CADCAM详细介绍.pptx

Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,CAD/CAM培训教材,Edition:CKH/2002_1023,课堂守则,请将手机、,BP,机等通讯工具调到震动状态。,请勿在上课期间，随意进出，以免影响其他同事。,请勿交头接耳、大声喧哗。,如有特殊事情，在征得培训导师的同意的情况下，方可离场。,以上守则，各位学员共同遵守,。,前言,中国,PCB,产业属性，几乎是以，也就是受客户委托制作空板（,Bare Board）,而已，不像美国，很多,PCB Shop,是包括了线路设计，空板制作以及装配,Assembly),的,Turn-Key,业务。以前，只要客户提供的原始资料如,Drawing,Artwork,Specification，,再以手动翻片、排版、打带等作业，即可进行制作，但近年由于电子产品日趋轻薄短小，,PCB,的制造面临了几个挑战:,（1）薄板（2）高密度（3）高性能（4）高速(5)产品周期缩短（6）降低成本等。,以往以灯桌、笔刀、贴图及照相机做为制前工具，现在己被计算机、工作软件及激光绘图机所取代。,过去，以手工排版，或者还需要,Micro-Modifier,来修正尺寸等费时耗工的作业，今天只要在,CAM(Computer Aided Manufacturing),工作人员取得客户的设计资料，可能几小时内，就可以依设计规则或,DFM(Design For Manufacturing),自动排版并变化不同的生产条件。同时可以,output,如钻孔、成型、测试夹具等资料。这就是,CAD/CAM,的过程。首先来了解一下本公司,PE,部对客户资料是如何处理的。,制前准备,Table of Contents,Part I:PCB CAD/CAM Introduction,(40 minutes),Customer Data,CAD,文件格式,CAD/CAM 名词的定义与解说,Laser Plotter&Developer&Artwork,DFM,Netlist,DRC,Part II:CAD/CAM Process,(20 minutes),Tooling Fabrication Flowchart,Input,PCB&Panel Editing,Drill Editing,OL&IL Editing,Part I:PCB CAD/CAM Introduction,客户必须提供的资料：,电子厂或装配工厂，委托,PCB SHOP,生产空板（,Bare Board）,时，必须提供下列资料以供制作。见表料号资料表-供制前设计使用.,客户资料,项目,内容,格式,1.,资料,P/N,包含此,P/N,的版别、更改历史、日期以及发行资讯。,和,Drawing,一起或另有一,Text,档。,2.,工程图,A.,P/N,工程图：,包括一些特殊要求，如原物料需求，特性阻抗控制、防焊油墨、文字种类、颜色、尺寸公差、层次等。,HPGL,及,Post Script,B.,钻孔图,此图通常标示孔位,孔径及孔符,HPGL,及,Post Script,C.,成品外围图,包含每一小片的位置、尺寸、折断边、工具孔相关规格、特殊符号以及特定制作流程和容差。,HPGL,及,Post Script,D.,压板结构图,包含各导体层，绝缘层厚度，阻抗厚度等。,HPGL,及,Post Script,3.,菲林资料,(,Artwork Data,A.,线路层,B.,防焊层,C.,文字层,Gerber,(RS-274),4.,Aperture List,定义：各种,pad,的形状，一些特别的如,thermal pads,并须特别定义,construction,Text file,文字档,Customer Data,客户资料,项目,内容,格式,5.,钻孔资料,定义：,A.,孔位置,B.,孔径及孔符,C.,孔类型(,PTH&NPH),D.,埋孔及盲孔层,Excellon Format,6.,钻孔工具档,定义：,A.,孔径,B.,电镀状态,C.,盲埋孔,D.,档名,Text file,文字档,7.Netlist,资料,定义线路的运通,IPC-356,or,其它从,CAD,输出之各种格式,8.,制作规范,1.,指明依据之国际规格，如,IPC，MIL,2.,客户自己,PCB,进料规范,3.特殊产品必须,meet,的规范如,PCMCIA,Text file,文字档,客户资料,上表资料是必备项目，有时客户会提供一片样品,一份零件图，一份保证书（保证制程中使用之原物料、耗料等不含某些有毒物质）等。这些额外资料，厂商须自行判断其重要性，以免误了商机。,Customer Data,Artwork Film,Drill,Drawing,Netlist,CAM Format,Gerber RS274D,Excellon I,HPGL 1,IPC-D-356,ODB+,Gerber RS274X,Excellon II,HPGL 2,IPC-D-356A,Image,Barco DPF,Trudril,AutoCAD DXF,Mentor Netlist,PADS 2000,SM 1000,ATI,SM 3000,Hitachi,CAD/CAM,文件格式,相关,CAD/CAM,名词的定义与解说,A Gerber file,这是一个从,PCB CAD,软件输出的资料文件做为光绘图语言。1960年代一家名叫,Gerber Scientific（,现在叫,Gerber System）,专业做绘图机的美国公司所发展出的格式，尔后40年，行销于世界多个国家。几乎所有,CAD,系统的发展，也都依此格式作其,Output Data，,直接输入绘图机就可绘出,Drawing,或,Film，,因此,Gerber Format,成了电子业界的公认标准。