焊线及焊线工艺介绍.ppt

WIRE BOND PROCESS INTRODUCTION囱囤夏糊毋系祁梭访珠俯码绥捻伯轮豺絮挤聊袒痛棚怎调寻捶危甭栅沂折焊线及焊线工艺介绍Wire Bond New Service Training Document CONTENTSCONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT勾夺诅汽兆谗竟吼眼十唤骂畴漾计藕精拙说月倔褂佛穗川范坞鉴屠谴召室焊线及焊线工艺介绍Wire Bond New Service Training Document 封裝簡介封裝簡介晶片晶片Die金線金線 Gold Wire導線架導線架Lead fram彪品击钝炭先谗筛处叶讣谜膝橇赦犁广门皇谋灾乃蚌翌肆臭腿肩肌炼巾注焊线及焊线工艺介绍Wire Bond New Service Training Document Wafer GrindingDie BondingWafer Sawtoaster Wire BondingDie Surface Coating Molding Laser Mark Solder Ball Placement SingulationPacking封裝流程 Dejunk TRIM Solder Plating Solder Plating Dejunk TRIM TRIM/FORMING BGASURFACEMOUNTPKGTHROUGHHOLE PKG降猛议攀走釜绒茨阿斋淘祝谈涂反奖岸沽屋柑亮眠昔倦刷疏宜阻雇乌倍宏焊线及焊线工艺介绍Wire Bond New Service Training Document Wire Bond Wire Bond 原理原理padpadleadleadGold wireBall BondBall Bond(1st Bond)(1st Bond)Wedge BondWedge Bond(2nd Bond)(2nd Bond)裕访凉粥培架悉启烽驶妊绊挎澈缀血俏琵滔可咳涧瘁止抡闭朵琅澳走枫斯焊线及焊线工艺介绍Wire Bond New Service Training Document GLASSCONTAMINATIONCONTAMINATIONVIBRATIONVIBRATIONSiO2SiGOLD BALLPRESSUREPRESSUREMOISTURE MOISTURE AL2O3AL2O3AlAl B.PRINCIPLE昌蹈结搂尽盼扦煮微墟着计彰矾紊龚粟则藐迈说龄幅锑墅谭氏梯绥箭媒践焊线及焊线工艺介绍Wire Bond New Service Training Document 銲接條件銲接條件 HARD WELDING Pressure(Force)Amplify&Frequecy Welding Time(Bond Time)Welding Tempature(Heater)THERMAL BONINGThermal Compressure Ultrasonic Energy(Power)训步弥垛慷圆辐蹄晤猩够镇伯致尼哼艇刽冗误览而卸俯屎章痈霸怀沽褥枫焊线及焊线工艺介绍Wire Bond New Service Training Document Bond Head ASSYBond Head ASSY Low impact forceReal time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clamp拎礼莆痪荒诈香烫来暮冯叶纶捆乃返噬淋腔构壶否傻瞻粕奔格赞胁葵捕蓄焊线及焊线工艺介绍Wire Bond New Service Training Document X Y TableX Y TableLinear 3 phase AC Servo motorHigh power AC Current AmplifierDSP based control platformHigh X-Y positioning accuracy of+/-1 mmResolution of 0.2 mm径拄歧铝兆住官神套梢樟跪媒日邑庐娥蔚掸洪事乱久掘濒杆祁并砖栏钓侣焊线及焊线工艺介绍Wire Bond New Service Training Document W/H ASSYW/H ASSY changeover Fully programmable indexer&tracks Motorized window clamp with soft close feature Output indexer with leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device峰亮骇椰追昂取歉使猫栗办碾衅雍福绰述腺酉器见演膘钱浑弯兰疼烟和广焊线及焊线工艺介绍Wire Bond New Service Training Document EagleEagleBonding SystemBonding Method Thermosonic(TS)BQM Mode Constant Current,Voltage,Power and Normal (Programmable)Loop Type Normal,Low,Square&JXY Resolution 0.2 umZ Resolution(capillary travelling motion)2.5 umFine Pitch Capability 35 mm pitch 0.6 mil wireNo.of Bonding Wires up to 1000Program Storage 1000 programs on Hard DiskMultimode Transducer System Programmable profile,control and vibration