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1、 IPC-1710A OEM Standard for Printed Board Manufacturers' Qualification Profile Developed by the OEM council of the IPC, the MQP sets the standard for assessing PWB manufacturers capabilities and allows PWB manufacturers to more easily satisfy customer requirements.
2、 IPC-1710A May 2004 A standard developed by IPC ____________________________________________________________________________________________ 2215 Sanders Rd, Northbrook, IL 60062-6135 Tel. 847.509.9700 Fax 847.509.9798 NOTICE IPC standards and publications are designed to serve t
3、he public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standar
4、ds and Publications shall not in any respect preclude any member or non-member of IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whe
5、ther the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials or processes. By such action, IPC does not assume any liability to any patent owne
6、r, nor do they assume any obligation whatever to parties adopting the recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. The material in this standard was developed by the OEM Council of the
7、Institute for Interconnecting and Packaging Electronic Circuits. Ó Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions. FOREWORD It is not intended that this Manufacturers’ Qualification Profile (MQP) sati
8、sfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work cl
9、oser to meeting each others needs. ACKNOWLEDGMENTS The IPC is indebted to the members of the OEM council who participated in the development of this document. A note of thanks is also expressed to the members of the IPC Presidents Council for their review and critique and construction recomme
10、ndations in finalizing the principles developed for the MQP. Although the IPC is grateful for all the involvement and individual contributions made in completing the MQP a special acknowledgment is extended to the following individuals. It was their dedication and foresight that made this public
11、ation possible. Rudolfo Archbold Digital Equipment Corp Rick Iantaffi Northern Telecom Don Noel Harris Corp. - Computer Sys. Div Mario Suarez-Solis Encore Computer Corp. Patrick Bernardi IBM Sue Jones Wilcox Electric Rick Smith Compaq Computer Corp. Gordon
12、Wolfram Raytheon Company Vernon Brown Motorola, Inc. Chuck Krzesicki Honeywell Avionics Division Peter Solecky IBM Jerald G. Rosser Hughes Missile Operations Div. Don Holt Texas Instruments Thomas Kurtz Hughes Defense Communications Joseph F. Sterb
13、a Honeywell, Inc. Jamie Zanios Wellborn Industries Ltd. CONTENTS Sections: Pages: 1.1 Company Description 1 1.2 Site Description 2 2.1 Process 3-4 2.2 Electrical Test Equipment 5-7 2.3 Product Type 8-10 2.4 Product Complexity 11-14 2.5 Quality Development 15-16 3.0 E
14、quipment Pro Master Equipment Listing 22 4.0 Technology Pro 23-30 5.0 Quality Pro 6.0 Manufacturing History 42 7.0 Identification of Previous Audits 43 8.0 Financial Review 44 9.0 MQP Electronic Editing 45 SECTION 1.1 DATE COMPLETED 2006/5/16 COMPANY DESCRIPTION GENE
15、RAL INFORMATION LEGAL NAME PHYSICAL ADDRESS CITY STATE ZIP PROVINCE COUNTRY China TELEPHONE NUMBER FAX NUMBER TELEX NUMBER E-MAIL ADDRESS MODEM NUMBER DATE FOUNDED PUBLIC PRIVATE INTERNET URL MANAGEMENT PRESIDENT CHIEF OPERATING OFF
16、ICER VICE PRESIDENT OF MANUFACTURING VICE PRESIDENT OF QUALITY VICE PRESIDENT OF MARKETING/SALES VICE PRESIDENT OF CUSTOMER SERVICE WASTE TREATMENT MANAGER (POLLUTION PREVENTION) CORPORATE NUMBER OF EMPLOYEES DESCRIPTION CORPORATE SITE COMMENTS DESIGN AND DEVELOPMENT
17、 ENGINEERING MANUFACTURING CONTROL MANUFACTURING DIRECT INDIRECT QUALITY CONTROL QUALITY ENGINEERS INTERNAL AUDITORS GENERAL MANAGEMENT ADMINISTRATION Other TOTAL SECTION 1.2 DATE COMPLETED 2006/
18、5/16 SITE DESCRIPTION (TO BE COMPLETED FOR EACH SITE) ATTACH APPROPRIATE CHARTS (OPTIONAL) MANUFACTURING FACILITY COMPANY NAME PHYSICAL ADDRESS CITY STATE ZIP PROVINCE COUNTRY TELEPHONE NUMBER 6-755-61615623 FAX NUMBER TELEX E-MAIL ADDRESS MODEM NUMBER YEARS IN BUSINE