,CAD/CAM,名词的定义与解说,B.RS-274D,Gerber Format,的正式名称，正确称呼是,EIA STANDARD RS-274D(Electronic Industries Association),主要两大组成：1.,Function Code：,如,G codes,D codes,M codes,等。2.,Coordinate data：,定义图像（,imaging）,RS-274D&RS-274X,C.RS-274X,是,RS-274D,的延伸版本，除,RS-274D,之,Code,以外，包括,RS-274X Parameters,，,或称整个,extended Gerber format,它以两个字母为组合，定义了,Aperture,及,XY Coordinate.,D.ODB+,ODB+,是,Orbotech/Frontline,发展出来的一套,CAD CAM,format,可以很容易由,PCB CAD/CAM,产生,然后依此系统,PCB SHOP,再产生,Artwork Film,NC Drill Program,Netlist,并可直接输入,Laser Plotter,绘制底片,.,ODB+,Laser Plotter,见图,输入,Gerber format,或,IPC 350 format,以绘制,Artwork,Laser Plotter,Aperture,镜头孔径,Gerber,资料,代表意义,X002Y002D02*,移至(0.2,0.2)快门开关,D11*,选择,Aperture2,D03*,闪现所选择,Aperture,D10*,选择,Aperture1,X002Y0084D01*,移至(0.2,0.84)快门开关,D11*,选择,Aperture2,D03*,闪现所选择,Aperture,D10*,选择,Aperture1,X0104Y0084D01*,移至(1.04,0.48)快门开关,D11*,选择,Aperture2,D03*,闪现所选择,Aperture,D12*,选择,Aperture3,X0104Y0048D02*,移至(1.04,0.48)快门开关,D03*,闪现所选择,Aperture,X0064Y0048D02*,移至(0.64,0.48)快门开关,D03*,闪现所选择,Aperture,Aperture Table,Dcode,Shape,Size,D10,Round,5,D11,SMD,50 x 100,D12,Donut,100-70,Gerber+Aperture,将PCB文件转换为GERBER文件和钻孔数据后,交PCB厂制板的原因,大多数工程师都习惯于将PCB文件设计好件转换为GERBER文件和钻孔数据后交PCB厂，为何不直接,把文件设计好后直接送,PCB厂加工呢？,因为电子工程师和PCB工程师对PCB的理解不一样，由PCB工厂转换出来的GERBER文件可能不是您所要的，如您在设计时将元件的参数都定义在PCB文件中，您又不想让这些参数显示在 PCB成品上，您未作说明，PCB厂依葫芦画瓢将这些参数都留在了PCB成品上。这只是一个例子。若您自己将PCB文件转换成GERBER文件就可避免此类事件发生。,GERBER文件是一种国际标准的光绘格式文件，它包含RS-274-D和RS-274-X两种格式，其中RS-274-D称为基本GERBER格式，并要同时附带D码文件才能完整描述一张图形；RS-274-X称为扩展GERBER格式，它本身包含有D码信息。常用的CAD软件都能生成此二种格式文件。,底片与程序：底片,Artwork,在,CAM,系统编辑排版完成后，配合,D-Code,档案，而由镭射绘图机（,Laser Plotter）,绘出底片。所须绘制的底片有内外层之线路，外层之防焊，以及文字底片。由于线路密度愈来愈高，公差要求越来越严谨，因此底片尺寸控制，是目前很多,PCB,厂的一大课题。下表是传统底片与玻璃底片的比较表。玻璃底片使用比例已有提高趋势。而底片制造商亦积极研究替代材料，以使尺寸之安定性更好。例如干式做法的铋金属底片.,Artwork,传统工作底片,玻璃底片,尺寸安定性,最易受温度和相对湿度影响,几乎不受相对湿度影响，且温度效应为传统底片的一半。,耐用性,基材易起趋纹且封位孔易受磨损,易破碎，但不易起趋纹,操作/储存/运送,较轻且具柔软性容易运送及储存,较重，需小心防碎，要注意储存运送空间，并注意其重量。,使用于一般的曝光,适用于所有曝光设备,需调整设备或特殊设备。,绘图机,适于一般自动化处理机,碟式或特殊平板处理机。,价格,便宜,贵,Artwork,显影 定影 水洗 烘干,菲林冲片机,一般在保存以及使用传统底片应注意事项如下：1).环境的温度(22,3,C),与相对湿度(55,5%),的控制 2).全新底片取出使用的前置适应时间(,min.24 hrs),3).取用、传递以及保存方式 4).置放或操作区域的清洁度,底片环境控制,Future Trend:LDILaser Direct Imaging,DRC,Design Rule Check(DRC):设计规则,检查,主要检查客户设计是否符合设计者所制定的规则，同时也需确认所制定的规则是否符合印制板生产工艺的需求，,一 般检查有如下几个方面：,线与线，线与元件焊盘，线与贯通孔，元件焊盘与贯通孔，贯通孔与贯通孔 之间的距离是否合理，是否满足生产要求。,电源线和地线的宽度是否合适，电源与地线之间是否紧耦合（低的波阻抗）？在PCB中是否还有能让地线加宽的地方。,加在PCB中的图形（如图标、注标）是否会造成信号短路。,在PCB上是否加有工艺线？阻焊是否符合生产工艺的要求，阻焊尺寸是否合适，字符标志是否压在器件焊盘上，以免影响电装质量。多层板中的电源地层的外框边缘是否缩小，如电源地层的铜箔露出板外容易造成短路。