资源描述
IPC-1710A
OEM Standard for Printed Board Manufacturers' Qualification Profile
Developed by the OEM council of the IPC, the MQP sets the standard for assessing PWB manufacturers capabilities and allows PWB manufacturers to more easily satisfy customer requirements.
IPC-1710A
May 2004 A standard developed by IPC
____________________________________________________________________________________________
2215 Sanders Rd, Northbrook, IL 60062-6135
Tel. 847.509.9700 Fax 847.509.9798
NOTICE
IPC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or non-member of IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the OEM Council of the Institute for Interconnecting and Packaging Electronic Circuits.
Ó Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions.
FOREWORD
It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closer to meeting each others needs.
ACKNOWLEDGMENTS
The IPC is indebted to the members of the OEM council who participated in the development of this document. A note of thanks is also expressed to the members of the IPC Presidents Council for their review and critique and construction recommendations in finalizing the principles developed for the MQP.
Although the IPC is grateful for all the involvement and individual contributions made in completing the MQP a special acknowledgment is extended to the following individuals. It was their dedication and foresight that made this publication possible.
Rudolfo Archbold
Digital Equipment Corp
Rick Iantaffi
Northern Telecom
Don Noel
Harris Corp. - Computer Sys. Div
Mario Suarez-Solis
Encore Computer Corp.
Patrick Bernardi
IBM
Sue Jones
Wilcox Electric
Rick Smith
Compaq Computer Corp.
Gordon Wolfram
Raytheon Company
Vernon Brown
Motorola, Inc.
Chuck Krzesicki
Honeywell Avionics Division
Peter Solecky
IBM
Jerald G. Rosser
Hughes Missile Operations Div.
Don Holt
Texas Instruments
Thomas Kurtz
Hughes Defense Communications
Joseph F. Sterba
Honeywell, Inc.
Jamie Zanios
Wellborn Industries Ltd.
CONTENTS
Sections: Pages:
1.1 Company Description 1
1.2 Site Description 2
2.1 Process 3-4
2.2 Electrical Test Equipment 5-7
2.3 Product Type 8-10
2.4 Product Complexity 11-14
2.5 Quality Development 15-16
3.0 Equipment Pro
Master Equipment Listing 22
4.0 Technology Pro 23-30
5.0 Quality Pro
6.0 Manufacturing History 42
7.0 Identification of Previous Audits 43
8.0 Financial Review 44
9.0 MQP Electronic Editing 45
SECTION 1.1
DATE COMPLETED
2006/5/16
COMPANY DESCRIPTION
GENERAL INFORMATION
LEGAL NAME
PHYSICAL ADDRESS
CITY
STATE
ZIP
PROVINCE
COUNTRY
China
TELEPHONE NUMBER
FAX NUMBER
TELEX NUMBER
E-MAIL ADDRESS
MODEM NUMBER
DATE FOUNDED
PUBLIC PRIVATE
INTERNET URL
MANAGEMENT
PRESIDENT
CHIEF OPERATING OFFICER
VICE PRESIDENT OF MANUFACTURING
VICE PRESIDENT OF QUALITY
VICE PRESIDENT OF MARKETING/SALES
VICE PRESIDENT OF CUSTOMER SERVICE
WASTE TREATMENT MANAGER (POLLUTION PREVENTION)
CORPORATE
NUMBER OF EMPLOYEES
DESCRIPTION
CORPORATE
SITE
COMMENTS
DESIGN AND DEVELOPMENT
ENGINEERING
MANUFACTURING CONTROL
MANUFACTURING
DIRECT
INDIRECT
QUALITY
CONTROL
QUALITY ENGINEERS
INTERNAL AUDITORS
GENERAL MANAGEMENT
ADMINISTRATION
Other
TOTAL
SECTION 1.2 DATE COMPLETED 2006/5/16
SITE DESCRIPTION
(TO BE COMPLETED FOR EACH SITE)
ATTACH APPROPRIATE CHARTS (OPTIONAL)
MANUFACTURING FACILITY
COMPANY NAME
PHYSICAL ADDRESS
CITY
STATE
ZIP
PROVINCE
COUNTRY
TELEPHONE NUMBER 6-755-61615623
FAX NUMBER
TELEX
E-MAIL ADDRESS
MODEM NUMBER
YEARS IN BUSINESS
INTERNET URL
FTP
PRINCIPLE PRODUCTS/SERVICES/SPECIALTIES
BUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.)
FACILITY MANAGEMENT
TITLE
REPORTS TO (Function/Job Title)
OVERALL OPERATION RESPONSIBILITY FOR THIS SITE
MANUFACTURING
TECHNICAL/ENGINEERING
MATERIALS/PRODUCTION CONTROL
PURCHASING
QUALITY
SALES REPRESENTATIVE
WASTE MANAGEMENT
BUILDINGS
SYSTEMS (INDICATE % COVERAGE)
AGE
AREA
(Sq. Ft.)
