PCBA检验规范.doc

PCBA检验规范编 号：版 本：V1.0生效日期：1修订情况表修订历史版本说明作者审核批准生效日期2术语表术语表名称说明PCBA检验规范目 录1.目的(PURPOSE)12.范围(SCOPE)1 3.名词解释(WORDS EXPLANATION)14.参考文件(REFERENCE DOCUMENT)15. 职责(RESPONSIBILITY) .16. 作业流程及内容(Flow chart and content).17. 修订权限(AUTHORITY OF MODIFICATION)28. 附件(ATTACHMENT).2 8.1 附件一(PCBA).4 8.2 附件二(机构类).42 8.3 附件三(其它).52PCBA检验规范1 目的(Purpose) 建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的workmanship,防止不良之发生. To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.2 范围(Scope) 本规范适用于所有产品(含半成品及成品PCBA)的外观目视检验, 包含自行生产制造之PCBA, 委托外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA等. It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.3 名词解释(Words explanation)无(None)4 参考文件(Reference document) ANS/IPC-A-610D5 职责(Responsibility)5.1 生产单位(Production unit):负责产品检验之执行.Be responsible for doing product inspection5.2 质量管理部(Quality unit):负责产品规格之制定及产品品质之抽样检验管制Be responsible for making product specification and controlling the spot check of product quality6 作业流程及内容(Flow chart and content )6.1检验前的准备(preparation for inspecting):检验前须先确认所使用的工具,材料,胶,清洁剂等,是否合乎规定. 检验PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限.Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but the finished good with。6.2 若有检验标准未规范的异常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm. 6.3 检验环境要求光线充足,以目视为主,辅以放大镜和卡尺6.4 外观检验项目基准参见附件一三。The item of cosmetic inspection standard reference Appendix 1 to 3.7 修订权限(Authority of modification)本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同.This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as the same above.8 附件Attachment ( 含记录表单)8.1 附件一：PCBA Appendix 1: PCBA 8.2 附件二：机构类Appendix 2: Mechanical 8.3 附件三：其它Appendix 3: Other附 件 预 览 总 表附件一: PCBA类附件二: 机构类(Mechanical)附件三: 其它(Other)1 SMT零件(SMT component)1-1 焊点规格(Soldering SPEC)1-2 焊点异常(Solderingabnormal)1-3 零件损坏(Component damage)1-4 点胶(Staking adhesive gluing)1 外壳(Housing)1 标签(Label)2 托架,承座(Chassis)2 Barcode3 铭板(Overlay)3 包装袋(PE bag)4 散热片(Heat sink)4 外箱(Carton)5 绝缘片(Insulator)5 Housing6 螺丝,螺帽,垫片(Screw nut)7 DC series converter 系列成品外观检验标准2 Dip 零件(DIP component)2-1 焊点规格(DIP SPEC)2-2 引脚突出(Lead protrusion)2-3 通孔(PTH)2-4 插件外观(Appearance)2-5 点胶(Adhesive gluing)2-6 DIP高翘(DIP componentlifted)8 Transformer9 Shielding cover 外观检验标准3 PCB3-1 marking3-2 外观(Surface appearance)3-3 焊锡性(Solderability)4 Connector, PIN & 金手指(Golden finger)5 其它(Other)5-1 螺丝(Screw)5-2 跳线(Jump)附件一: PCBA类1 SMT零件(SMT component)1-1 焊点规格(Soldering SPEC)1-1-1 Chip 零件(Chip component)DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移D50% W 或D50% P 拒收DefectSide overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less零件偏移D50% W 或D50% P 拒收Defect Any end overhang (B)零件超出pad 拒收DefectComponent in reserved to lacquer to go to circuit to form a short circuit零件在有保护漆之线路上造成短路拒收AcceptableEnd joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less零件焊点宽度C50%W or C50% P 允收AcceptableMaximum fillet height (E) may overhang the lend or extend onto the of the end cap metallization, but not extend further onto the component body锡高超过金属端,但未延伸至零件本体允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收DefectMinimum fillet high (F) is less than 25% termination high (H), or fillet high (F) is less than 0.5mmHigh voltage capacitance minimum fillet high (F) is less than 50% termination high (H), or fillet high (F) is less than 0.75mm爬锡高度 F25% H 或 F0.5mm 拒收高压电容爬锡高度 F50% H 或 F50% W or 50% P. 拒收DefectAny end overhang (B)零件超出pad 拒收AcceptableEnd joint width (C) is minimum 50% component diameter (W) or land width (P),whichever is less零件连接直径宽度C50% W or 50% P 允收AcceptableSide joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less侧面焊点长度D50%T or 50%S 允收DefectSolder fillet extends onto the component body锡延伸到零件本体上拒收AcceptableMinimum fillet heitht(F) is solder thickness(G) plus 25% diameter(W) of the component end cap焊锡高度F25%(G+W) 允收AcceptableEnd overlap(J) between the component termination and the land is minimum 50% the length of the component termination(T)零件末端与PAD重叠部分J50%T 允收DefectEnd overlap(J) is less than 50% of the length of component零件末端与PAD重叠部分J50% W 拒收DefectEnd joint width (C) is less than 50% castellation width (W)零件末端焊点宽度 C50% W 拒收DefectMinimum side joint length (D) is less than 50% minimum fillet height (F) or land length external to package (S),whichever is less零件末端焊点长度 D50% S 或50% F 拒收DefectMinimum fillet height (F) is 25% castellation height (H)焊锡高度 F25% H 拒收DefectAny end overhang (B)零件超出pad 拒收DefectMinimum fillet height (F) is 25% castellation height (H)焊锡高度 F50% W 拒收DefectMinimum end joint width (C) is less 50% lead Width (W)焊点宽度 C50% W 拒收DefectSide joint length(D) is less than 80% of lead length (L)焊锡长度 D4/5 L 拒收DefectSolder touches the body or end seal of high-lead configuration component焊锡延伸至零件本体上或封装末端 拒收Acceptable爬锡高度: Fillet 接触到正面吃锡面 允收DefectSolder touches package body锡延伸到零件本体上 拒收AcceptableTransformer high voltage pins solder is over the A corner portion ,but ex no function pin (for all inverters, except special case) 变压器高压Pin吃锡度已达到A 处(第一弯角处) 允收Acceptable Solder is over the B portion(for all inverters, except special case) 吃锡度超出B 处 允收Defect Solder is already over the B portion, and bobbin had Been damaged by iron . Bobbin 被烙铁烫伤 拒收DefectMinimum heel fillet height (F) is less than 25% lead thickness (T)焊锡高度 F50% W 拒收DefectMinimum end joint width (C) is less than 50% lead width/diameter (W)焊锡宽度 C50% W 拒收DefectSide joint length (D) is less than 80% lead length焊锡长度 D 小于 4/5 引脚长度拒收DefectSolder touches the package or end seal焊锡延伸至零件本体上或封装末端拒收DefectMinimum side joint height (Q) is less than solder thickness (G) plus 50% diameter (W) of round lead or 50% thickness of lead at joint side (T) for coined lead焊锡高度QG+50% W or Q50% W 拒收AcceptableMinimum end joint width (C) is 50% lead width (W)焊锡宽度 C50%W 允收DefectSide joint fillet (D) less than 150% lead width焊锡宽度 (D) 小于150% 引脚宽度(W) 拒收DefectSolder fillet touches package body焊锡延伸至零件本体上 拒收1-1-7 I形引脚 (Butt/I Joints)DefectAny toe overhang (B)侧边突出 拒收DefectEnd joint width (C) is less than 75% lead width (W)焊锡宽度 C75%W 拒收DefectSolder touches package body焊锡延伸至零件本体上 拒收DefectFillet height (F) is less than 0.5mm0.02inch焊锡高度(F)小于0.5mm 拒收1-1-8 向内L型引脚(Inward formed L-shaped ribbon leads)DefectEnd joint width(C) is less than 50% lead with(W)Side overhang(A) is greater than 50%WMinimum fillet height(F) is less than 25% E焊锡宽度C50%W 拒收焊锡高度F25% 拒收AcceptableMinimum end joint width(C) is greater than 50% lead with(W)焊锡宽度 C50%W 允收1-1-9 BGA 零件(Area array/Ball grid array )DefectMore than 50% overhang偏移50% 拒收DefectSolder bridge锡桥 拒收Dark spots in X-Ray view the bridge between solder joints在X-Ray下焊点间桥接或 拒收Solder open锡散开 拒收Missing solder漏锡 拒收Solder ball(S) that bridge more than 25% of the distance between the leads锡珠超出焊点间距25% 拒收DefectFracture solder connection锡裂 拒收1-2 焊点异常(Soldering abnormal)1-2-1 侧立(Mounting on side)DefectChip resistance mounting on side电阻侧立 拒收AcceptableChip capacitance & Inductance minimum type is less than 1206, mounting on side and no more than five(5) chip on each assembly are mounted side ways电容,电感类零件小于1206(含)以下, 且单面少于5pcs 允收1-2-2 翻件(Mounting upside down)AcceptableElement of chip component with exposed deposited electrical Element is mounted toward board能导通 允收1-2-3 墓碑(Tombstone)DefectChip component standing on their terminal end(Tombstone)墓碑 拒收1-2-4 共平面 (Coplanarity)DefectOne lead or series of leads on component is out alignment and fails to make proper contact with the land零件的一个或多个引脚变形，不能与pad 正常接触 拒收1-2-5 锡未完全熔化(Reflow not complete)DefectIncomplete reflow of solder paste锡未完全熔化 拒收1-2-6 空焊 (Nonwetting)DefectSolder has not wetted to the land or termination空焊 拒收1-2-7 冷焊(Dewetting, Disturbed solder)DefectCharacterized by stress lines from movement in the connection while solidifying冷焊 拒收1-2-8 锡裂(Fractured solder)DefectFractured or crack solder焊锡断裂或破裂 拒收1-2-9 针孔/吹孔(Pinholes/Blowholes)DefectBlowholes, pinholes, voids, etc焊锡连接出现气泡,气泡,空白,流出物等 拒收Acceptable焊点上紧临零件脚的气孔/针孔,一个焊点只允许有一个,且其大小须小于零件脚面积的1/4 允收Acceptable焊点上未紧临零件脚的气孔/针孔,一个焊点容许有不超过两个(含),且其大小须小于零件脚面积的1/4 允收1-2-10 锡桥(短路)Solder bridge(short)DefectA solder connection across conductors that should not be joined锡桥(短路) 拒收AcceptableOn the same PAD, solder bridge(short) across conductors同PAD上两焊点短路 允收On the same trace(Visualization) but not same PAD, solder bridge(short) across conductors目视同线路不同PAD短路 允收1-2-11 锡珠(Solder ball)DefectSolder ball dislodge非附着性锡珠 拒收Entrapped or encapsulated solder balls that are exceed 0.2mm in diameter 附着性锡珠但锡珠直径大小为0.2mm （含）以上变压器高压端及高压电容旁有附着性锡珠 拒收Solder ball attached on high voltage side of transformer or around high voltage capacitorMore than 5 solder balls (diameter less than 0.2mm) per 600mm2锡珠直径大小为0.2mm 以下但锡珠数量多于 5 颗 / 6 平方公分（含） 