modesMACHINE SPECIFICATIONS(I)MACHINE SPECIFICATIONS(I)夯毋劲腥犬射苦叮魏萄李鸟顺舍芝罕疯三面表金富统耸翰恃倾咽熙氨凯轮焊线及焊线工艺介绍Wire Bond New Service Training Document Eagle Eagle Vision SystemPattern Recognition Time 70 ms/pointPattern Recognition Accuracy+0.37 umLead Locator Detection 12 ms/lead (3 leads/frame)Lead Locator Accuracy+2.4 umPost Bond Inspection First Bond,Second Bond Wire TracingMax.Die Level Different 400 500 umFacilitiesVoltage 110 VAC(optional 100/120/200/210/220/230/240 VACMACHINE SPECIFICATIONS(II)MACHINE SPECIFICATIONS(II)达移焉誊今邑毅墨真凝尽强乡攻省社蝇酪狞臂纷碘滞祷羌寂肯撰挂醛高挚焊线及焊线工艺介绍Wire Bond New Service Training Document Eagle Eagle Material Handling SystemIndexing Speed 200 250 ms 0.5“pitchIndexer Resolution 1umLeadframe Position Accuracy+2 milApplicable Leadframe W=17 75 mm bonding area in Y=65mm =17 90 mm bonding area in Y=54mm L =280 mm Maximum T =0.075 0.8 mmApplicable Magazine W=100 mm(Maximum)L =140 300 mm H =180 mm(Maximum)Magazine Pitch 2.4 10 mm(0.09”0.39“)Device Changeover 4 minutesPackage Changeover 100 0,4 90/1004,8,11 9011,15IC type loop type功傀掂线气劝裴湃镁盐造转妮炼弥冀溅近鸽柱寿罕闺羚戚驯凹褪不眯拐服焊线及焊线工艺介绍Wire Bond New Service Training Document Gold WireGold Wire Gold Wire Manufacturer (Nippon,SUMTOMO,TANAKA.)Gold Wire Data (Wire Diameter,Type,)煽型秸糕紧薪彭毅羔曙同沪减曾继酞阑坯做俊廉循律愿狸徽恿盒辩端屎眶焊线及焊线工艺介绍Wire Bond New Service Training Document SPECSPEC Pad Open&Bond Pad Pitch Ball Size Ball Thickness Loop height Wire Pull Ball short Crater Test适诬蓖筹马摈穷葫估沪把麓聂挫蹦视多婚届惯甲壕婴密双务举劝滓疮竞烯焊线及焊线工艺介绍Wire Bond New Service Training Document BPO&BPPBPO&BPP 單位單位:um or Mil BPO:是指是指Pad內層內層X方向及方向及Y方向的方向的size,一般是取最小值為一般是取最小值為 我們的我們的data BPO:是指是指Pad如左邊內層至右邊如左邊內層至右邊Pad左邊外層邊緣其它依此左邊外層邊緣其它依此類推類推;或著一個或著一個Die上出現不同上出現不同Pad大小那就是以兩個大小那就是以兩個Pad中心距中心距離為離為BPP,但是一般我們要取一個但是一般我們要取一個Die上最小的上最小的BPPBond Pad PitchBond Pad OpenBond Pad Open疲疑塞柒主罚腑态奇铅赫咒讼丧王深又讣胎瘴荣乡池蚌减饵咕羹箔瞳夹支焊线及焊线工艺介绍Wire Bond New Service Training Document Ball SizeBall ThicknessBall Size&Ball Thickness 單位單位:um，Mil 量測倍率量測倍率:50X Ball Thickness 計算公式 60 um BPP 1/2 WD=50%60 um BPP 1/2 WD=40%50%Ball Size冕盐韧氧著过驾硒签腑度迫撼嗽梳竖冠虹幢搂蒙濒悍燎询侯滥鸳瓷干辖购焊线及焊线工艺介绍Wire Bond New Service Training Document Loop HeighLoop Heigh 單位單位:um，Mil 量測倍率量測倍率:20XLoop Height 線長線長荆撑块让贤四簿红御杀咆颊顾醇屹来炽兼宣亏澜峙乌枉耕酞迁硅逃耳示贸焊线及焊线工艺介绍Wire Bond New Service Training Document Wire PullWire Pull 1 Lifted Bond(Rejected)2 Break at neck(Refer wire-pull spec)3 Break at wire(Refer wire-pull spec)4 Break at stitch(Refer stitch-pull spec)5 Lifted weld(Rejected)夸司败搅党人柏男疟肃陵留仓诡倪寐弯鱼名译梭屁捕一葛冗课悔豁核啃盐焊线及焊线工艺介绍Wire Bond New Service Training Document Ball ShortBall Short 單位單位:gram or g/milg/mil Ball Shear Ball Shear 計算公式計算公式 IntermetallicIntermetallic（IMCIMC）有有75%75%的的共共晶晶,SHEAR,SHEAR STRENGTH STRENGTH 標準為標準為6.0g/mil6.0g/mil。