,Manufacturing Analysis,DFMDesign for manufacturing,(,加工设计,/,为制造着想的设计),Pcb lay-out,工程师大半不太了解，,PCB,制作流程以及各制程需要注,意的事项，所以在,Lay-out,线路时,，仅考虑电性、逻辑、尺寸等，,而甚少顾及其它。,PCB,制前设计,工程师因此必须从生产力，优良,率等考量而修正一些线路特性，,如圆形接线,PAD,修正成泪滴状，,见图2.5,为的是制程中,PAD,一孔对,位不准时，尚能维持最小的垫环,宽度,DFM,DFM,Minimum Pad Size=a+2b+c,Where:,a=Maximum finished hole diameter,b=Minimum annular ring requirements,c=A standard fabrication allowance,IPC-2221-9.1.1),Maximized Land,Key Holing,Filleting,Corner Entry,Not Preferable,Preferable,(IPC-2221-9-1),Level A,General Design Complexity Preferred,0.4 mm,16 mil,Level B,Moderate Design Complexity Standard,0.25 mm,10 mil,Level C,High Design Complexity,Reduced,0.2 mm,8 mil,Minimum Standard Fabrication Allowance,Not Preferable,Preferable,Land(Pad)Requirements,In order to meet annular ring requirement particularly while breakout is not desirable,the pad size requirement shall be determined by the following equation:,Example of land size calculation:,Given:4 layer,1 oz base Cu,Level B,Finished hole size=13,3 mil,Max.finished hole size=16 mil,Min.annular ring=2 mil,Fabrication allowance=10 mil,Minimum land size=16+2(2)+10 =30 mil,1 For copper weight greater than 1oz/sq.ft,add 2 mil minimum to c for each additional oz/sq.ft.of copper used.,2.For more than 8 layers add 2 mil,(IPC-2221-9.1.1),DFM,NPTH Wall To Copper,Requirement,PTH Wall To Copper Requirement,In order to improve yield,PTH wall to copper spacing for inner layer should be kept at minimum 13 mil.This 13 mil is the alignment allowance for pressing,drilling and film registration.,NPTH wall to copper spacing should be designed preferably at minimum 10 mil.This allowance is particular necessary to ensure dry film has enough bonding area to adhere on the pcb.The purpose of covering NPTH hole with dry film is to avoid the hole to be plated.,Inner Layer Opening,Requirement,Due to process allowance,inner layer clearance on power or ground layer should be designed preferably with at least 10 mil clearance.,Drilled Hole,Opening Clearance,Cu,(Minimum 10 mil),Hole To Hole Spaces,Requirement,Conductor Widths&Spaces Requirement,Conductor widths and spaces shall be maximized whenever feasible.In order to maintain the conductor widths and spaces specified on the master drawing,conductor widths and spaces on the production master should be compensated for etching process allowance.,Cu Weight,Min.LW/LS,Inner Layer,Hoz,1oz,3mil/3mil,3mil/3mil,Outer Layer,Hoz,1oz,2oz,4mil/4mil,5mil/5mil,6mil/6mil,Red Area:Compensate for etching allowance,In order to improve yield in Desmear