工程英文确认常用词及常用语句.doc

工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总厚度公差线路层孔层阻焊层字符层外形层叠层单词1. 附件：attached 2. 样品：sample3. 认可：approval4. 答复：answer;reply5. 规格：spec6. 与.同样的：the same as 7. 前版本：previous version(old version)8. 生产：production9. 确认：confirm10. 再次确认：double confirm11. 工程问题：engineering query（EQ）12. 尽快：ASAP(as soon as possible)13. 生产文献：production gerber14. 联系某人：contact somebody15. 提交样板：submit sample16. 交货期：delivery date17. 电测成本：ET（electrical test） cost18. 通断测试：Open and short testing19. 参考：refer to20. IPC标准：IPC standard21. IPC二级：IPC class 222. 可接受的：acceptable23. 允许：permit24. 制造：manufacture25. 修改：revision26. 公差：tolerance27. 忽略：ignore(omit)28. 工具孔：tooling hole29. 安装孔：mounting hole30. 元件孔：component hole31. 槽孔：slot32. 邮票孔：snap off hole33. 导通孔：via34. 盲孔： blind via35. 埋孔：buried via36. 金属化孔：PTH(plating through hole)37. 非金属化孔：NPTH( no plating through hole)38. 孔位：hole location39. 避免：avoid40. 原设计：original design41. 修改：modify42. 按原设计：leave it as it is43. 附边：waste tab44. 铜条：copper strip45. 拼板强度：panel strong46. 板厚：board thickness47. 删除：remove(delete)48. 削铜：shave the copper49. 露铜：copper exposure50. 光标点：fiducial mark51. 不同：be different from(differ from)52. 内弧：inside radius53. 焊环：annular ring54. 单板尺寸：single size55. 拼板尺寸：panel size56. 铣：routing57. 铣刀：router58. V-cut：scoring59. 哑光：matt60. 光亮的：glossy61. 锡珠：solder ball(solder plugs)62. 阻焊：solder mask(solder resist)63. 阻焊开窗：solder mask opening64. 单面开窗：single side mask opening65. 补油：touch up solder mask66. 补线：track welds67. 毛刺：burrs68. 去毛刺：deburr69. 镀层厚度：plating thickness70. 清洁度：cleanliness71. 离子污染：ionic contamination72. 阻燃性：flammability retardant73. 黑化：black oxidation74. 棕化：brown oxidation75. 红化：red oxidation76. 可焊性：solderability77. 焊料：solder78. 包装：packaging79. 角标：corner mark80. 特性阻抗：characteristic impedance81. 正像：positive82. 负片：negative83. 镜像：mirror84. 线宽：conductor width85. 线距：conductor spacing86. 做样：build sample87. 按照：as per88. 成品：finished89. 做变更：make the change90. 相类似：similar to91. 规格：specification92. 下移：shift down93. 垂直地：vertically94. 水平的：horizontally95. 增大：increase96. 缩小：decrease97. 表面解决：Surface Finishing98. 波峰焊：wave solder99. 钻孔数据：drilling date100. 标记：Logo101. Ul 标记：Ul Marking102. 蚀刻标记：etched marking103. 周期：date code104. 翘曲：bow and twist105. 外层：outer layer106. 内层：internal layer107. 顶层：top layer108. 底层：bottom layer109. 元件面：component side110. 焊接面：solder side111. 阻焊层：solder mask layer112. 丝印层：legend layer (silkscreen layer or over layer)113. 兰胶层：peelable SM layer114. 贴片层：paste mask layer115. 碳油层：carbon layer116. 外形层：outline layer(profile layer)117. 白油：white ink118. 绿油：green ink119. 喷锡：hot air leveling (HAL)120. 水金：flash gold121. 插头镀金：plated gold edge-board contacts122. 金手指：Gold-finger123. 防氧化：Entek(OSP)124. 沉金：Immersion gold (chem. Gold)125. 沉锡：Immersion Tin(chem.Tin)126. 沉银：Immersion Silver (chem. silver)127. 单面板：single sided board128. 双面板：double sided board129. 多层板：multilayer board130. 刚性板：rigid board131. 挠性板：flexible board132. 刚挠板：flex-rigid board133. 铣：CNC (mill , routing)134. 冲：punching135. 倒角：beveling 136. 倒斜角：chamfer137. 倒圆角：fillet138. 尺寸：dimension139. 材料：material140. 介电常数：Dielectric constant141. 菲林：film142. 成像：Imaging143. 板镀：Panel Plating144. 图镀：Pattern Plating145. 后清洗：Final Cleaning146. 叠层：layup (stack-up)147. 污染焊盘：contaminate pad148. 分孔图：drill chart149. 度数：degree150. 被覆盖：be covered with151. 负公差：minus tolerance152. 标靶盘： target pad153. 外形公差：routing tolerance154. 芯板：core常用语句、厚度1. 规定孔内铜厚0.001太紧对我们的生产，建议按IPC二级0.0008。The copper thickness of the wall of the plated-through holes is specified 0.001. Its too tight for our production. We suggest as per IPC class 2.thats to say ,Its 0.0008 .2.规定金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.3.建议所规定的铜厚2OZ为成品铜厚，并且我们将用基铜1.5OZ电镀到2OZ。