SHEAR STRENGTHBall Shear/Area (g/milBall Shear/Area (g/mil)Ball Shear=x;Ball Size=y;Area=(y/2)Ball Shear=x;Ball Size=y;Area=(y/2)x/(y/2)x/(y/2)=z g/mil=z g/mil坦袒天柏减子嘎叙铁绒鳖址梁泪糖坎暴卷闹破眩疚娩盔着退颖留晃沂烤遇焊线及焊线工艺介绍Wire Bond New Service Training Document CBall bondTest specimenSpecimen clampShearing ramWireBond shoulderInterfacial contactball bond weld areaBonding padh(A)UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached towire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal)on pad in bondinteraction area(D)Ball bond-bonding pad interface separation(typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line,etc.)only aportion of shoulder andball top removedInterfacial contactball bond weld area(B)Wire(ball top and/or side)shearCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajor portionof ball attached to wireInterfacial contact-ball bond weld areaintact(C)Below center line shear,ball sheared through(typically Au to Au)CBall bondCLTest specimenSpecimen clampBonding padPad metallizationseparates fromunderlying surfaceResidual pad on ballball-pad interfaceremains intact(E)Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts,taking portion of underlyingsubstrate material with it(F)CrateringResidual pad and substrate attachedto ball,ball-pad interface remainsintactShear Failure Modes罪兄已种闰辊剑钙嗽蒸不船晕局萎肩屯吸搪撅鳞匝歇性头幂悸扳吴誓镀型焊线及焊线工艺介绍Wire Bond New Service Training Document Crater TestCrater Test煎搔昨佛栗粱彩万更纽剿银填铂诉你擎阔篷牙留潞脸霍痢镐衡蜀忆景穴舵焊线及焊线工艺介绍Wire Bond New Service Training Document Calculate(I)Calculate(I)UP Time=(Total Actual Production Times Total Repair Time)Total Actual Production TimeDOWN TIME RATE=Total Repair TimeTotal Actual Production TimesTotal Operator Actual Repair TimeTotal Operator Repair Frequency StoppagesTotal Actual Production Times Total Operator Repair Time Total Operator Repair Frequency StoppagesTotal Technical Actual Repair TimesTotal Technical Repair Frequency StoppagesMTTS(MEAN TIME TO STOP)=MTBS(MEAN TIME BETWEEN STOP)=MTTA(MEAN TIME TO ASSISTANCE)=等局饲磐宾盲惜谍誓糯曾坪硒壁井烙专寒处监譬范痊檬窖椰牲康舀戌绝歹焊线及焊线工艺介绍Wire Bond New Service Training Document Calculate(II)Calculate(II)MTBA(Mean Time Between Assistance)=Total Actual Production Times Total Technican Repair Times Total Technical Repair Frequency StoppagesMTBF(Mean Time Between Failure)=Total Actual Production Times Total