Construction (Wood/Brick)
Power
Conditioning
Heating
Ventilation
Air Conditioning
Sprinklers
Waste Treatment
Other
Office
Manufacturing
Storage
Planned additions
SAFETY AND REGULATORY AGENCY REQUIREMENTS
Are fire extinguishers functional and
accessible to employees?
YES
NO
What is the distance to the nearest fire station? (in minutes)
20 Minutes
Do you conform to local/federal environ-
ment protection agency requirements?
YES
NO
Date of last OSHA visit
Date of last EPA visit
4/10/2006
5/9/2006
Are you currently operating under a waiver
or in violation of local government requirements?
YES
NO
Other Agency Audits, UL,
ISO 9000, NECQ, CSA Approval
and Number
UL # E232940
CSA #
ISO 9001# 2000
Other
Do you have a safety program?
Describe below.
YES
NO
Hazardous Waste Number
Trade Waste Account Number
3
PLANT PERSONNEL (TOTAL EMPLOYEES)
Regular
Contract
Office
Technical/
Engineering
Production
Full-Time
QA
Part-Time
QA
Union
Non-
Union
Union
Name
Contract Expires (Date)
COMMENTS
SECTION 2.1
PROCESS
DATE COMPLETED
This section is intended to provide overview information on the processes used to fabricate printed board products.
Site Capability Snapshot (Please Check all that apply)
Designators
Remarks
A
Conductor Forming Processes
Subtractive
Thin Foil Subtractive less than .5 oz.
Semi-Additive
Additive (Electro-less)
Black Hole
Thick Film Paste and Fire
Thin Film Semi-conductor Sputtering
Other: PTHàpanel platingàD/F-àpattern plating-àETch
B
PTH Materials and Processes
Acid Copper
Pyro-Phosphate Copper
Full Built Electro-Less
Gold Paste
Copper Paste
Gold Conductor Sputtering
Nickel Conductor Sputtering
Other:
C
Permanent Over-plating
Tin
Tin-Lead
Tin-Nickel Alloy
Nickel
Nickel Gold (Hard)
Nickel Gold (Soft)
Nickel Rhodium
Conductive Polymer
Other:
D
Permanent Selective Plating
Tin
Tin-Lead
Tin-Nickel Alloy
Nickel
Nickel Gold (Hard)
Nickel Gold (Soft)
Nickel Rhodium
Other:
E
Permanent Mask or Coating
Photo Dry Film
Photo Liquid
Image Transfer Screen Mask
Conformal Coating Solder Mask
Cover Coat
Other:
F
Other Surface Finishes
Tin-Lead Fused
Immersion Tin
Solder Leveled
Roll Soldered
Electro-less Solder Fused
Solder Bumped Lands
Solder Paste Fused
Azole Organic Protective Covering
Flux Protective Covering
Other: Flash gold; lead free HAL; Immersion Silver
SECTION 2.2
ELECTRICAL TEST EQUIPMENT
DATE COMPLETED
5/16/2006
This section is intended to provide overview information on the test equipment and testing capability of the manufacturer.
Site Capability Snapshot (Please Check the column that applies furthest to the right.)
Designators
Remarks
A
Number of Nets
<200
200
500
1000
2000
3000
4000
5000
>5000
Other:
B
Number of Nodes
<500
500
1000
2000
3000
4000
5000
6000
>6000
Other:
C
Probe Point Pitch
>1.0 [.040]
1.0 [.040]
0.8 [.032]
0.65 [.025]
0.50 [.020]
0.40 [.016]
0.30 [.012]
0.20 [.008]
<0.20 [.008]
Other:
D
Test % Single Pass
None
<60%
60%
70%
80%
90%
95%
99%
100%
Other:
E
Probe Accuracy (DTP)
>0.2 [.008]
0.2 [.008]
0.15 [.006]
0.125 [.005]
0.1 [.004]
0.075 [.003]
<0.075 [.003]
Other:
F
Grid Density
Single Side Grid
Double Sided Grid
Double Density Grid
Double Density Double Sided
Quad Density
Double Sided Quad Density
Flying Probe
Other:
G
Netlist Capability
Golden Board
IPC-D-356
Net List Extraction
CAD/CAM Net List Compare
Other:
H
Test Voltage
<20 VDC
20 VDC
40 VDC
60 VDC
80 VDC
100 VDC
500 VDC
1000 VDC
>1000 VDC
Other:
250V
J
Impedance Meas
Micro Section
Inboard Circuit
Coupon
Manual TDR
Automated TDR
Other:
K
Impedance Tolerance
None
>20%
20%
15%
10%
7%
5%
2%
<2%
Other:
Standard
Advanced
SECTION 2.3
PRODUCT TYPE
DATE COMPLETED
5/16/2006
This section is intended to provide overview information on the printed board product types being fabricated by the manufacturer.
Site Capability Snapshot (Please Check all that apply.)
