半导体集成电路概述.ppt

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,单击此处编辑母版标题样式,半导体集成电路,IC,常用术语,园片：硅片,芯片,(Chip,Die),：,6,、,8,：,硅（园）片直径：,1,25.4mm,6,150mm;,8,200mm;,12,300mm;,亚微米,1m,的设计规范,深亚微米,=0.5 m,的设计规范,0.5 m,、,0.35 m,设计规范（最小特征尺寸）,布线层数：金属（掺杂多晶硅）连线的层数。,集成度：每个芯片上集成的晶体管数,IC,工艺常用术语,净化级别：,Class 1,Class 10,Class 10,000,每立方米空气中含灰尘的个数,去离子水,氧化,扩散,注入,光刻,.,最小线宽变化,生产工厂简介,PSI,Fab,Two was completed,January 2,1996,and is a State of the Art facility.This 2,200 square foot facility was constructed using all the latest materials and technologies.In this set of,cleanrooms,we change the air,390 times per hour,if you do the math with ULPA filtration this is a,Class One facility.,We have had it tested and it does meet,Class One,parameters(,without any people working in it,).Since we are not making microprocessors here and we dont want to wear,space suits,we run it as a,class 10,fab,.Even though it consistently runs well below Class Ten.,Here in the,Fab,Two,Photolithography area,we see one of our,200mm,.35,micron I-Line Steppers,.this stepper can image and align both 6&8 inch wafers.,Another view of one of the,Fab,Two Photolithography areas.,Here we see a technician loading,300mm wafers,into the,SemiTool,.The wafers are in a 13 wafer Teflon cassette co-designed by,Process Specialties,and,SemiTool,in 1995.Again these are the,worlds first 300mm,wet process cassettes(that can be spin rinse dried).,As we look in this window we see the Worlds First true 300mm production furnace.Our development and design of this tool began in,1992,it was installed in December of 1995 and became fully operational in January of,1996,.,Here we can see,the loading of,300mm,wafers,onto the Paddle.,Process Specialties,has developed the worlds first production 300mm Nitride system!We began processing,300mm,LPCVD Silicon Nitride,in May of 1997.,2,500 additional square feet of State of the Art,Class One,Cleanroom,is currently processing wafers!With increased 300mm&200mm processing capabilities including more PVD,Metalization,300mm Wet processing/Cleaning capabilities and,full wafer 300mm.35um Photolithography,all in a Class One,enviroment,.,Currently our,PS300A,and,PS300B,diffusion tools are capable of running both 200mm&300mm wafers.We can even process the two sizes in the same furnace load without suffering any uniformity problems!(,Thermal Oxide Only,),Accuracy in metrology is never an issue,at Process Specialties.We use the most advanced robotic laser,ellipsometers,and other calibrated tools for,precision thin film,resistivity,CD and step height measurement,.Including our new,Nanometrics,8300 full wafer 300mm thin film measurement and mapping tool.We also use outside laboratories and our excellent working relationships with our Metrology tool customers,for additional correlation and calibration.,One of two,SEM,Labs located in our facility.In this one we are using a field emission tool for everything from looking at,photoresist,profiles and measuring CDs to double checking metal deposition thicknesses.At the helm,another one of our process engineers you may have spoken with Mark Hinkle.,Here we are looking at the,Incoming material disposition racks,Above you are looking at a couple of views of the facilities on the west side of,Fab,One.Here you can see one of our,18.5 Meg/Ohm DI water systems,and one of,four,10,000 CFM air systems,feeding this,fab,(left picture),as well as one of our,waste,air scrubber units,(right picture).Both are inside the building for easier maintenance,longer life and better control.,集成电路（,Integrated Circuit,IC,）,：,半导体,IC,，膜,IC,，,混合,IC,半导体,IC,：,指用半导体工艺把电路中的有源器件、无源元件及互联布线等以相互不可分离的状态制作在半导体上，最后封装在一个管壳内，构成一个完整的、具有特定功能的电路。