The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production. 4.规定锡厚为0.0005-0.003，我们做不到这么厚，建议按IPC二级，即保证可焊性，The solder thickness is required to plated 0.0005-0.003 ,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability. 二、公差1. XXX.的尺寸公差为+/-0.005，这规定是太紧对我们生产，建议公差放松到+/-0.008。The tolerance of dimension is specified XXX.+/-0.005 .It is tight for our production .We suggest +/-0.008 instead。2.在*.pdf文献中规定外形公差为+/-0.005，建议按IPC 二级+/-0.01代替。The profile tolerance is specified +/-0.005 in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01.3. 在叠层图中规定板厚公差为+/-0.007，而notes 1中规定板厚公差为+/-0.005，他们是不同的，建议0.062+/-0.007是可接受的，由于+/-0.005对我们来说太难控制了。The tolerance of the board thickness is specified +/-0.007 in layup detail which is different form NOTES 1 +/-0.005.We suggest 0.062+/-0.007 is acceptable for +/-0.005 is very tough for us to control.4.外形公差规定+/-0.1mm，这超过了我们生产，建议按+/-0.2mm控制。The tolerance of the outline is specified +/-0.1mm.Its above us.We suggest +/-0.2mm instead.5. v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。The remain tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。The tolerance of the hole position is specified 0.05mm. Its too tight for us, We suggest +/-0.076mm instead.7. 角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5度。The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.8.在1MB5476-01.pdf文献中规定孔到板中心的公差是+/-0.05mm，这是太紧对我们，建议安IPC二级。It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is too tight for us ,we suggest as per IPC class 2 .9.规定线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.10.3.0的孔径公差规定+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.三、线路层1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broken is permitable.2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。The copper pad extend to the board outline, it will lead to copper exposed if we follow Gerber to do,We suggest copper exposed is acceptable.4.有三个盘离v-cut 线很近将会引起露铜，建议削焊盘0.4mm避免露铜。The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达成0.2mm.The copper grids on bottom side is only 0.178mm in some places,we can not do it per this gap,so we suggest decreasing the tracewidth to make copper grids to 0.2mm.6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.7.建议加在顶层空白区域加些铜以提高电镀质量。We suggest putting some copper in blank area on top side to improve plated quality.8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.9. 两个光标点处在v-cut线上，它们将被削到，我们建议向左边移1.0mm。The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔层1. 两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.2这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them NPTH.3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们建议做PTH孔。The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .4. 直径0.11“的孔相应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM ，请确认The hole with dia.0.11 have pad which is larger than the hole in top and bottom copper layer .But its specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diameter 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.7.有两个0.991、0.762重叠在一起，建议保存一个0.991mm的孔。There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only dia.0.991mm remain there.8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文献中孔数是290，请确认孔数是290而不是291。The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.9.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slots in the gerber file ,we suggest as per gerber file.10.由于铣外形没有定位孔，我们建议附边加四个2.0mm孔。As no located holes for our routing,we suggest four additional holes with dia.2.0mmin waste tab.五、阻焊层1在字符J3处，一些0.065 inch & 0.0461 inch的孔两面没有开窗，未避免阻焊污染焊盘，在对孔双面加开窗。On the location of J3,some holes of diameter 0.065 inch & 0.0461 inch have not mask opening on both sides, we would like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides.2.