PCB基本工艺术语专业资料.doc

* Process Module 阐明 ： A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔 (Blind & Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F) c-1 前解决 (Pretreatment) c-2 压 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 显 影 (Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping) c-7 初检 ( Touch-up) c-8 化学前解决,化学研磨 ( Chemical Milling ) c-9 选取性浸金压膜 (Selective Gold Dry Film Lamination) c-10 显 影(Developing ) c-11 去膜(Stripping ) D. 压 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蚀 (Microetching) d-3 铆钉组合 (eyelet ) d-4 叠板 (Lay up) d-5 压 合 (Lamination) d-6 后解决 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 铣靶 (spot face) d-9 去溢胶 (resin flush removal)E. 减铜 (Copper Reduction) e-1 薄化铜(Copper Reduction) F. 电镀 (Horizontal Electrolytic Plating) f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂带研磨 (Belt Sanding) f-6 剥锡铅 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 预烤 (Precure) g-3 表面刷磨 (Scrub) g-4 后烘烤 (Postcure) H. 防焊(绿漆)：(Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 静电喷涂 (Spray Coating) h-4 前解决 (Pretreatment) h-5 预烤 (Precure) h-6 曝光 (Exposure) h-7 显影 (Develop) h-8 后烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 喷砂 ( Pumice)(Wet Blasting) h-12 印可剥离防焊 (Peelable Solder Mask) I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) i-2 电镀软金 (Soft Ni/Au Plating) i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡 (Hot Air Solder Leveling) j-1 水平喷锡 (Horizontal Hot Air Solder Leveling) j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling) j-3 超级焊锡 (Super Solder ) j-4. 印焊锡突点 (Solder Bump) K. 成型 (Profile)(Form) k-1 捞型 (N/C Routing ) (Milling) k-2 模具冲 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜边 ( Beveling of G/F) L. 短断路测试 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查 ( AOI Inspection) l-2 VRS 目检 (Verified & Repaired) l-3 泛用型治具测试 (Universal Tester) l-4 专用治具测试 (Dedicated Tester) l-5 飞针测试 (Flying Probe) M. 终检 ( Final Visual Inspection) m-1 压板翘 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包装 及出货 (Packing & shipping) Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸取(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(实验).Acceleration速化反映.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy精确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity，or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)积极零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力增进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模仿电路/模仿讯号.Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国原则协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检查.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准.Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液. *B*Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels，Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传播线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145Sp.Gr)凡液体比重比水轻则 Be=140(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对纯水1g/cm比值).Beam lead光芒式平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝她射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层.Bonding Sheet(Layer)接合片.Bonding Wire结合线.Bow，Bowing板弯.Braid编线.Brazing硬焊(用含银铜锌合金焊条).在425870下进行熔接方式).Break Point显像点.Break-away Panel可断开板.Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍解决.Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程.Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化实验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层. *C*C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment，Active活化炭解决.Card卡板.Card Cages/Card Racks电路板构装箱.Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board，Catalyzed Substrate催化板材.Catalyzing催化.Cathode阴极.Cation阴向离子，阳离子.Caul Plate隔板.Cavitation空泡化 半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针尖部.Chlorinated Solvent含氯溶剂,氯化溶剂.Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 .Clip Terminal绕线端接.Coat，Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材.Condensation Soldering凝热焊接,液化放热焊接.Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性，服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service合力厂,分包厂.Controlled Depth Drilling定深钻孔.Conversion Coating 转化皮膜.Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜实验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板.Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记.Counterboring方型扩孔.Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon，Test Coupon板边试样.Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕实验.Crosshatching十字交叉区.Crosslinking，Crosslinkage交联,架桥.Crossover越交,搭交.Crosstalk噪声，串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力.Curtain Coating濂涂法. *D*Daisy Chained Design菊瓣设计.Datum Reference基准参照.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边沿逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具备重量(以克米计).Densitomer透光度计.Dent凹陷.Deposition 皮膜解决.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬 酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面解决铜箔.Drag In / Drag Out带进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy，Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板. *E*E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承办器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试.EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度.Electrodeposition电镀.Electro-deposition Photoresist电着光阻，电泳光阻.Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜.Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动，电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性，延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰.Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜解决.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融构成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼. *F*Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线.Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度，纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性级别.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板.Flexural Failure挠曲损坏.Flexural Module弯曲模数，抗挠性模数 .Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊.Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 ，贴平式 导体.Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残存物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线阐明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液. *G*G-10由持续玻纤所织成玻纤布与环氧树脂粘结剂所复合成材料.Gage，Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼顺序(电动顺序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging，Groove玻纤突出/挖破.Glass Transition Temperature，Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用原则板.Grain Size结晶粒度.Grass Leak 大漏.Grid原则格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚. *H*Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC氟碳化物一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次刺下动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起实验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐. *I*I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert，Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子互换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性. *J*JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时浮现. *K*Kap