西门子可靠性培训资料.ppt

Click here to change the properties of the text template,Second level,Third level,Fourth level,Fifth and last level,Click here to edit the title format,Information and Communication Networks,9,82,5,46,1,08,7,64,10,91,6,00,0,00,8,00,M.,Chbat,S.,Eberlin,M.Tochtermann,T.Juhnke,hiT,7500,Multi-Haul DWDM system,Product Reliability Update Processes,Status,and Measures,Sept,15,2004,Siemens Reliability Process Overview,Optical Components:,EDFA,VOA,GTC,Passives,Negotiations with suppliers:,Modeling,Field experience,Supplier comparison,Electrical Components:,Resistors,Capacitors,Transistors,ICs,etc.,Standards:,SN 29500,IEC 61709,Mechanical Components:,Connectors,Boards,etc.,Standards:,SN 29500,IEC 61709,Card,FIT Rate,Feedback from,Field Return Rate,Product Reliability Assurance Process,Reference,:Siemens,standard,;in agreement,with,international,standards,IEC 61709,product definition,product development,product delivered,requirements aligned with technology basis failure rate allocation to individual cards involvement of component engineering&QA,card failure rates,on,basis,of,parts listscomponent rating by,design,new,&,critical components specificationnew components,&,supplier audits,in,production failure controlfield return analysis,&,threshold monitoringconservative data based,on,predicted valuesregular component supplier audits,Reliability Control and Improvement,Cross-functional team established to install focused program,Close interaction with the supplier for design,technology and process,Early failure monitoring and feedback in development phase,Extended testing including temperature cycling in production,Detailed failure monitoring in production for early corrective action,Predicted,FIT,rates,vs.,field return,FIT,rates,Field return FIT rate inherently is(!)lower than predicted FIT rate,spare parts dont contribute to FMA,non-installed equipment at certain carriers,low channel count for many years,temperature for FIT estimation probably higher than in reality,margin(e.g.,due to low channel count,low PMD,BOL)can mask performance degradation,Functional Partition of OLI,Optical amplification via EDFA gain block,Pump diodes,Monitor diodes,EDF-Heater,Internal Gain Switch,OSC splitting functions as,Add/Drop of the OSC channel using wavelength selective couplers,Splitting of monitor signals at the input and output port and at intermediate measurement points,Spectral shaping of the signal using a,VOA for setting the EDFA to an optimized operating point,GTC for tilt compensation,Optical monitor ports at input and output for signal supervision,APSD circuitry,Gain Control and Supervision(DSP,on-board processor),Electrical components for control and power supply,Mechanics including PCB,0 1 2 3 4 5 6 7 8 9 10 11 12 13,Operating time T in years,Failure rate,l,Early failures,l,total,Wear-out failure,The bathtub curve:Failure rates,l,via time T,Random failure,For the field replaceable HW-units and their components,the,failure rate,l,could be,only,predicted by,random failures,!,The unit of the failure rate,l,is a FIT,(,Failure in Time;,1 FIT=1 Failure per 10,9,h)!,Bathtub Curve,IEC 61709:,Electronic components Reliability,Reference conditions for failure rates and stress models for conversion,(no basic failure rates),Relationship between Standards,SIEMENS standard SN29500/IEC61709 compared to SR-332,SR-332:,Reliability Prediction Procedure for,Electronic Equipment,SN29500:,Failure rates of components,Expected values,(This is in addition to IEC 61709),a)Climatic and mechanical stresses,per IEC 721-3-3(see next slide)multiplying factors for environmentalconditions,b)Quality factor,tested components SN725004 quality levels known,c)Temperature and electrical stress,by reference conditions IEC 61709given reference conditions and conversion(SR-332),IEC 61709:Electronic components Reliability,Reference conditions for failure rates and stress models for conversion,The failure rate under operating conditions is calculated as follows:,Where,l,ref,is the failure rate under reference