SMT检验统一标准PCBA专业资料.doc

检查项目:A-1零件脚吃锡局限性 SOP QFP (Inspection Item：A-1 Insufficient Solder SOP QFP Lead)允收原则(Accept Standard)吃锡应当达零件脚长1/2以上及需有爬锡状況 Side joint length (D) is more than 50% of lead length(L).拒收原则(Reject Standard)吃锡未达脚长1/2以上Side joint length (D) is less than50% of lead length(L) .检查项目：A-2零件脚吃锡局限性 PLCC SOJ (Inspection Item：A-2 Insufficient Solder PLCC SOJ Lead)允收原则(Accept Standard)吃锡高度(F)零件脚厚度(T) 1/2焊接物(G) Heel fillet height(F) more than solder thickness(G) plus 50% Lead thickness(T)拒收原则(Reject Standard)吃锡高度(F)零件脚厚度(T)1/2+焊接物(G)Heel fillet height(F)less than solder thickness(G) + 50% lead thickness(T)检查项目:A-3零件偏移SOP QFP (Inspection Item:A-3 Component Shift SOP QFP ) 允收原则(Accept Standard)偏移：1.零件脚(W)超过PCB不可超过本体宽度1/4Component lead shift off the pad,ut not exceed 1/4 width of lead width (W) 2.对于尺寸不大于0.5mm之QFP零件偏移量不可超过本体宽度1/2.The QFP component lead of pitch less than 0.5mm shift off the pad，but not exceed 1/2 width of lead width .拒收原则(Reject Standard)1.零件偏离焊垫且零件与焊垫接触面积(C)占零件本体宽度(W)3/4如下. Component lead shift off the pad andcontact the pad less than3/4 width of lead width(W)检查项目:A-4零件偏移 PLCC SOJ (Inspection Item：A-4 Component Shift)允收原则(Accept Standard)零件脚超过PCB(A)不可超过本体1/4(W) Component Lead shift off the pad，but not exceed 1/4 width of Lead area(W). 拒收原则(Reject Standard)零件偏离焊垫且超过本体面积1/4(W).Component Lead shift off the pad andexceed 1/4 width of Lead area(W)检查项目:A-5 零件偏移 (Inspection Item:A-5 Component shift)允收原则(Accept Standard)零件位於焊垫中心点. Component is on the center of pad 拒收原则(Reject Standard)零件偏离焊垫且超过本体宽度1/4.Component body shift off the pad and exceed 1/4Width of body width.检查项目：A-6吃锡过多 (Inspection Item:A-6 Excess Solder)允收標準(Accept Standard)吃锡带形状如锥形. The contour of soldering look like conic shape.拒收標準(Reject Standard) 焊锡超过焊垫四周 Tin excess around of pad.锡过多结成球点Tin too much look like ball shape检查项目：A-7立件 (Inspection Item：Tombstone Effect)允收原则(Accept Standard)零件位於焊垫中心点. Component is on the center of pad 拒收原则(Reject Standard)零件高翘导致电极端未吃锡Chip components standing on their Terminal end ( tombstone )检查项目：A-8 反向 (Inspection Item：A-8 Component Reverse)允收原则(Accept Standard)方向零件依PCB上方向标示上件 The polarity component is insertedaccording with polarity index on PCB. 拒收原则(Reject Standard)零件上件方向与PCB上方向标示不同The polarity component is inserted reversing with polarity index on PCB.检查项目：A-9 空焊 (Inspection Item:A-9 Void Soldering)允收原则(Accept Standard)零件吃锡饱满,并延伸至焊垫边.Solder well and Tin extend over side of pad.拒收原则(Reject Standard)零件脚吃锡未连接焊垫,导致空焊One lead or series of leads on component Is out of alignment and fails to make Proper contact with the land.检查项目：A-10 短路 (Inspection Item:A-10 Short Circuit)允收原则(Accept Standard)零件吃锡部份无任何短路. There isnt any short circuit on solder part of component. 拒收原则(Reject Standard) 零件吃锡部份导致短路.There is short circuit on solder part of component.检查项目：A-11缺件 (Inspection Item:A-11 Omitting Part)允收原则(Accept Standard)PCB零件数目与BOM零件数目相符合.The component quantity of PCB have to match the component quantity on BOM 拒收原则(Reject Standard)PCB零件数目与BOM零件数目不符合. The component quantity of PCB dont match the component quantity on BOM.