喷锡沉银沉锡培训资料.pptx

单单面面板板双双面面板板多多层层板板硬硬板板软软硬硬板板通通孔孔板板埋埋孔孔板板盲盲孔孔板板硬度性能硬度性能PCBPCB分类分类孔的导通状态孔的导通状态表面制作表面制作结构结构沉沉锡锡板板软软板板印制电路板概述印制电路板概述PCB（线路板）是用来承载电子元件，提供电路联接各元件的母版。喷喷锡锡板板镀镀金金板板沉沉金金板板E EN NT TE EK K板板碳碳油油板板金金手手指指板板沉沉银银板板喷锡工序简介通过热风整平，使线路板表面焊盘（或孔壁）附上一层平整的铅锡层，以利于焊接电子元件工序流程图：上板NPS微蚀水洗DI水洗烘干预热上助焊剂浸锡热风整平风冷热DI水洗刷磨CE2263清洗热DI水洗干板收板1、微蚀：线路板通过NPS溶液后其表面的油迹、氧化物及部分铜被蚀掉，铜表面活性增强，便于上锡。2、预热：线路板通过预热机预热，以防锡炉锡温降低而影响热风整平，其控制因素为输送速度。线路板通过预热机后板面温度可达60-1603、上助焊剂：助焊剂主要作用是使铜面较易上锡，助焊剂上板面要求均匀，适量。4、浸锡及热风整平：线路板从锡液中经过后，附有助焊剂的干洁铜面与熔融的锡液产生很好的附着力，并形成介面合金共化物(Cu6Sn5)，再经过上、下风刀的热风整平，吹去孔里和板面多余的铅锡，得到良好的可焊性。锡面要求平整，光亮，厚度适当。5、风冷：线路板通过风垫机时，板面温度均匀降低，线路板被风垫托起，避免柔软的板面接触硬物，影响锡面表观。喷锡喷锡(待喷锡存放及取板待喷锡存放及取板)HASL)HASLStoring before HASL项目 tem 要求requirement戴手套wear glove必须needL架放板数量Panel quantity on L table100块Less than 100 pnls垫胶片Underlay the filmNA使用工具toolingKT60车KT60 car注意notice：1.L架上的板只能竖立放板Put the panel upright on the L table2.L架边沿至少保留1CM空位 hold 1cm space at less on the edge of the L table HASL 1喷锡基本操作规范及生产参数1、基本操作规范：项目item要求requirement戴手套wear glove必须needL架放板数量panel quantity on the L table100块Less than 100 pnls垫胶片underlaying the filmNA使用工具toolingKT60车,自动放板机KT60 car,automatism loading m/c注意notice：拉板车的滚槽与磨板机入口的皮带对齐后将L架轻推到放板机接板皮带上 Push the L table to the strap of the loading m/c after the car and the entrance of the scrubing m/c is touch in the right way.喷锡（上板）喷锡（上板）Loading for HASLHASL 2项目item要求requirement戴手套wear gloveNAL架放板数量Panel quantity on L table100块Less than 100pnls垫胶片Underlay the film必须need使用工具toolingNA注意notice：手戴手套取板将板从前处理出板段放入生产拉Put down the panel from the entrance of the pre-treatment r machine,wear the glove when operanting.喷锡（返喷）喷锡（返喷）Loading for rework of HASLHASL 3项目item要求requirement戴手套wear glove必须need使用工具tooling红胶纸Red glue paper注意notice：必须双手持板，问题板用红胶纸指出Hold panel with both hands and poin out the defect panel with red glue paper喷锡（随拉抽检）喷锡（随拉抽检）In-line visual inspection before unloadingHASL 4项目item要求requirement戴手套wear glove需要need L架放板数量panel quantity on the L table100 pnlsLess than 100 pnls使用工具toolingKT60车KT60 car注意notice:1.喷锡后所有板必须隔胶片Underlay the film for all the panels after HASL.喷锡（收板）喷锡（收板）Unloading after HASLHASL 5喷锡（出货暂存及出板）喷锡（出货暂存及出板）Storing after HASL/Transferring to next process项目item要求requirement戴手套wear glove需要needL架放板数量 panel quantity of L table100pnlsLess than 100 pnls使用工具toolingKT60车 KT60car注意notice：1.