19、SS INTERNET URL FTP PRINCIPLE PRODUCTS/SERVICES/SPECIALTIES BUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.) FACILITY MANAGEMENT TITLE REPORTS TO (Function/Job Title) OVERALL OPERATION RESPONSIBILITY FOR THIS SITE MANUFACTURING TECHNICAL/ENGINEE
20、RING MATERIALS/PRODUCTION CONTROL PURCHASING QUALITY SALES REPRESENTATIVE WASTE MANAGEMENT BUILDINGS SYSTEMS (INDICATE % COVERAGE) AGE AREA (Sq. Ft.) Construction (Wood/Brick) Power Conditioning Heating Ventilation Air Conditioning Sprinkl
21、ers Waste Treatment Other Office Manufacturing Storage Planned additions SAFETY AND REGULATORY AGENCY REQUIREMENTS Are fire extinguishers functional and accessible to employees? YES NO What is the distanc
22、e to the nearest fire station? (in minutes) 20 Minutes Do you conform to local/federal environ- ment protection agency requirements? YES NO Date of last OSHA visit Date of last EPA visit 4/10/2006 5/9/2006 Are you currently operating under a waiver or in violation of local government
23、 requirements? YES NO Other Agency Audits, UL, ISO 9000, NECQ, CSA Approval and Number UL # E232940 CSA # ISO 9001# 2000 Other Do you have a safety program? Describe below. YES NO Hazardous Waste Number Trade Waste Account Number 3 PLANT PERSONNEL (TOTAL EMPLOYEES)
24、 Regular Contract Office Technical/ Engineering Production Full-Time QA Part-Time QA Union Non- Union Union Name Contract Expires (Date) COMMENTS SECTION 2.1 PROCESS DATE COMPLETED This section is intended to provid
25、e overview information on the processes used to fabricate printed board products. Site Capability Snapshot (Please Check all that apply) Designators Remarks A Conductor Forming Processes Subtractive Thin Foil Subtractive less than .5 oz. Semi-Additive Additive (Electro-less)
26、 Black Hole Thick Film Paste and Fire Thin Film Semi-conductor Sputtering Other: PTHàpanel platingàD/F-àpattern plating-àETch B PTH Materials and Processes Acid Copper Pyro-Phosphate Copper Full Built Electro-Less Gold Paste Copper Paste Gold Conduc
27、tor Sputtering Nickel Conductor Sputtering Other: C Permanent Over-plating Tin Tin-Lead Tin-Nickel Alloy Nickel Nickel Gold (Hard) Nickel Gold (Soft) Nickel Rhodium Conductive Polymer Other: D Permanent Selective Plating Tin
28、 Tin-Lead Tin-Nickel Alloy Nickel Nickel Gold (Hard) Nickel Gold (Soft) Nickel Rhodium Other: E Permanent Mask or Coating Photo Dry Film Photo Liquid Image Transfer Screen Mask Conformal Coating Solder Mask Cover Coat Other: F
29、Other Surface Finishes Tin-Lead Fused Immersion Tin Solder Leveled Roll Soldered Electro-less Solder Fused Solder Bumped Lands Solder Paste Fused Azole Organic Protective Covering Flux Protective Covering Other: Flash gold; lead free HAL; Immersion Silver
30、 SECTION 2.2 ELECTRICAL TEST EQUIPMENT DATE COMPLETED 5/16/2006 This section is intended to provide overview information on the test equipment and testing capability of the manufacturer. Site Capability Snapshot (Please Check the column that applies furthest to the right.)
31、 Designators Remarks A Number of Nets <200 200 500 1000 2000 3000 4000 5000 >5000 Other: B Number of Nodes <500 500 1000 2000 3000 4000 5000 6000 >6000 Other: C Probe Point Pitch >1.0
32、[.040] 1.0 [.040] 0.8 [.032] 0.65 [.025] 0.50 [.020] 0.40 [.016] 0.30 [.012] 0.20 [.008] <0.20 [.008] Other: D Test % Single Pass None <60% 60% 70% 80% 90% 95% 99% 100% Other: E Probe Accuracy (DTP)
33、 >0.2 [.008] 0.2 [.008] 0.15 [.006] 0.125 [.005] 0.1 [.004] 0.075 [.003] <0.075 [.003] Other: F Grid Density Single Side Grid Double Sided Grid Double Density Grid Double Density Double Sided Quad Density Double Sided Quad Density Flying Pro
34、be Other: G Netlist Capability Golden Board IPC-D-356 Net List Extraction CAD/CAM Net List Compare Other: H Test Voltage <20 VDC 20 VDC 40 VDC 60 VDC 80 VDC 100 VDC 500 VDC 1000 VDC >1000 VDC Other: 250V