conditions;,p,U,is the voltage dependence factor;,p,I,is the current dependence factor;,p,T,is the temperature dependence factor.,These Parameter are listed e.g in the SN29000 library!,Reference conditions for climatic and mechanical stresses,Type of stress,Reference condition,1),q,amb,ref,=40 C,Climatic conditions,Class 3K3 as per IEC 721-3-3,Mechanical stress,Class 3M3 as per IEC 721-3-3,Special stresses,3),None,For details of notes(-1,-2,-3)please refer to IEC 61709,Ambient temperature,2),The definitions,reference conditions and conversion models used in the IEC 61709 fully,correspond with the already existing SIEMENS standard SN 29500 method.,Details:,SIEMENS Standard SN29500 and IEC61709,FIT Rates of Individual Electrical Components(1),Voltage dependence,and Current dependence,or,(1),(2),U,Operating voltage,in V,U,ref,Reference voltage,in V,U,max,Rated voltage,in V,C,1,Constant,in(1/V),C,2,C,2,C,3,Constants,(1).Digital CMOS,Families,Contactors,(2).,Others,I,Operating current,in A,I,ref,Reference current,in A,I,max,Rated current,in A,C,4,C,5,Constants,FIT Rates of Individual Electrical Components(2),A,Constant,Ea,1,Ea,2,Activation energies,in,eV,T,U,ref,Reference,ambient,temperature,in K,T,1,Reference junction,*,),-(,comp,.*,),-),temperature,in K,T,2,Actual junction,*,),-(,comp,.*,),-),temperature,in K,*,),Depends,on,type,of,component,see,also SN 29500,Part 1,Capt,.4.3,Temperature dependence,The expected failure rate of a HW-unit can be calculated,by adding the expected failure rates of the components:,EPROM,Capa,.,Resi,.,Fan,Trans.,Diode,DC/DC,Optic.Module,IC,PINs,LED,Solder joints,ASIC,field-replaceable HW-unit(Example),EPROM,Optic.Module,PINs,LED,IC,IC,IC,Trans.,Diode,Diode,Trans.,Trans.,Fan,Capa,.,Capa,.,Capa,.,Capa,.,Capa,.,Resi,.,Resi,.,Resi,.,Resi,.,Resi,.,Resi,.,Resi,.,ASIC,Resistors,1 FIT,8,16,8 FIT,Capacitors,2 FIT,6,12,12 FIT,Diodes,8 FIT,3,6,24 FIT,Transistors,15 FIT,4,12,60 FIT,ICs,25 FIT,4,64,100 FIT,EPROM,100 FIT,2,64,200 FIT,DC/DC,40 FIT,2,28,80 FIT,ASIC,250 FIT,2,1016,500 FIT,FAN,150 FIT,2,10,300 FIT,Optical Module,800 FIT,2,32,1.600 FIT,Solder joints,0,1 FIT,1260,126 FIT,3.010 FIT,Failure rates of,l,Components,Sum of,failure rates,Name of,Components,No.of,Pins,No.of,Comp.,Example:tot.failure rate of the HW-unit,l,unit,=,Component 1,R,1,l,1,Component 2,R,2,l,2,Total functional reliability(survivor),R,tot,of two components:,Details:,Total Reliability and Total Failure Rate of Unit,Siemens Reliability Process Overview,Optical Components:,EDFA,VOA,GTC,Passives,Negotiations with suppliers:,Modelling,Field experience,Supplier comparison,Electrical Components:,Resistors,Capacitors,Transistors,ICs,etc.,Standards:,SN 29500,IEC 61709,Mechanical Components:,Connectors,Boards,etc.,Standards:,SN 29500,IEC 61709,Card,FIT Rate,Feedback from,Field Return Rate,Estimation of FIT Rates for Optical Components,In parallel to the qualification cross-check detailed discussions take place with the vendor,What is the estimate of the vendor?How did he reach his estimate?What is the FIT rate of sub-components and,PCBAs,of the module?,Results of the cross-qualification are taken into account(failures,corrective actions,changes),The estimation of the vendor and the expertise of qualification team lead to the Siemens estimate(not necessarily the same as the vendors estimate),Field returns are taken into account when available and compared to the estimate,FIT rates are adapted accordingly(repetitive process),Example,of FIT Rate Adaption:EDFA w/5,pumps,First estimate in 2001:,6000 FIT,(complete new design incl.new Pumps,no experience at SIEMENS side),New vendors(new spec.)were qualified by,CoC,Optics and the,CoC,process took place,Estimates by two vendors:,3500-4800 FIT,Reduction to,5000,FIT,beginning of 2004,Quality improvement discussions with the vendors ongoing,Check with field returns:,1600 FIT,Reduction to,4000 FIT,(Siemens estimate)in April of 2004,Continuously monitored,Similar process with,EDFAs,(2 pumps)lead to an estimate of 2400 