用KT60运板车出板；2.所有板必须隔胶片；HASL 62、生产参数：流程flow控制参数control parameter控制范围control range前处理机pre-treatment machine前处理放板机放板速度 panel loading speed10-70NPS温度 NPS temperature 305热风温度 hot air temperature805NPS浓度 NPS concentration200250g/l微蚀率 micro-etching rate3570 inches微蚀压力 micro-etching pressure13 kg/cm2H2SO4浓度 H2SO4 concentration24%输送速度 convection speed3000-4000mm/min加压水洗 pressing rinse24 kg/cm2水柱水洗 water column rinse24 kg/cm2高压水洗压力high pressure rinse pressure1520 kg/cm2加压水洗 pressing rinse24 kg/cm2预热机pre-heat machine预热后板面温度Panel temperature after pre-heat60160IR输出 IR output46A转角机rotation machine旋转角度 Revolving angle080松香Flux machine松香桶液位 Flux wave level3050%水平机HASL machine上，下风箱温度Upper&down bellows temperature400500上，下风刀温度Upper&down air knives temperature190260上风刀压力 Upper air knife pressure1230 psi下风刀压力 Down air knife pressure1230 psi锡缸温度 Sn tank temperature240260锡液位 Sn water level5.006.00 inches锡泵转速 Sn pump rotate speed59 M/min上风刀角度 Upper air knife angle25下风刀角度Down air knife angle26下风刀距板面 The space of the down air knife and panel0.81.4 mm括锡片距板Space from the panel to the drawing piece0.51.0 mm上下风刀距离the space of upper air knife and the down one 1.55.5 mm后处理机Post-treatment machine后处理自动收板机收板速度 automatic unloading machines speed1070热水洗温控 hot water rinse temperature control532 C洗松香温控 flux rinse temperature control33 5C热水洗压力 hot water rinse pressure0.51.5 kg/cm21#加压DI水洗温控 1#pressurized DI WR/S temperature control532 C2#加压DI水洗温控 2#pressurized DI WR/S temperature control532 C加压水洗压力 pressurized DI WR/S pressure24 kg/cm2水柱水洗压力 jet WR/S pressure24 kg/cm2洗松香段压力 Flux rinse pressure13 kg/cm2高压水洗 high pressure rinse1520 kg/cm2DI水电导率 DI water conductance3L/Min磨刷压力电流 electricity of brush pressure1.00.5A输送速度 convey speed45005500 mm/min热风温度 hot air temperature805C沉银工序简介：沉银是制造线路板的一个最后表面处理工序，主要用途是在线路板的铜面上浸置一层薄银。沉银主要是根据化学电流的原理，因银与铜之间的电位差距，使铜与银能进行自发性的置换。工序流程图：入板除油水洗微蚀水洗检查预浸沉银出板烘干热水洗水洗后清洁水洗水洗1、除油：除去板面上的油污；2、微蚀：去除铜面上氧化物，使镀层与铜面结合力更好；3、预浸：去除氧化层及板面残物；4、沉银：在铜面上沉上一层薄银；5、后清洁：清洗沉银后板面残物；沉银基本操作规范及生产参数：1、基本操作规范：待做沉银待做沉银/抗氧化抗氧化Pending for Entek/Immersion Silver项目(Item)要求(Requirement)戴手套(Glove)NA叠板高度(StackHigh)低于盆的边沿1Belowthebasin1使用工具(ToolingUsing)蓝色存板盆(BlueBasin)其它：（Others)1.将即将过沉银/ENTEK的板手动放置于放板平台上1.MovingtheboardsfromEntekstoreareatotheloadingtablewithtwohands2.板竖直放置；且每排20片或25片间用纸皮或光树脂板隔开；3.出货单元为11或12的板及板厚大于2mm的板放板时每块隔纸皮；4.