AMOLED-LTPS-OLED介绍演示幻灯片.ppt

*,/56,QQ,：,406433680,AMOLED,Introduction to AMOLED,Basic Technologies,Future AMOLEDs,Introduction of Samsung Mobile Display,Market Trends,SMD(SDI SEC Joint Venture),Mobile Display Div.,Samsung,LCD,Mobile Display Div.,50%,50%,Samsung,SDI,Samsung Elec.&Samsung SDI to set up a Joint Venture,No.1 Mobile Display Company,1,2,3,Total Mobile Display Solution Provider,No.1 Mobile TFT-LCD Company,Leader in AMOLED Market,STNTFTOLED,Samsung Mobile Display Co.,LTD,SMD Competitiveness,SEC FAB+SDI Module,Best Quality,Operation&Process Dedicated to Mobile Biz,Cost Competitiveness,One-Stop Shopping(OLED+TFT+TSP+STN),Total Solution Provider,for Mobile Displays,Best,Collaboration,Structure,Worlds Largest,Capacity,(444M/Y),FPD Market Volume,2010,$127B,Source:iSuppli 2Q.07,Desktop,20,%,TV,47%,Mobile,32,%,Others,1,%,Display Panel Market Volume,Others:Industrial,Public Display,etc.,2006,Desktop,24,%,TV,43%,Others,$84B,Mobile,32,%,1,%,CAGR,8.7%,Low Cost Trend,Mobile Device Price,(Ref.2.0”QVGA TFT LCD,SDI Marketing 07 Q2),05,03,07,$5,$10,$15,$20,16,10,6,?,Module Price/Inch,SDI PDP Marketing(,06.3Q),TV Set Price,07,06,51,39,08,31,09,25,10,22,50,”,HD,$10,37,29,24,20,17,59,32,26,50,”,FHD,$20,$40,$30,$50,$60,44,42,”,HD,Set Price/Inch,09,Introduction to AMOLED,Evolution of Display,CRT,Bulky,Vacuum,Inorganic,LCD,Flat,Liquid/Gas,Inorganic,PDP,OLED,1st,Generation,2nd,Generation,3rd,Generation,Rigid Sheet,Solid,Organic,Flexible,Solid,Organic,Flexible,4th,Generation,Glass,Glass,O,L,E,D,AMOLED(Active Matrix Organic Light Emitting Diodes),What is AMOLED?,TFT,AMOLED,=,+,Silicon base TFT,(Single,a-Si,Poly Si),Oxide TFT,Organic TFT,Small Molecule,/Polymer,Phosphorescence,/Fluorescence,Classification,Unchangeable True Color,Comparison of Picture Quality,Color Purity,Low Grays,Contrast,Color Gamut,By Brightness,Outdoor,Readability,AMOLED,AMLCD,NTSC 100%,NTSC 10%,NTSC 80%,Viewing,Angle,Paper-like Thickness,Best Choice for Current Market Trend,Slim Design,11.5,mm,11.9,mm,6.9,mm,7.9,mm,13.9,mm,Pol,Glass,Pol,Glass,Backlight Unit,1.07t,2.6t,1.47t,0.52t,Thickness of AMOLED,0.37t,AMOLED,TFT(LTPS),Ferrari-like Speed,Fast&Robust Response time,0.001ms(1us),10ms,X 10,000,-10,70,25,(70ms),(10ms),Winter,(on sky slop),Room,(10ms),(0.01ms),(0.01ms),(0.01ms),Summer,(In a car),AMOLED,TFT LCD,(Nokia FINETECH 07,2.0”QVGA Display with Same Perceived Luminance),mWh,Low Power Consumption,Power consumption comparison,Energy Consumption,Typical Web Image,Typical UI Image,Typical Still Image,Typical Movie Page,TFT LCD,AMOLED,226mW,360mW,TFT LCD,AMOLED,226mW,164mW,TFT LCD,AMOLED,226mW,164mW,TFT LCD,AMOLED,226mW,31mW,Low Cost Structure,basically low material cost,Cost Comparison(2.0”),Increase(Encap glass),Increase(Complex Process),Remove,Reduce(IC integration),Remove,Reduce(1 sheet),Increase(OLED material),Glass,C/F,Pol.,BLU,D/IC,Etc,Total Material,Cost:85.5%,7.6%,30.3%,3.2%,13.6%,18%,12.8%,14.5%,Production,Cost,AMOLED,Ref,:SDI(06.1),AMLCD,Glass+Encap,Pol.,BLU,D/IC,Etc,C/F,?,Scalable Process(Gen.5),Simple Process Step,Cost Strategy,AMOLED Development History,Basic Technologies,AMOLED Process,Glass loading,TFT process,TFT Process,OLED Process,OLED deposition,Cathode depo.,Encapsulation Process,desiccant,Seal&Encapsulation,Module Process,Driver IC Attachment,FPC,Evaluation,Process,TFT Process,a-Si:H,Poly Si,Single Si,Crystallization,TFT,Carrier Mobility,0.5-1 cm,2,/V-sec,50-200 cm,2,/V-sec,600 cm,2,/V-sec,Design Rule,4-5um,1-3um,0.1um-0.25um,Vth,2-4V,1-2V,Va,GB protrusion,-Panel Size limitaion,Max.:,32”Max.,Laser length,limitation(465mm),-Short range non-uniformity,E/D,1,st,2,nd,3,rd,285,91,1,Distance,Result Problems,Low trough-put,High maintenance cost,Low stability of laser,High investment cost,High process cost,Narrow process