检查项目：A-12 多件 (Inspection Item:A-12 Excess Parts)允收原则(Accept Standard)PCB零件数目与BOM零件数目相符合. The component quantity of PCB have tomatch the component quantity on BOM拒收原则(Reject Standard)PCB零件数目与BOM零件数目不符合The component quantity of PCB dontmatch the component quantity on BOM.检查项目：A-13掉件 (Inspection Item:A-13 Missing Parts)允收原则(Accept Standard)PCB零件数目与BOM零件数目相符合.The component quantity of PCB have to match the component quantity on BOM拒收原则(Reject Standard)外力导致掉件The component of external force makemissing parts检查项目：A-14 焊垫吃锡局限性 (Inspection Item:A-14 Insufficient Pad) 允收原则(Accept Standard)吃锡带形状如锥形 The contour of soldering looklike conic shape.拒收原则(Reject Standard)焊垫吃锡面积未达75%以上.The solder area dontexcess 75% of pad.检查项目：A-15 锡尖 (Inspection Item:A-15 Solder Icicle) 允收原则(Accept Standard)零件脚无导致锡尖. There isnt any icicle on component lead拒收原则(Reject Standard)零件脚导致锡尖.There is an icicle on component lead.检查项目：A-16 零件破损 (Inspection Item:A-16 Component Breakage)允收原则(Accept Standard)零件无任何裂痕或断裂 There isnt any breakage or break拒收原则(Reject Standard)零件外部有刮、刺、割、碰等损伤.There is some scratch、dub、cut or bumpdamage on component appearance.检查项目：A-17 金手指缺陷 (Inspection Item:A-17 Defect On Golden Finger )允收原则(Accept Standard)1.每面缺陷不超过3根,单根不能超过两点缺陷单点不得大於金手指宽度1/4 。Every side of defect is less than 3 gold singers ,the gold singers is less than 2 point，the point ofdefect is less than 1/4 wide of gold singer .拒收原则(Reject Standard)1.每面缺陷超过3根,单根超过两点缺陷单点大於金手指宽度1/4。Every side of defect is more than 3 gold singers ,the gold singers is more than 2 point，the point ofdefect is more than 1/4 wide of gold singer .检查项目：A-18 浮件(Inspection Item:A-19 Floating)允收原则(Accept Standard)整个零件本体长度全接触於基板面. The whole component body touches the PCB 拒收原则(Reject Standard)零件本体与基板面高度大於0.5mm.The nearest distance between component and PCB is more than 0.5mm.检查项目：A-19 锡渣(Inspection Item:A-20 Solder Residue)允收原则(Accept Standard)PCB及零件皆无沾锡丝或锡渣. There isnt any solder wire or solder dregs on PCB or component.拒收原则(Reject Standard)PCB或零件沾有锡丝或锡渣.There is a solder wire or solder dregs on PCB or component.检查项目：A-20 锡珠(Inspection Item:A-21 Solder Ball)允收原则(Accept Standard)1. 锡珠直径0.127mm如下,及PCB每面3颗锡珠如下. The diameter of solder ball is under 0.127mm and there are under 3 solder ball on one side of PCB 2.锡珠离焊垫或线路在在0.127mm以外.Solder balls beyond 0.127mm of lands or traces. 拒收原则(Reject Standard)1. 锡珠直径0.127mm以上,及PCB每面3颗锡珠以上.The diameter of solder ball is under 0.127mmand there over 3 solder ball on one side of PCB2.锡珠离焊垫或线路在0.127mm以内.Solder balls within 0.127mm of lands or traces.检查项目：A-21 (Inspection Item:A-22 Other Body Adhere)允收原则(Accept Standard)PCB无结晶状异物及白包沉淀物. There arent any crystal sludge and white magistery on PCB. 拒收原则(Reject Standard)PCB有结晶状异物及白色沉淀物.There are some crystal sludge andwhite magistery on PCB检查项目：A-22 锡裂(Inspection Item:A-23 Solder Crack)允收原则(Accept Standard)吃锡带没有裂痕、表面光亮平滑. There isnt any crack on soldering area and the surface is bright and flat. 拒收原则(Reject Standard)吃锡带有裂痕.There is a crack on soldering area.检查项目：A-23 锡洞(Inspection Item:A-24 Solder Crack)允收原则(Accept Standard) 吃锡带没有空洞、表面光亮平滑. There isnt any cave on soldering area and the surface is bright and flat. 拒收原则(Reject Standard)一种针孔以上焊点上有小颗粒或气泡.Above one little cave.There is a prill or bubble on soldering area.