出货尺寸大于12“12”需斜放在L型车上。SurfaceFinish-02沉银沉银/抗氧化拉放板抗氧化拉放板 Loading of Immersion Silver/Entek machine项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)使用工具(ToolingUsing)NA其它：（Others)1.放板时注意板间距，一般前后2”，左右应1”1.Thedistanceofeachboardmustbekept2”fronttobehindand1”lefttoright2.轻拿轻放，垂直方向取放板，禁止拖拉板SurfaceFinish-03沉银沉银/沉锡拉接板沉锡拉接板 Unloading of Immersion Silver/Tin machine 项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)使用工具(ToolingUsing)暂存架(Unloadingtable)其它：（Others)1.收板时按同一方向竖直方向放在盆内，如错开放置则每25片隔一张无硫纸。2.出货单元为11或12，或板厚大于2mm的需每块板之间隔无硫纸。3.出货尺寸大于12“12”需斜放在L型车上SurfaceFinish-07沉银沉银/锡板检查后存放锡板检查后存放Storage of Immersion Silver/Tin After Inspection项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)叠板高度(StackHigh)低于盆边沿1Belowthebasin1使用工具(ToolingUsing)手推车(handcart)其它：（Others)1.板竖直放置；且每排20片或25片间用纸皮或光树脂板隔开；2.出货单元为11或12的板及板厚大于2mm的板放板时每块隔纸皮。3.出货尺寸大于12“12”需斜放在L型车上。SurfaceFinish-092、生产参数缸号Tank No.工序Procedure 控制项目Control items操作参数Operating parameter最佳值Optimum分析频率 Analysis frequency-入板Input 传输速度Transfer speed1.50.5m/min1.5 m/min每班一次Once per shift2酸性除油Acid cleaner FF Spray Cleaner(75040)浓度FF Spray Cleaner(75040)concentration8-12%10%每日一次Once per day温度Temperature3849C43C每班一次Once per shift含铜量Copper content 1000mg/L 1000mg/L每周一次Once per week喷淋压力Spray pressure21kg/cm22kg/cm2每班一次Once per shift过滤压力Filtrate pressure5-20Psi/每班一次Once per shift4微蚀Micro etching FF Surface Prep Part A(76909)浓度FF Surface Prep Part A(76909)concentration90-150g/L120 g/L每班一次Once per shift纯硫酸Pure sulfuric acid2-10%/每班一次Once per shift含铜量Copper content5-15g/L/每日一次Once per day温度Temperature32-42C37C每班一次Once per shift微蚀速率Etch rate30-5040每班一次Once per shift过滤压力Filtrate pressure5-20Psi/每班一次Once per shift7预浸Sterling pre-dipping 螯合物Chelator Molarity0.01-0.02M0.015M每班一次Once per shift酸含量Acid Normality0.1-0.2N0.15N每班一次Once per shift铜含量Copper1000mg/L/每周一次Once per shift温度Temperature32-43C38C每班一次Once per shift过滤压力Filtrate pressure5-20Psi/每班一次Once per shift8沉银Immersion silver 银含量Silver0.6-0.9 g/L0.75 g/L每班一次Once per shift螯合物Chelator Molarity0.02-0.04M0.03M每班一次Once per shift酸含量Acid Normality0.12-0.22N0.17N每班一次Once per shift铜离子Copper3000mg/L3000mg/L每周一次Once per shift温度Temperature50-54C52C每班一次Once per shift过滤压力Filtrate pressure5-20Psi/每班一次Once per shift11后清洁Post cleaning FF Post Cleaner(75077)浓度FF Post Cleaner(75077)concentration4.5-5.5%5%每日一次Once