window,LTPS TFT Key Process-ELA,a-Si TFT,poly-Si TFT,Oxide TFT,Generation,8G,4G,8G,Semiconductor,Amorphous Si,Polycrystalline Si,Amorphous IGZO,TFT uniformity,Good,Poor,Good,Channel Mobility,1cm,2,/Vs,100 cm,2,/Vs,10 90 cm,2,/Vs,TFT for OLED,45,511,45,Pixel Circuit,Simple(1T+1C),Complex(5T+2C),Simple(2T+1C),Cost/Yield,Low/high,High/low,Low/high,Vth(I,DS,=3uA,30khr),30V,1lm/W)and stability,1987 Doped,heterostructure thin-film OELD,(C.W.Tang and S.A.VanSlyke,Appl.Phys.Lett,.51,913(1987),1990 PPV LED(Friend,et al,Cambridge,Nature,347,539(1990);USP 5,247,190),1992 Flexible“plastic”LED(Heeger,et al,UCSB,Nature,357,477(1992),1997 First commercial product(Car Stereo,Pioneer).,1998 Ink-jet printing of polymer OELD(Yang Yang,UCLA,MRS98;CDT-Seiko-Epson).,2000 Pentacene,tetracene single crystals(B.Batlogg,Bell Labs),-FET Mobility of a-Si:H 1cm,2,/Vs,2000 Nobel Prize in Chemistry,(Alan J.Heeger,Alan G.MacDiarmid,Hideki Shirakawa),Organic devices:A Brief History,Electron,Transport,Layer,(ETL),Emission,Layer,(EML),Hole,Transport,Layer,(HTL),Anode,(ITO),Cathode,(low Work function,Ca,Al:Li,Mg:Ag),-,electron,Hole,+,-,+,100 200 nm,Exciton,1)Carrier Injection(balanced injection;N,e,=N,h,),2)Carrier Transport(bipolar transport;m,e,=m,h,),3)Electron-hole recombination and exciton formation,4)Radiative and non-radiative recombination of excitons and energy transfer,Light,output,OLED Structure,Evolution of OLED,1960 1970 1980 1990 2000,Cathode,EML,Anode,Substrate,Single Layer,Cathode,ETL,EML,HTL,Anode,HIL,Substrate,Multi Layer,S/M Fluorescent,Cathode,ETL,HBL,EML,HTL,HIL,Anode,Substrate,Cathode,EML,HTL,Anode,Substrate,Double Layer,Polymer,Multi Layer,S/M,Phosphorescent,OLED Device Design,transparent electrode,low surface roughness,high work function,low work function metals,Hole transport,(high hole mobility),Electron blocking,intermediate work function,btw anode and HTL,Enhance injection efficiency,of holes from anode,Good contact with anode,Smoothening effect on ITO,Metal-organic complex,Electron transport,Hole blocking,Host-dopant system,Energy transfer,from host to dopant,Light emitting,anode,cathode,EML,HIL,EIL,ETL,HBL,HTL,EML,HTL,HBL,ETL,HIL,Simulation,Role of each layers,Comparison of LEDs,Inorganic Semiconductor LEDs,Organic Semiconductor LEDs,Glass,ITO,HIL,HTL,ETL,Cathode,EML,Recombination,Emission of Light,+,Injection:Barrier Height,Transport:Mobility,Traps,Space Charge,Recombination:Exciton,Recombination,Fluorescence vs.Phosphorescence,25%,75%,Material Progress,Efficiency,Efficiency increase(50100%),Voltage Drop(V,OLED,67V,4V),white 150nit,white 150nit,OLED Structure Optimization,Life time,Color Generation Methods,Individual Patterning,White+Color Filter,One color EL+CCM,Structure,Material,S/M-FMM,LITI,Polymer-Ink-jet,LITI,C/F Encapsulation,COA,Blue EL+CCM,Company,SDI,Sony,LGD,CMEL,Kodak,SEC,Sony,Idemitsu Kosan,Merit,High Efficiency,Long life time,High color purity,Process Yield,High resolution pattern,Scalability,Process Yield,High resolution pattern,Scalability,Demerit,Scalability,High resolution,patterning,High cost,Low efficiency of White,materials,Low reliability of White,High cost,low efficiency of CCM,Color purity,B,G,R,B,G,R,B,G,R,C/F,C/F+CCM,OLED,OLED,OLED,Comparison of Color Patterning,Items,Evaporation,(Shadow Mask),Ink-Jet Printing,LITI,Materials,Small Molecule(SM),Polymer(LEP),LEP,SM,Hybrid,Position Accuracy,15,10,3.0,Resolution,Gen.7,Simple and economical process,Material development issue(Special ink),Size:Gen.4,Dry Patterning,Multi-stacking,Donor film required,Emission Structure,Bottom emission,Top emission,Sturcture,Pro.,Simple Process,High aperture ratio,Long Life time,Con.,Low color purity,Low resolution,Need precise process control,Resolution,200 ppi,Color Purity,7080%,100%,(Using