项目新产品开发整体流程介绍.ppt

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,PPT,文档演模板,Office,PPT,05 十一月 2026,项目新产品开发整体流程介绍,Role&Responsibility,Function,Responsibility,PM,產品經理-Product Manager(或計畫專案經理-Project Manager)為所負責計畫或產品線成敗之總負責人,將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解.並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.,TM,TM is responsible to coordinate technical issues conflict among HW,SW,ID and ME and decision-making.TM has to handle all project technical issues.,PCC,為規劃推廣、連絡及控制專案進行的負責人,掌握專案進行之情況以協助處理異常狀況,使新產品能順暢切入工廠且如期推出,以提高產品競爭力.,協助 R&D RELEASE 開發階段 BOM CHANGE NOTICE.,R&D,R 包括ME,Thermal,Packing design.若只寫 SW(Software design)則指軟體設計部門有負責 BIOS,Driver 及 Pre-load 不同工作性質之軟體開發功能.R&D 人員負責產品之開發、設計、測試規劃，包括 H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書.,-Wistron Case,Role&Responsibility,Function,Responsibility,HW(Hardware Design),*Hardware is responsible for Electronic Engineering Design,*Co-works with S/W and QT to make sure that the every function works well according to spec.,*H/W should conduct technical transfer to PE.,*H/W should input,update,and maintain the bugs/issues information in the bug tracking system.,SW(Software Design),*Software is responsible for the design of BIOS,Driver,Utilities,and S/W Preload.,*S/W co-works with H/W and QT to make sure that every function works well according to the specification.,*S/W has to release the SCD and the Cert.Team Document.,*S/W should conduct technical transfer to TE.,*S/W has to input/update/maintain the bugs/issues information in the bug tracking system.,ID/ME(Industrial Design/Mechanical Engineering),*ID/ME is responsible for Mechanical Engineering,Thermal and Packing designs.,*ID/ME should conduct technical transfer to PME.,*ID/ME should input,update,and maintain the bugs/issues information in the bug tracking system used.,-Wistron Case,Role&Responsibility,Function,Responsibility,PA,(EMI/Safety,QT,CE/Reliability,PCB,OS Certification),為產品保證暨開發支援Function之總稱,主要負責根據 MRS/PES 執行各項產品之測試,諸如 EMC/Safety:REGULATORY TEST,CE:RELIABILITY TEST 及 KEY COMPONENT APPROVAL,PCB:PCB LAYOUT,DC:BOM,OS:OS 認證 etc;,EMC/Safety,All products to meet EMC/Safety requirements and guarantee the legality in the international marketing.申請產品之安規、測試、Debug.,QT,為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITY TEST,SOFTWARE TEST,S/W PRELOAD TEST,DIAGNOSTIC PROGRAM TEST,ETC.,CE/Reliability,組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證,產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定.,PCB,PCB Layout之申請、PCB之設計、Orcad library&Mentor library的建立與管理.,信號品質CAE分析,PCB layout外包廠商之管理，PCB製造廠商之管理.,OS Certification,執行公司各產品之 OS 相容性認證測試及 LOGO 申請.,O.S.Beta Site 測試,PDM,料號編碼及控管,BOM製作,-Wistron Case,Role&Responsibility,Function,Responsibility,AM(Account Manager),1.爭取訂單與客戶合約協商,.,2.協調產品,SPEC.,工程變更,SAMPLE APPROVAL.,3.適時反應市場需求與趨勢,.,MM(Material Management),1.MM is responsible for new supplier development,parts purchasing,2.Controlling mechanical tooling status including the schedule,capacity,parts readiness,concerns,3.Manage the dependencies,long lead-time items.,4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final version,SQM(Supplier Quality Management),*零件品質管理及參與分包商之評鑑,/,管理(SQRC Plan/Status),*負責異常材料分析、追蹤與改善,.,*負責進行產品,QVL CANDIDATE APPROVAL,作業系統,AT mfg.,GCSD,1.開發及推動全球客戶服務及支援計劃.,2.各項售後服務及支援作業.,3.參與 Field 品質改善作業(EWG),FI,負責評估,Project Cost,決定,Project,是否可行以及,Project,所花費之,Cost.,Legal,合約及專利審核,-Wistron Case,Role&Responsibility,Function,Responsibility,CFE,CFE acts on behalf of Wistron global manufacturing operation to deal with the customer,and also acts as a representative of the customer when dealing with internal Wistron teams.Based on the C4/C5 checklist,related reports and project status,CFE is responsible to conclude the exit judgment(Ready or Not ready)during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not,NPI,1.