per day温度Temperature50-60C55C每班一次Once per shift喷淋压力Spray pressure21 kg/cm22kg/cm2每班一次Once per shift过滤压力Filtrate pressure0.03-0.13MPa/每班一次Once per shift13热水洗Hot DI rinse 温度Temperature55-65C60C每班一次Once per shift电导率Conductance20s20s每班一次Once per shift3,5,9,10,12水洗Rinse 电导率Conductance20s20s每班一次Once per shiftPH值PH value6-87每班一次Once per shift14烘干Drying 温度Temperature60-70C65C每班一次Once per shift沉锡工序简介沉锡是制造线路板的一个最后表面处理工序，主要用途是在线路板的铜面上浸置一层薄锡。工序流程及参数：入板除油水洗微蚀水洗预浸沉锡1沉锡2出板热水洗后清洁PH水洗1、除油：除去板面上的油污；2、微蚀：去除铜面上氧化物，使镀层与铜面结合力更好；3、预浸、沉锡1、沉锡2：在铜面上沉上一层薄锡；4、PH水洗：清洗锡面上的残留药水；5、后清洁：清洗板面残物；沉锡基本操作规范及生产参数：1、基本操作规范：沉锡拉上沉锡拉上/下板下板 Loading/Unloading of Immersion Tin machine项目（Item）要求（Requirement)戴手套(Glove)胶手套（plasticGlove)使用工具(ToolingUsing)NA其它：（Others)1.上板前调好挂篮卡槽的宽度与高度，上下板均要求一块块拿板；2.轻拿轻放，禁止一个卡槽内插两块板；3.插好板后将挂篮挂上天车吊臂；沉完锡的板待滴水时间足够后双手将挂篮从天车臂取下放于洗板机前。如为厚板需两人抬挂篮下板；SurfaceFinish-05沉锡水洗拉放板沉锡水洗拉放板 Loading of Immersion Silver/Entek machine项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)使用工具(ToolingUsing)NA其它：（Others)1.放板时注意板间距，一般前后2”，左右应1”1.Thedistanceofeachboardmustbekept2”fronttobehindand1”lefttoright2.轻拿轻放，垂直方向取放板，禁止拖拉板SurfaceFinish-06沉银沉银/沉锡拉接板沉锡拉接板 Unloading of Immersion Silver/Tin machine 项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)使用工具(ToolingUsing)暂存架(Unloadingtable)其它：（Others)1.收板时按同一方向竖直方向放在盆内，如错开放置则每25片隔一张无硫纸。2.出货单元为11或12，或板厚大于2mm的需每块板之间隔无硫纸。3.出货尺寸大于12“12”需斜放在L型车上SurfaceFinish-07沉银沉银/锡板检查后存放锡板检查后存放Storage of Immersion Silver/Tin After Inspection项目（Item）要求（Requirement)戴手套(Glove)白丝袜手套（WhiteGlove)叠板高度(StackHigh)低于盆边沿1Belowthebasin1使用工具(ToolingUsing)手推车(handcart)其它：（Others)1.板竖直放置；且每排20片或25片间用纸皮或光树脂板隔开；2.出货单元为11或12的板及板厚大于2mm的板放板时每块隔纸皮。3.出货尺寸大于12“12”需斜放在L型车上。SurfaceFinish-092、生产参数：序号Serial No.流程Procedure缸号Tank No.缸体积Vol.浸泡时间（minute）Immersion time滴水时间（sec）Drop time工作温度（设定值）Working Temp.(Setting)主要成分Basis1上板Loading1#/2除油Oil remove19#480 L46103045（38）除油剂SCPro select SC.浓H2SO4（98%）98%H2SO43水洗Rinse 18#400L1.52.55/自来水city water4水洗Rinse 17#400L1.52.55/自来水 city water5水洗Rinse 16#400L235/自来水 city water4微蚀Micro-etch15#480 L12102535（30）NPS，浓H2SO4（98%）NPS,98%H2SO45水洗Rinse14#400 L125/DI水 DI water6水洗Rinse 13#400 L125/DI水 DI water7水洗Rinse 12#400 L2330/DI水 DI water8预浸Pre-immersed11#480L12152035（28）(浸锡)基本剂LP Stannatch LP conc.(浸锡)基本剂2000 Stannatch 2000 conc.