这些焊盘仅TOP面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM面也加上与TOP面等大的阻焊开窗These pads have single side mask opening on the top side , we suggest extra maskopening on the bottom side with same size as pads to avoid mask onto pad.3.我们发现6个直径0.8MM的孔双面没有阻焊开窗，我们认为它们应为元件孔，建议双面加直径1.75MM的阻焊开窗。We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on both sides.4.我们发现单板内有些光标点没开窗，这点我们应当按原设计吗？We found some fiducials without mask opening in the unit.Should we following the original design?5.锡珠，小挡点根据原设计多数过孔没有开窗，它们也没有堵孔规定，在我们生产过程中，由于孔内没充满绿油锡将会流进这些孔内，为此我们有三种建议：建议1：允许部分过孔孔内有锡珠。建议2：若不批准建议1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分锡环。建议3：若不批准以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增长成本和增长制程时间，对我们来说这种是最不利的选择。我们希望你能选择建议1或建议2。Most vias have no solder mask opening as per original design and no vias-plugged request .During our process, the solder will flow into the vias ,for they arent filled with solder resist completely.So our suggestion have three:suggestion1 :Solder ball in partial vias is permitted.Pls confirm.suggestion2: If you dont agree with our suggestion 1, we would like to put an opening with a size little larger than holes on both side .In this way,the wall of the vias will have no any solder resist ,one partial pads will be soldered and the other will be covered with solder resist.Pls confirm.suggestion3: If you dont agree with above two,we will have to plug those vias which have no opening on both side with solder resist . But it will increase our production cost and cause lead-time much. It is the worst way for us.We would like to hope you could choose our suggestion 1or 2.9. 过孔规定堵孔，但一些过孔顶层有开窗，建议保存过孔开窗且对0.46mm的过孔堵孔。The via is specified to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept. 12. 根据原设计光标点开窗压到周边的些线或盘，建议削光标点开窗，避免露线。In the borad ,some soldermask opening of fiducial marks cover the nearby traces or pads on top side per original design. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .14. 开窗与线路盘现状不同，我们应当修改开窗使按键处所有上金还是依据原设计制作？The solder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold completely , or we will follow Gerber to do . 15. 能我们使用太阳PSR 2023油墨代替太阳PSR 4000油墨？由于我们没有这类型的油墨。Can we use the solder-mask type with TAYO ink PSR 2023 instead of TAYO ink PSR 4000 H85?because we have not this type 六、字符层1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，假如需要丝印字符，我们建议删去上焊盘的字符。Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去上焊盘的白油，请确认。There is white ink on the top pads per original design, We suggest shaving the white ink in case of they contaminate pads. Pls confirm.3.一些字符靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say the defective legends is permittable.4.GERBER文献没有发现丝印层，因此建议此板没有字符，假如需要丝印字符，请将字符文献发给我们。We didnt find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us the file.5.在U1和U5区域，两个IC焊盘的间距只有0.3MM ，假如按原设计制作，白油会污染焊盘，要不白油做少许更改，白油上焊盘是允许的。In U1 & U5 area the gap between two IC pads is only 0.3mm and the white ink will contaminate pads if we follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示The notation just lie on the large solder pad per original design , if need us to shave ink to avoid ink contaminate the solder pad or need us to follow gerber to do? please advise.7. 所有底层字符都没镜像，建议没有底层字符或假如要做出他们需要镜像，请提出你的建议。All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we need to do them.Pls advise.8在GM4层有些字符，我们忽略它们或是加到顶层？There are some legends on the GM4,should we omit them or put them on top side silkscreen?9.由于单元比较小，没有足够的空间加我们的UL标志及周期在每个单元内，我们只能丝印我们的UL标志及周期在附边。As the unit is so small ,there is no large enough bare space to add our UL logo and date code in each unit we have to add our UL logo and date code on the