Designators
Remarks
A
Product Type
Rigid Printed Board
Flex Printed Board
Rigid/Flex Board
Rigid Back Plane
Molded Product
Ceramic Printed Board
Multichip Module
Liminated Multichip Module
Deposited Dielectric Multichip Modules
Other:
B
Circuit Mounting Type
Single Sided
Double Sided
Miltilayer
Single-sided Bonded to Substrate
Double-sided Bonded to Substrate
Multilayer Bonded to Substrate
Constrained Multilayer
Distributed Plane Multilayer
Other:
C
Via Technology
No-Vias
Thru Hole Vias
Buried Vias
Blind Vias
Thru Hole & Blind Vias]
Thru Hole & Buried Vias
Thru Hole Buried & Blind Vias
Buried & Blind Vias
Other:
D
Laminate Material
Phenolic
Epoxy Paper
Epoxy Glass
Modified Epoxy Composite
Polyimide Film & Reinforce
Cynanate Ester
Teflon
Ceramic Glass Types
Various Combinations
Other: Rogers; Alumimum Based
E
Core Material
No Core
Polymer
Copper
Aluminum
Graphite
Copper Invar/Copper
Copper Moly/Copper
Other: FR-4
F
Copper Thickness (Oz.)
1/8 Minimum
1/4 Minimum
3/8 Minimum
1/2 Nominal
1 Nominal
2 Nominal
3-5 Max
6-9 Max
>10
Other:
G
Construction
£4 Planes
>4 Planes
THK to TOL £0.2 mm
THK to TOL >0.2 mm
Bow/Twist £1%
Bow/Twist >1%
£0.3 mm Pro
0.3 mm Pro
Other:
max 24 layers
max 0.7%
H
Coatings and Markings
£0.1 mm Mask Clearance
>0.1 mm Mask Clearance
One Side (Legend)
Two Side (Legend)
None (Legend)
UL Material Logo
U.L. V0 Logo
U.L. V1 Logo
U.L. V2 Logo
Other:
SECTION 2.4
PRODUCT COMPLEXITY
DATE COMPLETED
This section is intended to provide overview information on product complexity being fabricated by the manufacturer.
(Please check the column that applies farthest to the right)
Designators
Remarks
A
Board Size Diagonal
<250 [10.00]
250 [10.00]
350 [14.00]
450[17.50]
550 [21.50]
650 [25.50]
750 [29.50]
850 [33.50]
>850 [33.50]
Other:
771.8mm (457x622mm)
B
Total Board Thickness
1,0 [.040]
1,0 [.040]
1,6 [.060]
2,0 [.080]
2,5 [.100]
3,5 [.135]
5,0 [.200]
6,5 [.250]
>6,5 [.250]
Other:
C
Number Conductive Layers
1-4
5-6
7-8
9-12
13-16
17-20
21-24
25-28
>28
Other:
D
Dia Drilled Holes
>0,5 [.020]
0,5 [.020]
0,4 [.016]
0,35 [.014]
0,30 [.012]
0,25 [.010]
0,20 [.008]
0,15 [.006]
<0,15 [.006]
Other:
min drill bit size 0.15mm
E
Total PTH TOL (Max-Min)
>0,250 [.010]
0,250 [.010]
0,200 [.008]
0,150 [.006]
0,125 [.005]
0,100 [.004]
0,075 [.003]
0,050 [.002]
<0,050 [.002]
Other:
+/-0.075mm (standard)
+/-0.05 mm (advanced)
F
Hole Location TOL DTP
>0,50 [.020]
0,50 [.020]
0,40 [.016]
0,30 [.012]
0,25 [.010]
0,20 [.008]
0,15 [.006]
0,10 [.004]
<0,10 [.004]
Other:
+/-0.075mm
G
Internal Layer Clearance (Min)
>0,350 [.014]
0,350 [.014]
0,250 [.010]
0,200 [.008]
0,150 [.005]
0,125 [.005]
0,100 [.004]
0,075 [.003]
<0,075 [.003]
Other:
>=6-layer
4-layer
H
Internal Layer Conductor Width (Min)
>0,250 [.010]
0,250 [.010]
0,200 [.008]
0,150 [.006]
0,125 [.005]
0,100 [.004]
0,075 [.003]
0,050 [.002]
<0,050 [.002]
Other:
J
Internal Layer Process Allowance
>0,100 [.004]
0,100 [.004]
0,075 [.003]
0,050 [.002]
0,040 [.0015]
0,030 [.0012]
0,025 [.001]
0,020 [.0008]
<0,020 [.0008]
Other:
K
External Layer Clearance (Min)
>0,350 [.014]
0,350 [.014]
0,250 [.010]
0,200 [.008]
0,150 [.006]
0,125 [.005]
0,100 [.004]
0,075 [.003]
<0,075 [.003]
Other:
L
External Layer Conductor Width (Min)
>0,250 [.010]
0,250 [.010]
0,200 [.008]
0,150 [.006]
0,125 [.005]
0,100 [.004]
0,075 [.003]
0,050 [.002]
<0,050 [.0
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