35、 J Impedance Meas Micro Section Inboard Circuit Coupon Manual TDR Automated TDR Other: K Impedance Tolerance None >20% 20% 15% 10% 7% 5% 2% <2% Other: Standard Advanced SECTION 2.3 PRODUCT TYPE DATE COMPLETED 5/
36、16/2006 This section is intended to provide overview information on the printed board product types being fabricated by the manufacturer. Site Capability Snapshot (Please Check all that apply.) Designators Remarks A Product Type Rigid Printed Board Flex Printed Boar
37、d Rigid/Flex Board Rigid Back Plane Molded Product Ceramic Printed Board Multichip Module Liminated Multichip Module Deposited Dielectric Multichip Modules Other: B Circuit Mounting Type Single Sided Double Sided Miltilayer Single-sided Bonded
38、 to Substrate Double-sided Bonded to Substrate Multilayer Bonded to Substrate Constrained Multilayer Distributed Plane Multilayer Other: C Via Technology No-Vias Thru Hole Vias Buried Vias Blind Vias Thru Hole & Blind Vias] Thru Hole & Buried Via
39、s Thru Hole Buried & Blind Vias Buried & Blind Vias Other: D Laminate Material Phenolic Epoxy Paper Epoxy Glass Modified Epoxy Composite Polyimide Film & Reinforce Cynanate Ester Teflon Ceramic Glass Types Various Combinations Other: Rogers;
40、Alumimum Based E Core Material No Core Polymer Copper Aluminum Graphite Copper Invar/Copper Copper Moly/Copper Other: FR-4 F Copper Thickness (Oz.) 1/8 Minimum 1/4 Minimum 3/8 Minimum 1/2 Nominal 1 Nominal 2 Nominal 3-5
41、 Max 6-9 Max >10 Other: G Construction £4 Planes >4 Planes THK to TOL £0.2 mm THK to TOL >0.2 mm Bow/Twist £1% Bow/Twist >1% £0.3 mm Pro 0.3 mm Pro Other: max 24 layers max 0.7% H Coatings and Markings £0.1 mm Mask Cleara
42、nce >0.1 mm Mask Clearance One Side (Legend) Two Side (Legend) None (Legend) UL Material Logo U.L. V0 Logo U.L. V1 Logo U.L. V2 Logo Other: SECTION 2.4 PRODUCT COMPLEXITY DATE COMPLETED This section is intended to provide overview information
43、 on product complexity being fabricated by the manufacturer. (Please check the column that applies farthest to the right) Designators Remarks A Board Size Diagonal <250 [10.00] 250 [10.00] 350 [14.00] 450[17.50] 550 [21.50] 650 [25.50] 750 [29.50] 850
44、 [33.50] >850 [33.50] Other: 771.8mm (457x622mm) B Total Board Thickness 1,0 [.040] 1,0 [.040] 1,6 [.060] 2,0 [.080] 2,5 [.100] 3,5 [.135] 5,0 [.200] 6,5 [.250] >6,5 [.250] Other: C Number Conductive Layers 1-4 5-6
45、 7-8 9-12 13-16 17-20 21-24 25-28 >28 Other: D Dia Drilled Holes >0,5 [.020] 0,5 [.020] 0,4 [.016] 0,35 [.014] 0,30 [.012] 0,25 [.010] 0,20 [.008] 0,15 [.006] <0,15 [.006] Other: min drill bit size 0.15mm E
46、 Total PTH TOL (Max-Min) >0,250 [.010] 0,250 [.010] 0,200 [.008] 0,150 [.006] 0,125 [.005] 0,100 [.004] 0,075 [.003] 0,050 [.002] <0,050 [.002] Other: +/-0.075mm (standard) +/-0.05 mm (advanced) F Hole Location TOL DTP >0,50 [.020] 0,50 [.020]
47、0,40 [.016] 0,30 [.012] 0,25 [.010] 0,20 [.008] 0,15 [.006] 0,10 [.004] <0,10 [.004] Other: +/-0.075mm G Internal Layer Clearance (Min) >0,350 [.014] 0,350 [.014] 0,250 [.010] 0,200 [.008] 0,150 [.005] 0,125 [.005] 0,100 [.004] 0,075 [
48、003] <0,075 [.003] Other: >=6-layer 4-layer H Internal Layer Conductor Width (Min) >0,250 [.010] 0,250 [.010] 0,200 [.008] 0,150 [.006] 0,125 [.005] 0,100 [.004] 0,075 [.003] 0,050 [.002] <0,050 [.002] Other: J Interna
49、l Layer Process Allowance >0,100 [.004] 0,100 [.004] 0,075 [.003] 0,050 [.002] 0,040 [.0015] 0,030 [.0012] 0,025 [.001] 0,020 [.0008] <0,020 [.0008] Other: K External Layer Clearance (Min) >0,350 [.014] 0,350 [.014] 0,250 [.010] 0,200 [.
50、008] 0,150 [.006] 0,125 [.005] 0,100 [.004] 0,075 [.003] <0,075 [.003] Other: L External Layer Conductor Width (Min) >0,250 [.010] 0,250 [.010] 0,200 [.008] 0,150 [.006] 0,125 [.005] 0,100 [.004] 0,075 [.003] 0,050 [.002] <0,050 [.0
©2010-2026 宁波自信网络信息技术有限公司 版权所有
客服电话：0574-28810668 投诉电话：18658249818
浙ICP备2021020529号-1 | 浙B2-20240490
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