負責規劃、協調、整合與提供,各,Site,製造所需相關資訊與技術資料,2.協調安排新產品轉移至海外生產工廠,3.協調處理海外生產工廠發生之生產相關問題,PE/PME,1.產品設計審查,產品問題之發覺及產品移交,.,2.協助生產良率提昇,克服生產瓶頸,提高生產力,.,3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質.,IE,1.設計及管理一個高效率的整合製造系統,.,2.消除浪費、杜絕不合理，提高生產力,3.生產流程規劃、製程改善、標準工時製定,QA,1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質,2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質,3.協助工程單位必要之驗證測試,.,4.建立PCBA,Final Assembly之檢驗標準,QE,1.執行 DQA.FDI,MTBF,ORT Test,2.執行產品開發過程之可靠度及環境測試(C4),3.協助工程測試驗證,4.品質工程問題分析與解決,-Wistron Case,Role&Responsibility,Function,Responsibility,PD(Production),PD has to work with PE,PME and IE respectively to get testing equipment&tools,assembly tools,and SOP ready before C5 Exit.PD is responsible to produce the product.PD is not just for efficiency only but also quality.,PSE(Process Engineer),PSE is responsible for SMT process and for releasing the SMT pilot run report.PSE is also responsible for the process continuous improvement(CIP).,FAE(Failure Analysis Engineer)or RE,FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement.FAE is also responsible for preparing repair SOP if applicable.,TE,TE is responsible for providing and maintaining Test Plan and Test Program.TE also implement all the preload to production line and report the problems related to preload to preload team.,PMC/GPMC(Plan Material Control/Global Plan Material Control),GPMC/PMC is responsible for product fulfillment,final shipping model,supply site and capacity plan,and ramp up plan for all sites.,-Wistron Case,Wistron C-System Quality Control,Proposal,Phase,Planning,Phase,R&D,Design,Phase,Lab,Pilot-run,Phase,Engineering,Pilot-run,Phase,Production,Pilot-run,Phase,Mass,Production,Phase,C0,C1,C2,C3,C4,C5,Check,Point,Wistron,C-Phase,NPI,FDI/MTBF,DQA/PQC/FQC,Compatibility/Diagnostic,Simulation Test,Layout&drawing,-Signal Integrity,-DFX Check,-AVL-C,-Test Plans,Reliability/Stress,EMI/Safety,OS&Pre-Load,WIH/WPH/WZS/WKS,MRS Check,-Service Cost Estimate,-Simulation,-Design Peer Review,-Lessons Learned,Availability,Develop,Plan,Launch,FAI&SPC,MTBF Demo,CIP/CLCA,Pareto Analysis,EWG Ready,AFR,Test Reports,Pre-QVL Ready,Diagnostics Program,Bug List&Action,DCN/ECN/ECR,FAI report,PFMEA,SQRC,Training,MTBF Review,QMP/QPA/QSA,FPYR,PPAP,Serviceability,Design,Test Plans,Integrate Design Review,Signal Quality,DFX Index,Initial Supplier Audit,Memorandum,DFMEA,Simulation,MTBF Estimate,MVP,Concept/Proposal,MRS Definition Scope,SCE,Investigation,&Proposal,Design&,Sourcing,Integration,Validation,Release,Product Life Cycle,MDRR/C4,Go/No Go?,MRR/C5,Go/No Go?,C6,OOB/OBA,ORT/Stress,EWG/FQH,AFR/DOA,New C System Architecture,Progress,C0 Exit,C0 Activity,C0 Entry,C1 Exit,C1 Activity,C1 Entry,C2 Exit,C2 Activity,C2 Entry,C3 Exit,C3 Activity,C3 Entry,C4 Exit,C4 Activity,C4 Entry,C5 Exit,C5 Activity,C5 Entry,C6 Exit,C6 Activity,C6 Entry,Time,Detail Activities,Subject,Scope,Definition,Procedure,.,Activities Definition,Record&Report,Format Definition,Escalation Rule,Measurement,Standard,Project Management&System Maintenance,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng.Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklist,HW DV test report,SW FV test report,ME test report,Reliability test report(prel.),ME/Artwork/packing drawing,PAL/ROM data listing,C3 manufacturability review report,Sample approvestatus&bug list review,C4 checklist,BOM,QVL,Time standard,System BIOS/KBCFW release,S/W Driver/AP/Utility/DiagnosticRelease,EE Eng.P/R report,SMT WS P/R report,PCBA WS P/R report,ME Eng.P/R report,Eng.P/R QA review report,Schematics&jumper setting,Test program/Procedure,SOP for PCBA/FA,User manual R/N,Packing standard,Compatibility test report,Reliability and C4 Reliability test report,Key Component verification,Spare parts list,C5 checklist,Service Guide,EMC Safety report,PD P/R yield rate analysis rpt,PCBA inspection instruction,Product inspection instruction,MTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C1 checklist,Inventiondisclosure,Time schedule,Project team,Model number define,Green design guide and reviewcheck list,Non QVL/Sampleapproval request form,C2 checklist,PES,EMC/Safety Request Form,BOM/QVL(Prel.),PCB Layout(prel.),Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist,Product phaseout notice,C0 Checklist,MRS,C0/PM,C0 Meeting,階段,C0構想階段(Proposal Phase),負責單位,計畫經理(Project Manager)或產品經理(Product Manager),目的,*確訂提案構想或市場需求規格書(MRS),*可行性分析,工作重點,*相關提案之市場資料搜集,*相關提案之關鍵技術資料搜集,*R&D 提出技術可行性分析,*PM 執行可行性及效益評估,審核會議,C0,目的,評估是否成立專案計畫，進行研發,檢核項目,計畫提案書或市場需求規格書(MRS),C0-工作重點及檢核項目,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng.Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklist,HW DV test report,SW FV test report,ME test report,Reliability test report(prel.),ME/Artwork/packing drawing,PAL/ROM data listing,C3 manufacturability review report,Sample approvestatus&bug list review,C4 checklist,BOM,QVL,Time standard,System BIOS/KBCFW release,S/W Driver/AP/Utility/DiagnosticRelease,EE Eng.P/R report,SMT WS P/R report,PCBA WS P/R report,ME Eng.P/R report,Eng.P/R QA review report,Schematics&jumper setting,Test program/Procedure,SOP for PCBA/FA,User manual R/N,Packing standard,Compatibility test report,Reliability and C4 Reliability test report,Key Component verification,Spare parts list,C5 checklist,Service Guide,EMC Safety report,PD P/R yield rate analysis rpt,PCBA inspection instruction,Product inspection instruction,MTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C0 Checklist,MRS,C2 checklist,PES,EMC/Safety Request Form,BOM/QVL(Prel.),PCB Layout(prel.),Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist,Product phaseout notice,C1 checklist,Inventiondisclosure,Time schedule,Project team,Model number define,Green design guide and reviewcheck list,Non QVL/Sampleapproval request form,C1/PM,C1 Meeting,C1-工作重點及檢核項目,階段,C1規劃階段(Planning Phase),負責單位,計畫經理(Project Manager)或產品經理(Product Manager),目的,*規格的擬訂*專案組織的成立,*專案時程的規劃,工作重點,*選任技術經理(Technical Manager,簡稱TM)並成立專案組織,*計畫專案經理(Project Manager)或產品經理，規劃專案時程,*召開C1審核會議,*法務確認Legal Concern、如Potential Patent List,Invention Disclosure,*成立專案團隊,審核會議,C1,目的,成立專案團隊、確定開發時程,檢核項目,Time Schedule,Project Team,Invention Disclosure,Green Design Check List,Sample Request Form,Case-bottle Coca in England,開採鋁礦,一噸鋁土提鍊半噸氧化鋁,半小時加工,半噸氧化鋁熔煉成1/4噸金屬鋁,再加工二週成鋁錠,瑞典或梛威,熔爐工廠,澳大利亞,澳大利亞,化學還原工廠,加熱至華氏900度,壓延成1/8 inch薄片,瑞典和德國,壓延廠,船運一個月,冷軋成1/80 inch薄片,冷軋廠,英國易開罐廠,成型，清洗，烘乾，防鏽,裝填，印刷,英國可樂廠,消費,鋁罐回收儘16%,Ecological Rucksack(生態包袱),生產一片半導體晶片所產生之廢料為產品重量之,十萬倍,生產一台筆記型電腦所產生之廢料為產品重量之,四千倍,生產一公升佛羅里達橘子汁需要,兩公升汽油及一千公升之水,生產一噸紙需用掉,九十八噸,之其他資源,資料來源:綠色資本主義 天下出版社,EU RoHS Directive,指令期程,2003.01.27 指令發布,2003.02.13 歐盟公報發行,指令生效,2004.08.13 轉為會員國當地法律,法規或行政指令,2006.07.01 新投入之產品不得含有禁用物質,指令要求/禁用項目,鉛(Pb),鎘 (Cd),汞(Hg),六價鉻(Cr6+),多溴聯苯(PBB),多溴化二苯乙醚(PBDE),(The restriction of the use of certain hazardous substances in electrical and electronic equipment),EU RoHS 管制規格,Substances,E.U.