process,drilled hole edge to drilled hole edge spaces shall be designed with at least 11 mil distance in between.,11 mil,Please see below table for Viasystems drilled hole size calculation:,Drilled Size Calculation for PTH,Drilled Hole,Hole Size,Drilled Size,+A,D,-B,HAL,Gold Plating/Entek,Immersion Gold,D+(A-B)/2+6 mil,D+(A-B)/2,+4 mil,Drilled Size Calculation for NPTH,Hole Size,Drilled Size,+A,D,-B,D+(A+B)/2,Choose the nearest bigger drill bit step,For D=X.YZ mm,IF,Drill Bit Size,3 Z 0,X.Y0,7,Z,3,X.Y5,10,Z 7,X.(Y+1)0,Drill Bit Size Selection,Please see below table for Viasystems minimum conductor widths and spaces requirements on customer design.,DFM,DFM Sample File,Genesis DFM,但是制前工程师的修正，有时却会影响客户产品的特性甚或性能，所以不得不谨慎。,PCB,厂必须有一套针对厂内制程上的特性而编辑的规范除了改善产品优良率以及提升生产力外，也可做为和,PCB,线路,Lay-out,人员的沟通语言，见图.,DFM,AOI,程序设计,由,CAD/CAM,直接产生,CAD reference,文件,。,AOI,系统可直接讀取文件.比以往使用金板製作程式更準確,。,AOI,A,Net,is a set of contiguous points connected by a conductive path.,All the points in a net are electrically connected through traces and plated drills on the printed circuit board.,What is a net?,A,Netlist,is a list of nets stored in a data file which define the conductivity inter-connection scheme of a bare circuit board.,What is a Netlist?,A netlist is a list of nets stored in data file which define the conductivity interconnection scheme of a bare circuit board.Comparison of customer netlist with the graphical data is imperative to ensure design integrity is being maintained during editing stages.Netlist provided by customer should be bare board netlist.,Accepted Formats:,IPC-D-356,IPC-D-356A,Mentor,Netlist Information,C IPC-D-356 Bare Board Electrical Test Information,C Based on the IPC-D-356 document,C Assumptions:1)All points are assumed to be end points.,C Column 32 will then always be blank.,317+42V AL1 -5C,317GND AL1 -5E,317NCAB SIGN1A-10A,317N/C SIGN1A-5B,317CKH SIGN1A-7B,367Mounting Hole Tool -1,.,999,D0280PA00X-015850Y+029075X0480Y0480R000 S0,D0280PA00X-015850Y+030650X0480Y0480R000 S0,D0280PA00X-024413Y+027500X0480Y0480R000 S0,D0280PA00X-028350Y+028287X0480Y0480R000 S0,D0280PA00X-026776Y+028287X0480Y0480R000 S0,D1250UA00X+000000Y+000000X1250Y1250R000 S3,Sample IPC-D-356 Test File,The format in supplied IPC-D-356 and IPC-D-356A should complies with the description of the IPC-D-356 specification.,Sample IPC-D-356A Test File,P JOB P023003A.ipc,P UNITS CUST,P TITLE P023003A.ipc,P NUM 23003,P REV 300,P VER IPC-D-356A,P IMAGE PRIMARY,C,367 -D1970UA00X-001590Y+055374X1970Y0000 