Micro cavity effect),OLED Process,Transparent Anode,Metal Cathode,Opaque Desiccant,Reflective Anode,Transparent Cathode,Transparent Desiccant,Anode(ITO),ETL,HIL,EML,HTL,Cathode(Metal),Reflective Anode,ETL,HIL,EML,HTL,Transparent Cathode,Encapsulation,Conventional Encapsulation,New-Filing Encap.,Substrate,Encapsulation glass or metal can,Getter,OLED,Sealant,1.5mm thick,Glass distortion,glass bending by press and high cost,Hydride encap by hot roll lamination,Inorganic multilayer stack NONON,Barix organic-inorganic multilayer,Substrate,Passivation,OLED,0.5mm,Filling material,Encap.glass,Substrate,Passivation,OLED,1.5mm,Inorganic organic,(Ref.GE),New Thin Film Encap.,Technical Issues of AMOLED,Low Power,Color Gamut,Brightness,Image Robustness,(Viewing angle,Temperature,Pressure),Outdoor readability,Slim&Light,Flexibility,Investment&Yield,Scalability,Material cost,Image sticking,Low Cost,Form Factor,High Image Quality,Operate time&Bright,High Resolution,Solution,Material,Micro Cavity,Peak Brightness,Dynamic C/R,Optical Design,Circuit,Circuit,Optical Film,Thin Film Encapsulation,Bendable,Flexible,Mask step reduction,Simple,Oxide TFT,Soluble process,Material/Device,Circuit,Material/Device,GUI,Circuit,FMM,LITI,WOLED,Part integration,Material Yield,Requirements,Future AMOLEDs,NEC,Head Mount Display,Bendable Display,Flexible Display,Source:Nokia,/,Tony Blanchet-Ruth,Source:eMagin,Source:Philips,Source:Sony,Transparent Display,Wall Display,3D Display,Wearable Display,Source:Lunar Design,/France Telecom,Future Display,Art&Construction,High Resolution 3D Display,High Resolution 3D,Fast Response of AMOLED,Frame Rate:120Hz,2D resolution=3D Resolution,2.4”4View 3D AMOLED,High resolution 3-D AMOLED,Right Eye,Left Eye,TD(Time Division)Parallax Barrier,4.3,”,WQVGA 3D AMOLED,Samsung SDI(SID2006),Touch Screen Display,Capacitive type sensor integrated,on encapsulation glass of AMOLED,Developing Algorithm,Developing combined ICs,DDI +TDI,2.6”QVGA capacitive type TSD,Integrating TSP on Encapsulation glass of AMOLED.,Increasing transmittance and reducing the module thickness.,Cost reduction as merging each IC functions,DDI and TDI.,AMOLED,TSP,Dual Display,Both Emission Display,Ultra slim Dual Phone,Dual mode Monitor,Slim Notebook with sub display,Transparent Display,Same Image,2.2”QCIF,Samsung SDI(2004),Sub+Main,Samsung SDI(SID 2005),2”QVGA+Sub,Different Image,2”QVGA,Samsung SDI(SID2006),Bendable Display,Ultra slim Bendable AMOLED,2.4”bendable display,0.25mm(Panel+Polarizer),4.0”bendable display,0.25mm(Panel+Polarizer),4.8”Flapping Display(FPD 2008),Thickness:50um,2”Passport Display(SID 2008),Foldable Display,Collaborate with SAIT,Seamless,Top Emission Structure,Thin Film Encapsulation,Foldable AMOLED,(SID 2008,FPD international 2008),AMOLED using thin film encapsulation technology can realize,seamless foldable display due to the absent of opaque seal area,Transparent Display,12.1”x 4 Window Display,(FPD international 2008),No C/F&No Backlight,Transparent C,olor Display,4.8”Transparent Display,(SDI 2008),Flexible AMOLED,Flexible AMOLED on Metal Foil,(5.6”SID 2006),Metal Foil Substrate,LTPS TFT,Scan driver Integration,Top Emission Structure,Thin Film Encapsulation,Ultra Thin(140um),Flexible AMOLED on plastic,(6.5”FPD International 2008),Plastic Substrate,Top Emission Structure,Thin Film Encapsulation,Ultra Thin(20um),OLED Light,Source:GE Global Research,White OLED is a solution for large area display and high resolution display,White OLED also has potentials of flat and flexible lighting application.,Source:Panasonic,Updated by C.H.Lee based on the data in J.R.Sheats,et al.,Science 273,884(1996)and recent results on OLEDs.,OLED Efficiency,OLED Efficiency Doubles Every Year:Extension of Haitzs Law on LED,Thank You!,