锡溶液SF-CSF Tin Solution C(浸锡)添加剂Stannatch Additive9沉锡1#Immersion tin 1#10#480 L1416（7-8，11-13）156572（68）(浸锡)基本剂LP Stannatch LP conc.(浸锡)基本剂2000 Stannatch 2000 conc.锡溶液SF-CSF Tin Solution C(浸锡)添加剂Stannatch Additive10沉锡2#Immersion tin 2#9#480L1.52.5456572（68）(浸锡)基本剂LP Stannatch LP conc.(浸锡)基本剂2000 Stannatch 2000 conc.锡溶液SF-CSF Tin Solution C(浸锡)添加剂Stannatch Additive11PH水洗PH rinse 7#525 L3070sec5常温R.T自来水 City water12水洗Rinse 6#400 L125/DI水 DI water13后清洁Post-clean5#480 L13106070（65）后清洁剂SFIonix SF14热水洗Hot rinse4#400 L 1254050（45）DI水 DI water15热水洗Hot rinse3#400 L1254050（45）DI水DI water16热水洗Hot rinse2#400 L1254050（45）DI水 DI water17下板Unloading 1#/常见问题分析（喷锡）A.锡渣残留：原因分析：原因分析：行板速率过慢，风刀气压过低，锡槽熔锡不良。板面清洁处理不良。解决措施：解决措施：调整行板速率，风刀压力，调整锡槽温度，检查板面清洁度。B、铅锡堵孔：、铅锡堵孔：1.5.2.A原因分析原因分析：风刀气压过低，速度过快。解决措施解决措施：及时调整风刀气压和行板速度。C、焊盘可焊性不良：、焊盘可焊性不良：1.4.2.B原因分析：原因分析：刀槽堆锡，风刀角度不当，锡缸温度偏低。解决措施：解决措施：及时清理刀槽，调整风刀角度，严格控制锡缸温度。D、焊盘脱落：、焊盘脱落：原因分析解决措施1、铜层与基材结合力差，剥离强度不够1、加强来料检查，购买优质板料或铜箔2、热风整平时风刀变形或风刀上挂锡刮掉焊盘2、及时清理风刀，或者修理更换3、热风整平时参数设置不当或风刀堵塞，焊盘锡高导致后处理或后工序擦掉3、调整热风整平参数，及时清理风刀4、独立焊盘电镀铜偏厚，高出其他焊盘及线路，导致后续工艺擦掉4、调整电镀工艺，规范员工操作常见问题分析（沉银）项目Item 现象Phenomenon 可能原因Possible cause 改善措施Improve action除油Cleaner清洁效果不佳(板子外观问题)Poor cleaning effect(poor appearance)温度不足Poor temperature 浓度不对Wrong concentration 喷洒时间不够Poor spray time槽液寿命超过Excess path life 温度量测检查Check temperature 定期分析与补充Analysis and replenishment termly 传动速度确认Ensure transfer speed依产量记录及分析结果更槽Dump bath according to the production record and analysis result.微蚀Micro etch 槽液污染(板子外观问题)Chemical polluted(poor appearance)加错药水Wrong chemical 铜含量过高High copper人员训练People training 定期分析及更槽Analysis termly and dump 微蚀量不足(镀层附着不良)Poor etch rate(poor plating)温度异常Abnormity temperature浓度异常Abnormity concentration 浸泡处理时间不足Dipping time shortage 温度检查Check temperature 槽液分析并补充Analysis and replenishment 传动速度确认Ensure transfer speed每班Etch Rate测试Measure etch rate per shift生产板问题处理：蚀过度(线路断路)Over Etch(circuitry open)浸泡处理时间太长Dipping time too long卡板重迭Board wrap传动检查Check transfer卡板尽速排除Remove the board in time 预浸Pre-Dip槽液污染(沉银无法镀上或上不好)Chemical polluted(silver can not plat or poor plating)微蚀药液带入Mix in micro etch chemical 微蚀后水洗不良Poor rinse after micro etch保持放板间距,避免重迭Keep right space between boards to avoid wrapping.增加水洗量,及确认水洗流量Increase rinse capacity and ensure water flux.