S0,367 -D1970UA00X-001583Y+001438X1970Y0000 S0,327NET1 -M A01X-002235Y+037065X0150Y0000 S1,327NET1 -M A01X-002235Y+037235X0150Y0000 S1,317NET1 -M A01X-002150Y+037150X0250Y0000 S1,017NET1 -MD0160PA00X-002150Y+037150,327NET1 -M A02X-002150Y+037150X0135Y0000 S0,317NET1 -M A02X-002150Y+037150X0250Y0000 S2,017NET1 -MD0160PA00X-002150Y+037150,327NET2 -M A02X+040700Y+035450X0135Y0000 S0,317NET2 -M A02X+040700Y+035450X0250Y0000 S2,017NET2 -MD0160PA00X+040700Y+035450,327NET2 -A01X+040735Y+031350X0380Y0310 S0,327NET2 -M A01X+040818Y+035425X0150Y0000 S1,327NET2 -M A01X+040820Y+035450X0150Y0000 S1,078 X28671 X28748Y5845 X29898 X30245Y5498 Y5198 X30498Y4945 X31053 X31305Y5198,078 Y6597 X31503Y6795 X36998 X37245Y6548 Y4398 X37395Y4248 Y2753 X37048Y2405,078 X36503 X35805Y3103 Y3703 X35553Y3955 X33998 X33698Y3655 X32447 X31698Y2905,078 X29248 X28748Y2405 X26253 X26055Y2603 Y5317 X26918 X27083Y5483 Y5718,078 X26918Y5883 X26175 Y6018 X27153Y6995 X28298,999,IPC-D-356,与,IPC-D-356A,的分别,As with 356,356A carries information required for electrical test:,Location,size,and accessibility of pads and holes on the board.,Netlist information,showing what pads and holes should be on the same net.,Header information giving the name and revision of the board,and so forth.,IPC-D-356A adds considerable information:,Location and width of conductors.,List of nets which are adjacent to each other.(This shows where shorts are likely.),Actual test probe locations,as opposed to just the location of the pad.,The size,shape,and location of the soldermask openings,independent of the pad.,Support for blind and buried vias.,Longer net names(up to 57 characters)are allowed.,Support for buried resistance.,A variety of non-test features,such as fail marks.,The board outline.,Support for high voltage tests.,Support for impedance tests.,Support for stepped images.,IPC-D-356A also changes the handling of some information from 356:,In 356A,there are stringent requirements for the order of data in the file.IPC-D-356 does not have these requirements.,IPC-D-356 supports an optional variable record format.Support for this format has been dropped in 356A.,IPC-D-356 uses fixed-column records.Trailing spaces must be included in the file.IPC-D-356A allows trailing spaces to be left out of the record.,IPC-D-356 was unclear on how records should be terminated,resulting in a variety of approaches by file writers.IPC-D-356A mandates that records be terminated by a CR/LF pair.,The result is that 356A files are