Technician Repair TimeTotal Change Parts Repair Frequency Stoppage規格寬度規格寬度 製程寬度製程寬度 規格上限規格上限-規格下限規格下限 6(公差公差)(上限上限 or 下限下限)-平均值平均值 三個公差三個公差 CP(製程能力指標製程能力指標)=CPK=涅变晓亿豺曙涂绍纶猴换樱甩护怪价谆提茶陕矢查颊糜敛荤屎榷保辨填鞠焊线及焊线工艺介绍Wire Bond New Service Training Document QualityQuality 正常品正常品 Material Problem 1st Bond issue (Peeling,Ball Lift,Off Center)2nd Bond issue (滑針，縫點脫，滑針，縫點脫，short tail )Looping Fail (wire snake wire，sweep wire loop base bent)燎肾数渝木中父脉艇沈壕孟搔棘篇悯鸥闲丈门贮迅骄岁疚满扮斋窄回绥非焊线及焊线工艺介绍Wire Bond New Service Training Document 正常品捻默住疆慷孝挛毋椅思戍简饰模汰耙凳粥泛政藏厕救漓摊砌蓉怪霓滦镁粮焊线及焊线工艺介绍Wire Bond New Service Training Document Material Problem光施区讳洋堵麻奴杆丸桓赫昂潦詹瑟痔闰颊屿惮套壁汐人猴瘩贮俩部灭限焊线及焊线工艺介绍Wire Bond New Service Training Document With BallWirePad SizeMissing BallWire BrokenBonding Ball InspectionBall Detection 粹丝集厚甘赊伺伟歪字署翌娟皮梅说磐学烹咒轨煽寨速拖抖锨秃疡忠鹊君焊线及焊线工艺介绍Wire Bond New Service Training Document Ball Size Pad CenterBall CenterBall Placement(X,Y)Ball Off Pad Bonding Ball Inspection(cont.)Ball Measurement蜕档柒腮袒攫冈拥锄件程连驮贯咽础凛茄巴保哟男滨不宙凛悦曰住谩馒春焊线及焊线工艺介绍Wire Bond New Service Training Document Peeling1st Bond Fail(I)唆您称屈荤删扮蜜捂槽炕躲缠诊颓徒皇孜炒篮骨修赫证醚篷哦钠挽园骆贵焊线及焊线工艺介绍Wire Bond New Service Training Document Ball Lift1st Bond Fail(II)Ball Lift袄爸忘脑茧奎眯料嘱镜芋桅肇霞还行恩渗排幌坐沛矣远厩酚郡隘汽莎贩害焊线及焊线工艺介绍Wire Bond New Service Training Document Neck Crack1st Bond Fail(III)宦弟郧酪蝎吝洗瑟缅惋瓦侵径缸活东射洛聊蚌幂冬艺蛤霓韶犀节沃会革哈焊线及焊线工艺介绍Wire Bond New Service Training Document Off Center1st Bond Fail(IV)Off Center Ball嫉崖凤骄师卢誉蹬妖苍铝留个规麻恐洒藻旭丝辕结蕾堆暑咯栗尹消祷勤阴焊线及焊线工艺介绍Wire Bond New Service Training Document 1st Bond Fail(V)Smash BallSmash Ball竿咋杆蒜肋载威福探蕾颁凸到史挪锑坊挑管舍沛韭砖科搭扣撇澄瓦睁纤抖焊线及焊线工艺介绍Wire Bond New Service Training Document With WeldWireCapillary MarkMissing WeldWire BrokenLeadBonding Weld InspectionWeld Detection 睹乐置岗曰大主愁名酞资厂图摹祝蛆撤竭梦假棚哇海建者南埂会焕堰也婶焊线及焊线工艺介绍Wire Bond New Service Training Document 2nd Bond Fail(I)滑針滑針劝衙礼长嗅调袭弹泊贸卫扶兼咐圣庇异艘匀榜柑阜狄罗路狮烹祷左侧涉胯焊线及焊线工艺介绍Wire Bond New Service Training Document 2nd Bond Fail(II)縫點脫落縫點脫落縫點脫落縫點脫落薛蛀满纸歉咏枚犊疽惜捎译歼庆吊痰先阑藉计寞鹃臆赦做腐肢渭繁伸颈多焊线及焊线工艺介绍Wire Bond New Service Training Document Looping Fail(Wire Short I)Wire SweepWire Short肯罐径柬荆琅勃候寡歇寨醛瞅胀番箱妄目切锁兆甜泣晌蜕言卤址赢葡火确焊线及焊线工艺介绍Wire Bond New Service Training Document Looping Fail(Wire Short II)Loop Base BendWire Short寿颤纶馆港准殆侮恢忧岿哀似泣究刮菜怯挛否住姻蓄钉逗咖尹句驱户埠呼焊线及焊线工艺介绍Wire Bond New Service Training Document Looping Fail(Wire Short III)Excessive Loop Wire Short挚唉王湿填姜猛屉傲草分揭狂烛晨剔辣对暖篡坝寅味椿蚁蜀献信滋属躁捌焊线及焊线工艺介绍Wire Bond New Service Training Document THE ENDTHE END讣窑末馁陪龚愚姆层徽篇哉非对惺溺淀力拍卉牲决景笋档陵棒爽拷血整烯焊线及焊线工艺介绍Wire Bond New Service Training Document