FIT,Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier(1),Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier(2),Overall FIT rate:3457.7,Siemens Reliability Process Overview,Optical Components:,EDFA,VOA,GTC,Passives,Negotiations with suppliers:,Modelling,Field experience,Supplier comparison,Electrical Components:,Resistors,Capacitors,Transistors,ICs,etc.,Standards:,SN 29500,IEC 61709,Mechanical Components:,Connectors,Boards,etc.,Standards:,SN 29500,IEC 61709,Card,FIT Rate,Feedback from,Field Return Rate,Reference FIT Rate for electrical and mechanical components,SN 29500 developed by ZT SR Corporate Function Standardization and Regulation,Cross-functional expert team SN 29500,Committee Quality,Used by all Siemens divisions,Updated by expert team with data from:,field experience,component qualifying teams and component manufacturers,History and acceptance,Developed as companys internal standard,First edition in 1978,Worldwide used by the most Siemens groups,Widely used outside the company,Generally used calculating the Siemens,telecommunications systems,Approved worldwide by the customers,Fully in accordance with EN/IEC 61709,actually parts,Part1:General,Part2:integrated circuits,Part3:discrete semiconductors,Part4:passive components,Part5:electrical connections,Part6:connectors and sockets,Part7:relays,Part9:switches,Part10:signal and,pilote,lamps,Part11:contactors,Part12:optical semiconductors,signal receivers,Part13:light-emitting and infrared diodes,Part14:,optocoupler,FIT Rates of Individual Electrical Components,Reliability,of Basic Booster(OLISTBNC):,Contribution,of,Component,Group,Quantity,Component Group,Percent.,17,Optoelectronics,43%,41,Other Components,11%,550,Capacitors,8%,64,IC analogue,6%,7,IC Memories,5%,45,Connectors Sockets,4%,6,IC ASIC,4%,26,Transistors,4%,1087,Resistors,3%,0,Electr,.Connections,3%,2,Micro-Processors and-Controllers,2%,4,IC Telecom,2%,15,IC Standard,1%,68,Diodes,1%,6,Semiconductors Power,1%,1938,Sum,100%,Reliability,of Standard Booster(OLITBNC):,Contribution,of,Component,Group,Quantity,Component Group,Percent.,34,Optoelectronics,52%,46,Other Components,9%,828,Capacitors,7%,104,IC analogue,6%,63,Transistors,5%,1791,Resistors,3%,7,IC Memories,3%,0,Electrical Connections,3%,67,Connectors Sockets,3%,6,IC ASIC,3%,8,IC Telecom,2%,126,Diodes,2%,2,Micro-Processors and-Controllers,1%,19,IC Standard,1%,9,Semiconductors Power,1%,3110,Sum,100%,Siemens Reliability Process Overview,Optical Components:,EDFA,VOA,GTC,Passives,Negotiations with suppliers:,Modelling,Field experience,Supplier comparison,Electrical Components:,Resistors,Capacitors,Transistors,ICs,etc.,Standards:,SN 29500,IEC 61709,Mechanical Components:,Connectors,Boards,etc.,Standards:,SN 29500,IEC 61709,Card,FIT Rate,Feedback from,Field Return Rate,FIT Rates of Individual Mechanical Components,Siemens Reliability Process Overview,Optical Components:,EDFA,VOA,GTC,Passives,Negotiations with suppliers:,Modelling,Field experience,Supplier comparison,Electrical Components:,Resistors,Capacitors,Transistors,ICs,etc.,Standards:,SN 29500,IEC 61709,Mechanical Components:,Connectors,Boards,etc.,Standards:,SN 29500,IEC 61709,Card,FIT Rate,Feedback from,Field Return Rate,Reliability Calculation of OLI,Standard,Assumptions,New,Calculation,Components with negligible power dissipation:,40C,temperature,Calculation done for,40C(,approx,.30C,environment,),Components with higher power dissipation:,typ,.power dissipation acc.data sheet or,75%max.load,if no typical value given,Actual estimated,power,dissipation used,For components with multiple units in a package:all units are used,Only units considered,which are used,Updated,FIT,rates for optical components used,FIT Rates-Improvements,FIT,(,previous,),FIT,(,today,),RR,(,previous,),%/,yr,RR,(,today,),%/,yr,Standard OLI,S42024-L5087-C423,10700,8537*,9.4,7.5,Basic OLI,S42024-L5087-C463,9600,5205,8.4,4.6,Calculation with respect to following conditions:,80,ch,load,40 deg C board temperature,*New OLI,type,in 3.12 will,reduce,FIT rate,further by approx,.15%,FIT decreases by additional 15%at 30 deg C(board temp.),