拒收PS:锡珠以静电毛刷刷不掉者,判为附着性锡珠1-2-12 锡渣(Solder splash)DefectSolder splashes that are exceed 0.2mm in length锡渣长度最长边0.2mm（含）以上 拒收Solder splashes attached on high voltage side of transformer or around high voltage capacitor变压器高压端及高压电容旁有锡渣 拒收More than 5 solder splashes (diameter less than 0.2mm) per 600mm2锡渣直径大小为0.2mm 以下但锡渣数量多于 5 颗 / 6 平方公分（含） 拒收PCB 铜箔PAD 沾锡直径大于0.7MM 拒收1-3 零件损坏(Component damage)1-3-1 裂缝与缺口(Cracks and chip-outs)AcceptableCracks or chip-outs not greater than dimensions L50%, W25%, T25%缺口的尺寸L50%, W25%, T25%可接受DefectAny nick or chip-out that exposes the electrodes任何电极上的裂缝或缺口 拒收Cracks, nicks or any type of damage bodied components玻璃组件本体上的裂缝、刻痕或任何损伤 拒收Any chip-outs in resistive elements任何电阻质的缺口 拒收Any cracks or stress fractures任何裂缝或压痕 拒收1-3-2 金属镀层(Metallization)AcceptableMaximum of 50% of metallization loss of top end area (for each terminal end)顶部金属镀层损失不大于50%,侧面金属镀层不得漏底材 允收DefectMetallization loss exceeds 50% of top area顶部金属镀层损失大于50% 拒收1-3-3 剥落(Leaching)DefectLeaching of the terminal ead face exposing ceramic. 剥落导致陶瓷暴露 拒收Leaching exceeding 25% of component width (W) or component thickness (T)零件剥落宽度(W)或厚度(T)超出25% 拒收1-3-4 点胶(Staking adhesive & gluing)DefectAdhesive is present in the solder connection area that reduces solder contact to less than 50% of the component termination width点胶位于待焊区域，造成焊锡宽度小于50% 拒收 DefectThe glue height above A or below B of crystal振荡器点胶之高度: 高于A或低于B 拒收DefectThe glue height above A or below B of ICIC点胶之高度: 高于A或低于B 拒收2 插件零件(DIP component)2-1 焊点规格(Soldering SPEC)2-1-1 焊点可接受性要求(Soldering acceptance)DefectNonwetting which results in the solder forming a ball or bead on the surface, much as water beads form on a maxed surface. The fillet will be convex; No feathered edge apparent不润湿导致焊点表面形成粗糙,灰暗或颗粒状,无光滑表面焊点移位 拒收Disturbed solder connection or Cold solder connection空,冷焊 拒收2-2 焊点凸出(Lead protrusion)DefectThe leads protrusion over 2.2 mm背面脚长大于2.2 mm 拒收脚直径大于1.0mm, Connector, 变压器Pin无短路及组装干涉问题者脚长可适当放宽DefectComponent to give to conduct electricity a circuit a short circuit零件与导电线路短路 拒收2-3 通孔Plated-through holes(PTH)2-3-1 通孔的填充(PTH-vertical fill of hole)DefectVertical fill of hole is less than 75%通孔的填充小于75% 拒收2-3-2 通孔的外围焊点-正面(PTH-circumferential wetting-primary side)DefectLess than 180 wetting on lead or barrel引脚和孔壁焊接不足180 拒收2-3-3 通孔的外围焊点-背面(PTH-circumferential wetting-secondary side)DefectMinimum 270 fillet and wetting (lead, barrel and termination area)引脚和孔壁焊接不足270 拒收2-3-4 包焊(Lead not discernible)DefectFillet convex, lead not discernible due to excess solder, providing visual evidence of the lead in the hole can be determined on the primary side由于焊锡过多导致包焊 拒收DefectLead not discernible due to bent lead由于引脚弯曲导致包焊 拒收2-3-5 引脚折弯处的焊锡(Solder in lead bent)DefectSolder in bend area comes in contact with the Component body or end seal引脚折弯处的焊锡接触组件本体或密封端 拒收2-3-6 陷入焊锡的绝缘层(Meniscus in solder)AcceptableExhibit good wetting and lead coating menisc