建議值,Lead(Pb)鉛;銲錫,1000 PPM,Lead(Pb)鉛;塑膠,線材,塗料,1000 PPM,Cadmium(Cd)鎘,100 PPM,Mercury(Hg)汞,1000 PPM,Hex.Chromium(Cr,6+,)六價鉻,1000 PPM,PBB,(聚溴聯苯),1000 PPM,PBDE,(聚溴二苯醚),1000 PPM,重金屬：,汞、鉛、鎘、六價鉻,溴性耐燃劑：聚溴聯苯(,PBB,s)、溴聯苯醚(,PBDE,s),註：另有,管制規範外,的項目,EU WEEE Directive,Directive 2002/96/EC期程,2003.01.27 指令發布,2003.02.13 歐盟公報發行，指令生效,2004.08.13 轉為會員國當地法律,法規或行政指令,2005.08.13 完成回收系統建構,製造商因應回收之 財務規劃就緒,2006.12.31 回收再利用率達每人每年4kg,2008.12.31 訂定下階段目標,回收Target of Recovery and Recycling,(,Waste Electrical and Electronic Equipment,),WEEE Category,Large household appliances,Small household appliances,IT&telecommunications appliances,Consumer equipment,Lighting equipment,Electrical and electronic tools,Toys,leisure&sports equipment,Medical devices,Monitoring and control instruments,Automatic dispensers,Rate of,Recovery,Rate of,Recycling,80%,75%,70%,50%,75%,65%,75%,65%,70%,50%,70%,50%,70%,50%,*,*,70%,50%,80%,75%,*To be determined by 31 December 2006,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng.Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C3 checklist,HW DV test report,SW FV test report,ME test report,Reliability test report(prel.),ME/Artwork/packing drawing,PAL/ROM data listing,C3 manufacturability review report,Sample approvestatus&bug list review,C4 checklist,BOM,QVL,Time standard,System BIOS/KBCFW release,S/W Driver/AP/Utility/DiagnosticRelease,EE Eng.P/R report,SMT WS P/R report,PCBA WS P/R report,ME Eng.P/R report,Eng.P/R QA review report,Schematics&jumper setting,Test program/Procedure,SOP for PCBA/FA,User manual R/N,Packing standard,Compatibility test report,Reliability and C4 Reliability test report,Key Component verification,Spare parts list,C5 checklist,Service Guide,EMC Safety report,PD P/R yield rate analysis rpt,PCBA inspection instruction,Product inspection instruction,MTBF DEMO test report,PM,PM,C0 meeting,C1 meeting,PM,C0 Checklist,MRS,PM,C1 checklist,Inventiondisclosure,Time schedule,Project team,Model number define,Green design guide and reviewcheck list,Non QVL/Sampleapproval request form,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist,Product phaseout notice,C2 checklist,PES,EMC/Safety Request Form,BOM/QVL(Prel.),PCB Layout(prel.),Outsourcing modulespecification,C2/PM,C2 Meeting,C2-工作重點及檢核項目,階段,C2設計階段,(R&D Design Phase),負責單位,技術經理,(Technical Manager),研發部門,目的,*,軟、硬體、機構設計,*,証實設計可行性,*,修正軟、硬體、機構規格,工作重點,*電路設計並完成電路圖,*機構設計並完成機構設計圖,*機電整合設計並完成機電介面設計,*軟體設計並完成初步版本,*電路設計,Review,*機構設計,Review,*機電整合設計,Review,*建立初步之測試計畫(硬體、軟體、機構),審核會議,C2,目的,*確定計畫規格,*檢討設計階段之工作成效,*決定是否進入樣品試作,*查核是否發出專利之申請,檢核項目,Schematics(Preliminary),S/W Specification,Mechanical&Thermal,Test Plan,Invention Disclosure Invention Disclosure,New C System Product Development,Proposal Phase,Planning Phase,R&D Design Phase,Lab Pilot Run Phase,Eng.Pilot Run Phase,Production Pilot run Phase,Mass production phase,C2 meeting,C3 meeting,C4 meeting,C5 meeting,C4 checklist,BOM,QVL,Time standard,System BIOS/KBCFW release,S/W Driver/AP/Utility/DiagnosticRelease,EE Eng.P/R report,SMT WS P/R report,PCBA WS P/R report,ME Eng.P/R report,Eng.P/R QA review report,Schematics&jumper setting,Test program/Procedure,SOP for PCBA/FA,User manual R/N,Packing standard,Compatibility test report,Reliability and C4 Reliability test report,Key Component verification,Spare parts list,C5 checklist,Service Guide,EMC Safety report,PD P/R yield rate analysis rpt,PCBA inspection instruction,Product inspection instruction,MTBF DEMO test report,PM,C0 meeting,C1 meeting,PM,C0 Checklist,MRS,PM,C1 checklist,Inventiondisclosure,Time schedule,Project team,Model number define,Green design guide and reviewcheck list,Non QVL/Sampleapproval request form,C2 checklist,PES,EMC/Safety Request Form,BOM/QVL(Prel.),PCB Layout(prel.),Outsourcing modulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6 meeting,GCSD,C6 checklist,Product phaseout notice,C3 checklist,HW DV test report,SW FV test report,ME test report,Reliability test report(prel.),ME/Artwork packing drawing,PAL/ROM data listing,C3 manufacturability review report,Sample approve statu