沉银Sterling-Silver槽液污染(沉银无法镀上或上不好)Chemical polluted(silver can not plat or poor plating)加错药水Wrong chemical超过槽液寿命Excess path life人员训练People training 依产量记录及分析结果更槽Dump bath according to the production record and analysis result.厚度不足/过厚Thickness shortage/excess 浸泡处理时间异常Abnormity dipping time浓度异常 Abnormity concentration温度异常Abnormity temperature 温度,速度检查Check temperature and speed定期分析化验调整Analysis termly and adjust确保银厚度在0.15-0.30m之间Ensure silver thickness is within the range:0.15-0.30mDI水洗DI water rinse 板面氧化变色(外观不良)Oxygenation and change color(poor appearance)水质不良Poor water quality水量不够Water quantity not enough 控制最终纯水洗电导率值20sThe final DI water conductance must be 20s增加并确认水洗流量Increase rinse capacity and ensure water flux.包装Packing 板面氧化变色(外观不良)Oxygenation and change color(poor appearance)手指印Finger marking 包装材料不良Poor packing material 储存条件不良Poor storage condition 使用干净手套Wear clean glove 使用无硫无氯之包装材料或隔纸Pack the board with sulfur and chlorine free paper or seclude with paper.储存环境温度小于30，湿度小于75%The storage temperature less than 30,Relative humidity less than 75%.刮伤Scrape 搬运不小心Fail convey 人员训练People training 使用隔纸Seclude with paper问题Problem 原因causation处理对策Countermeasure 1.运输带不能启动 Conveyance strip can not startup1.轴辘有损坏 Spindle and roller be mangled 2.齿轮的连接有损坏 Joint of gear be mangled3.马达失灵 Motor failure 1.维修或更换 Maintain or replace 2.维修或更换 Maintain or replace3.检查及维修 Check and maintain 2.循环泵不能启动 Pump can not startup 1.水位过低 Lower water level 2.水位感应器失灵或有污垢 Level inductor failure or there is dirt3.药液缸的盖未闭上 The tank lid is unclosed 4.循环泵机件故障 Pump parts error 1.补充水位 Supply water 2.清洁或更换 Clean or replace3.盖上所有药液缸的上盖 Cover all bath lids4.检查或更换 Check or replace3.泵的压力不足 The pressure of pump shortage 1.水管被阻塞 Water pipe is plugged 2.水压显示器失灵 Water pressure display failure 1.清洁管道或更换 Clean the pipe or replace2.维修或更换 Maintain or replace 4.发热器不能启动 Heater can not startup 1.水位不足 Water level shortage2.水位感应器失灵或有污垢 Level inductor failure or there is dirt3.温度控制器失灵 Temperature controller failure 1.补充水位 Supply water 2.清洁或更换 Cleaning or replace 3.检查,更换或维修 Check,replace or maintain 5.干板能力不足 Poor dry capacity 1.风刀被阻塞 Air knife is plugged 2.风刀的位罝错误 Wrong location of air knife 3.热风溫度不足 Low temperature 1.清理阻塞物 Cleaning plugged content 2.调校到正确位置 Adjust to right location 1.检查热风机操作是否正常及作出维修 Check if the operation of the hot air machine is right and maintain it设备问题：流程监控工具一、SPC图二、工序检查表返工一、MEI规定可以返工的项目1、可以直接返工的2、经批准需出返工指示的二、其它任何情况都属于非法返工，不允许