%20%20%30%27%27%29%18%18%17%16%23%28%17%27%28%30%29%20%20%20%17%17%17%14%12%29%19%15%9%10%12%11%9%9%11%12%7%11%10%11%10%10%10%0%0%0%1%1%1%1%1%1%1%2%2%0%1%2%0%0%5%7%6%6%4%3%6%5%5%5%3%4%5%0%0%0%0%0%0%0%3%9%10%11%13%1%11%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021F2M5M7-8M10-13M16M20-25M32M40-48M50M+1032Y2020 Y2021F Y2022F+4.2%+2.7%64M(0.7u):90mil.产能供应19ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-20222019-2022F SK Hynix mobile phone CIS shipment Structure by Resolution（Units：%）21Q1年SK Hynix手机CIS出货量将达到约1.7亿颗，同比增长29.8%675659Source：Sigmaintell22%20%11%10%7%7%9%8%7%7%6%6%16%8%7%16%16%18%20%10%11%19%21%26%21%22%21%17%15%22%44%45%51%53%38%42%39%40%35%37%37%40%48%40%37%17%17%16%15%41%37%27%24%25%25%25%23%16%32%25%3%2%3%2%1%1%2%5%8%7%7%6%2%2%7%1%3%2%2%2%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021F2M5M8M13M16M20-25M32M40-48M50M+698Y2020 Y2021F Y2022F48M(0.8u):10mil.-2.3%+5.9%产能供应20ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Source：Sigmaintell2019-2022F GalaxyCore mobile phone CIS shipment Structure by Resolution（Units：%）21Q1年GalaxyCore手机CIS出货量将达到约5.3亿颗，同比增长30.2%1726184136%29%25%22%19%20%9%18%11%9%9%7%28%16%9%49%49%52%56%61%58%55%55%56%53%53%53%51%57%54%13%14%16%15%19%20%28%20%27%31%27%26%14%22%28%3%8%7%7%2%1%8%7%6%8%11%12%6%4%9%19Q119Q219Q319Q420Q120Q220Q320Q421Q121Q2F21Q3F21Q4FY2019Y2020Y2021F2M(below)2M5M8M13M16M20-25M32M40-48M1905Y2020 Y2021F Y2022F50M(0.7u):预计2021年底出样+3.5%8M:在GSMC新扩产能，于21Q3释放+6.7%产能供应21ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022Galaxy Core,20%Samsung,28%SK Hynix,24%Sony,7%OVT,22%21Q1TOP5整机CIS采购的供应商分布Source：Sigmaintell21Q1 CIS Demands Value chain by Design House（Units：%）HonorXiaomiOPPOSamsungvivoGalaxy Core,30%Samsung,44%SK Hynix,11%Sony,9%OVT,6%Galaxy Core,22%Samsung,17%SK Hynix,6%Sony,14%OVT,42%Galaxy Core,23%Samsung,30%SK Hynix,12%Sony,10%OVT,25%Galaxy Core,31%Samsung,15%SK Hynix,7%Sony,16%OVT,30%产能供应22ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022技术趋势产能供应行业大盘23ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022108MS5KHM2:0.7um,1/1.52”9合18M50M108M200MResolutionY20Y21Q1Y21Q2Y21Q3Y21Q4Y22Q1Y22Q2200MS5KHP1:0.64um,1/1.22”16合1108MS5KHM6:0.6um,1/1.7”9合164MS5KGWB:0.7um,1/1.2”4合1 RGBW50MS5KJN1:0.64um,1/2.76”4合1 Low cost200MS5KHP2:0.56um,1/1.3”16合164MS5KJW1:0.64um,1/2.8”4合150MS5KGN2:1.4um,1/1.12”DPD50MS5KGN6:1.6um,1/1.1”DPD50MS5KGNX:1.0um,1/1.5”RGBW for Rear50MS5KGN5:1.0um,1/1.5”DPD8MS5K4HB:1.0um,1/4”Made in 12-inch,may be restart on 22Q1Cost DownSamsung CIS Product RoadmapHotHotHot技术趋势24ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-202264MIMX789:0.8um,1/1.7”2x2 OCL IMX689 upgrade13M50M64M108MResolutionY20Y21Q1Y21Q2Y21Q3Y21Q4Y22Q1Y22Q2108MTBD:0.6um,1/1.7”PDAF32MIMX709:0.8um,1/2.8”2x2 OCL RGBW for Front64MIMX782:0.7um,1/2”2x2 OCL Frist 0.7um sensor50MIMX766:1.0um,1/1.56”2x2 OCL50MIMX989:1.6um,1/1.1”Customized version54MIMX866:1.0um,1/1.5”Upgrade IMX766 Video output:16:913MIMX712:1.12um,1/3.1”AFCost DownSony CIS Product Roadmap50MIMX752:0.7um,1/2.4”No hardware remosaic20MIMX596:0.8um,1/3.4”Front 50MIMX758:0.7um,1/2.4”Hardware remosaic 2x2 OCL May continue to be delayedHotHotHot技术趋势25ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022RGBW/RCCB/RYYB/CMY等多种提升芯片感光能力方案,改善UDC拍摄效果技术趋势RGBW 方案：在每个2x2晶胞上，彩色滤波阵列方式（CFA）将由传统的Layer RGB阵列方式中的部分绿色单元格改变为白色。优点：理论上感光能力可以提升50%左右，暗光下亮度提升明显。不足：1，绿色物体的还原有偏差。2，Stack工艺Sensor内部进行Bayer pattern转换功耗较大，使用过程中容易产生热噪声，影响画质。3，需要专用外挂ISP处理器。RCCB方案：在每个2x2晶胞上，彩色滤波阵列方式（CFA）将由传统的Layer RGB阵列方式中的全部绿色单元格改变为白色。优点：感光能力理论提升 100%，暗态下亮度提升明显。不足：需要专用外挂ISP(Image Signal Processing即图像信号处理单元)处理，Sensor功耗可控，色彩还原较好。但是需要增加专用 ISP成本。RYYB方案：在每个2x2晶胞上，彩色滤波阵列方式（CFA）将由传统的Layer RGB阵列方式中的全部绿色单元格改变为黄色。优点：感光能力理论提升 40%，暗态下亮度提升明显。不足：如果是Sensor内部还原Bayer pattern,有产生热噪声的可能。如果是平台ISP处理，需要平台做定向设计。Layer RGBRGBWRCCBRYYBCMY方案（cyan/magenta/yellow）：CMY是将所有通道的color filter转换成CMY(蓝绿色/洋红色/黄色).根据色彩混加原理，这样每一个通道都从两层颜色混合成单层颜色，可以吸收更多的光线。优点：光线吸收特性是目前几个方案中最好的。不足：需要专用外挂ISP处理器。NEW26ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022双主摄或三主摄成为高端旗舰新标配技术趋势28ALL RIGHTS RESERVED BY SIGMAINTELL.REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION.2021-2022THANKS