much more powerful than 356 files,but are easier to read than 356 files.IPC-D-356A files are in many respects easier to write than 356 files,although the sorting requirements of 356A may add complexity to a writer.On balance,however,356A files are also easier to write than 356 files.,#,#date:Monday June 2,1997;18:46:15,#,#,#Board Information,#,BOARD SYSTEST_BOARD OFFSET x:0.0 y:0.0 ORIENTATION 0,B_UNITS Inches,#,#Attribute Information,#,B_ATTR MILLING_ORIGIN MILLING 0 0.0 0-0.4-4.0,B_ATTR DRILL_ORIGIN 0.0 0.0,B_ATTR BOARD_DEFINITION_IDENTIFIER 0 0,.,#Nets Information,#,NET/+8VTO10V,COMP C1 PN-150uFCAP 150uFCAP cl23_d5-0.2-2.0 1 0,C_PIN C1-1-0.2-2.0 0 1 0 term_1/N$577,C_PIN C1-2 0.6-2.0 0 1 0 term_1 GROUND,.,#,#Hole Information,#,HOLE PTH-0.2-3.8 0.093,HOLE PTH-0.2-1.2 0.093,HOLE PTH 3.9-1.2 0.093,#,#Pad Information,#,PAD VIA VIA_1 Thru 0.03,P_SHAPE VIA_1 PHYSICAL_1 CIRCLE 0.05,P_SHAPE VIA_1 PHYSICAL_2 CIRCLE 0.05,.,Genesis Manual,0403.1199,pg 42,43,Sample Mentor File,指,ETest,电测,Netlist,档,.,由,CAD/CAM,产生,ET,系统可接受的资料，而电测,Net list,档则用来制作电测治具,Fixture,。,Electrical Test,Part II:CAD/CAM Process,Drill,Data,Inner,Layer,Rout,S/M,C/M,Outer,Layer,ET,Input,DRC (CAM Checking),Tooling Fabrication Flowchart,No,Customer Fabrication,Package,1,st,Input(Engineer),2nd Input(Supervisor),Compare Two,Input Results,(D-code,Layers,&Report),Result,Analysis,Discrepancy,Occurs,No Discrepancy,Input Error,Notify,MI Group,Customer,Data Error,If,Customer Netlist,Exist?,Generate,CAD Netlist,Convert CAD Netlist,To Reference Netlist,For Film Fabrication,Reference,Compare Customer,Netlist with Generated,CAD Netlist,No Discrepancy,Discrepancy,Occurs,Result,Analysis,Customer,Netlist Error,Convert Generated,CAD Netlist,To Reference Netlist,For Film Fabrication,Reference,Notify MI Group,To Request Netlist,From Customer,Yes,No,Redo,Input,Input Error,Input Flowchart,Input,多层板时，若客户资料中无表示,Thermal,的字符时，需高度注意，部分客户的,Thermal Aperture,与,Circle,，,Round,同名，只是在文件头中,Power,一项设置为,True,，,则此时需把这种,Circle Input,为,Thermal,。,若两种情况都无，则需查清是否内层中孔与,GND,直接相连。,客户给出,Spuare,或,Rectangle,一项中，将会分,X,、,Y,。,X,表示水平，,Y,则表示坚直方向。,Input,时需以此为依据，若客户无标明及相关说明则检查图像中是否有,SMD,全部重叠在一条直线上，若有则表示,X,、,Y,颠倒，需更正。,客户设计中如有,0,mil Aperture,时，需确定这些,Aperture,代表内容，如为相关蚀字或白字，则需加到,56,mil,，,供,MI,参考，并提示出来。,Input,注意事项,CAM Checking,P2L,L2P,T2C,L2L/P,*,SLOT,长大于等于宽两倍时，总长加,2,mil,；,长小于宽两倍时加,3,mil,并加补偿。,*,为避免尾孔钻出板外，切记尾孔最大孔孔壁距,UNIT,板边,70,mil,。,*做完钻带必须优化。,*,检查,Template,须逐一检查,MI,所有关于孔的标数、,Size,，,并用红胶片一个单元去拍其它单,元检查是否少孔或多孔。,Drill,PCB EDITING,1、,EDITING,通过,CAD/CAM WORK