,半导体,IC,双极,IC,MOSIC,BiCMOS,PMOS IC,CMOS IC,NMOS IC,摩尔定律,集成电路工业发展的一个重要规律即所谓摩尔定律。,Intel,公司的创始人之一戈登,摩尔先生在,1965,年,4,月,19,日发表于,电子学杂志,上的文章中提出，集成电路的能力将每年翻一番。,1975,年，他对此提法做了修正，称集成电路的能力将每两年翻一番。摩尔定律现在的表达：在价格不变的情况下，集成电路芯片上的晶体管数量每,18,个月翻一番，即每,3,年乘以,4,。,集成电路工业发展的另一些规律建立一个芯片厂的造价也是每,3,年乘以,4,；线条宽度每,6,年下降一半；芯片上每个器件的价格每年下,30%40%,。晶片直径的变化：,60,年：,0.5,英寸,65,年：,1,英寸,70,年：,2,英寸,75,年：,3,英寸,80,年：,4,英寸,90,年：,6,英寸,95,年：,8,英寸（,200mm,）,2000,年：,12,英寸（,300mm,）,2007,年十大半导体厂商排行,2007,年全球半导体营收额为,2703,亿美元，同比增长,2.9%,。英特尔营收仍然高居榜首，市场份额从去年的,11.6%,增至,12.2%,。三星排名第二，市场份额为,7.7%,。东芝第三，市场份额为,4.6%,。德州仪器第四，市场份额为,4.2%,。以下为,Gartner,评出的,2007,年,10,大半导体厂商：,1.,英特尔（,06,年第,1,）,2.,三星（,06,年第,2,）,3.,东芝（,06,年第,6,）,4.,德州仪器（,06,年第,3,）,5.,意法半导体（,06,年第,5,）,6.,英飞凌（,06,年第,4,）,7.,Hynix,半导体（,06,年第,7,）,8.,Renesas,科技（,06,年第,8,）,9.NXP,半导体（,06,年未进前,10,）,10.NEC,电子（,06,年未进前,10,）,Transistor Counts,1,000,000,100,000,10,000,1,000,10,100,1,1975,1980,1985,1990,1995,2000,2005,2010,8086,80286,i386,i486,Pentium,Pentium,Pro,K,1 Billion Transistors,Source:Intel,Projected,Pentium,II,Pentium,III,Courtesy,Intel,Moores law in Microprocessors,4004,8008,8080,8085,8086,286,386,486,Pentium,proc,P6,0.001,0.01,0.1,1,10,100,1000,1970,1980,1990,2000,2010,Year,Transistors(MT),2X growth in 1.96 years!,Transistors on Lead Microprocessors double every 2 years,Courtesy,Intel,Die Size Growth,4004,8008,8080,8085,8086,286,386,486,Pentium,proc,P6,1,10,100,1970,1980,1990,2000,2010,Year,Die size(mm),7%growth per year,2X growth in 10 years,Die size grows by 14%to satisfy Moores Law,Courtesy,Intel,Frequency,P6,Pentium,proc,486,386,286,8086,8085,8080,8008,4004,0.1,1,10,100,1000,10000,1970,1980,1990,2000,2010,Year,Frequency(Mhz),Lead Microprocessors frequency doubles every 2 years,Doubles every2 years,Courtesy,Intel,Power Dissipation,P6,Pentium,proc,486,386,286,8086,8085,8080,8008,4004,0.1,1,10,100,1971,1974,1978,1985,1992,2000,Year,Power(Watts),Lead Microprocessors power continues to increase,Courtesy,Intel,2006,年度中国集成电路设计前十大企业,炬力集成电路设计有限公司,中国华大集成电路设计集团有限公司,(,包含北京中电华大电子设计公司等,),北京中星微电子有限公司,大唐微电子技术有限公司,深圳海思半导体有限公司,无锡华润矽科微电子有限公司,杭州士兰微电子股份有限公司,上海华虹集成电路有限公司,北京清华同方微电子有限公司,展讯通信,(,上海,),有限公司,2006,年度中国集成电路与分立器件制造前十大企业,中芯国际集成电路制造有限公司,上海华虹,(,集团,),有限公司,华润微电子,(,控股,),有限公司,无锡海力士意法半导体有限公司,和舰科技,(,苏州,),有限公司,首钢日电电子有限公司,上海先进半导体制造有限公司,台积电,(,上海,),有限公司,上海宏力半导体制造有限公司,吉林华微电子股份有限公司,2006,年度中国集成电路封装测试前十大企业,飞思卡尔半导体,(,中国,),有限公司,奇梦达科技,(,苏州,),有限公司,威讯联合半导体,(,北京,),有限公司,深圳赛意法半导体有限公司,江苏新潮科技集团有限公司,上海松下半导体有限公司,英特尔产品,(,上海,),有限公司,南通富士通微电子有限公司,星科金朋,(,上海,),有限公司,乐山无线电股份有限公司,上海,中芯国际,上海华虹,NEC,电子有限公司,上海宏力半导体制造有限公司,上海先进半导体,上海新进半导体,宏力,上海贝岭,台积电,茂基,贝里斯旭庆,江苏省,苏州和舰,无锡华晶,无锡华润,无锡,58,所,常州柏玛,常州赛米微尔,苏州太仓西菱（拟建）,无锡上华,无锡华润,南京高新,浙江省,绍兴华越,杭州士兰,绍兴华越,宁波国微明华,宁波中伟,慈溪华泰,宁波联微,京津地区,天津摩托罗拉,北京首钢日电,清华大学微电子所,北京燕东,北京宇翔,中科院微电子中心,北京大学微电子所,中芯国际,粤闽地区,广东珠海南科,福建福州福顺,广东广州南科,广州深圳高科,东北、西北、西南地区,吉林华微,丹东安顺,沈阳,47,所,天水天光,西安,771,所,重庆,24,所,沈阳科希,硅技术（？）,乐山菲尼克斯,西北西安西岳,大连,Intel,大连理工大学,