PCB工程部专业英语词汇.doc

PCB 工 程 部 专 业 英 文 词 汇
词汇
1. 板料: material
2. 最低限度: minimum 或者min.
3. 最大限度: maximum 或者max.
4. 基准点(零点) datum point
5. 周期 Date code
6. V-cut余厚 V-cut remain thickness
7. 抢电铜皮（假铜） dummy copper
8. 实物板 actual board
9. 外形及尺寸错误 dimension error
10. 异常情形 error data file
11. 焊锡面与零件面对位偏差 misregistration
12. 孔塞 plug hole
13. 要求 requirement
14. 缺少 miss
15. 偏公差 uneven tolerance
16. 补偿 compensation
17. 表面处理 surface treatment
18. 无铅喷锡 Lead free HAL
19. 金手指斜边 bevel of G/F
20. 制程能力 process capability
21. 建议,暗示 suggest
22. 确保 ensure
23. 满足,达到 meet
24. 为了 in order to
25. 交货期 delivery date
26. 绿油桥 solder mask bridge 或者 solder mask dam
27. 根据 according to
28. 单边3mil per side 3 mil
29. 直径 diameter
30. 半径 radius
31. 小于3mil less than 3mil
32. 高于3mil more than 3 mil
33. 压合结构 stacking structure 或者stack_up
34. 附件：attached file
35. 样品：sample
36. 文档Document
37. 答复：answer; reply
38. 规格：spec
39. 与...同样的：the same as
40. 前版本：previous version(old version)
41. 生产：production
42. 确认：confirm
43. 再次确认：confirm again
44. 工程问题：engineering query（EQ）
45. 尽快：as soon as possible
46. 生产文件：production Gerber
47. 联系某人：contact somebody
48. 提交样板：submit sample
49. 交货期：delivery date
50. 电测成本：ET（electrical test）cost
51. 通断测试：Open and short testing
52. 参考：refer to
53. IPC标准：IPC standard
54. IPC二级：IPC class 2
55. 可接受的：acceptable
56. 允许：permit
57. 制造：manufacture 或者 fabricate
58. 修改：revision
59. 公差：tolerance
60. 忽略：ignore
61. 工具孔：tooling hole
62. 安装孔：mounting hole
63. 元件孔：component hole
64. 槽孔：slot hole
65. 邮票孔：snap off hole 或者stamp hole
66. 导通孔：via hole
67. 盲孔： blind via hole
68. 埋孔：buried via hole
69. 金属化孔：PTH(plated through hole)
70. 非金属化孔：NPTH( no plated through hole)
71. 孔位：hole location
72. 避免：avoid
73. 原设计：original design
74. 修改：modify
75. 按原设计：follow up original design
76. 附边：waste tab, waste area 或者breakaway tab
77. 铜条：copper strip
78. 拼板：panel drawing
79. 板厚：board thickness
80. 删除：remove(delete)
81. 削铜：shave the copper
82. 露铜：copper exposure 或者exposed copper
83. 光标点: fiducial mark
84. 不同：be different from(differ from)
85. 内弧：inside radius
86. 焊环：annular ring
87. 单板尺寸：single size
88. 拼板尺寸：panel size
89. 铣,锣：routing
90. 铣刀：router 或者Routing bit
91. 楔形掏槽 V-cut 或者V scoring
92. 哑光：matt
93. 光亮的：glossy
94. 锡珠：solder ball(solder plugs)
95. 阻焊：solder mask(solder resist)
96. 阻焊开窗：solder mask opening
97. 单面开窗：single side mask opening
98. 补油：touch up solder mask
99. 补线：track welds
100. 毛刺：burrs
101. 去毛刺：deburr
102. 镀层厚度：plating thickness
103. 清洁度：cleanliness
104. 离子污染：ionic contamination
105. 阻燃性等级：flammability retardant rating
106. 黑化：black oxidation
107. 棕化：brown oxidation
108. 红化：red oxidation
109. 可焊性不良：poor solderability
110. 焊料：solder
111. 包装：packaging
112. 角标：corner mark
113. 特性阻抗：characteristic impedance
114. 正像：positive
115. 负片：negative
116. 镜像：mirror
117. 线宽：line width 或者trace width
118. 线距：line spacing 或者 trace spacing
119. 做样：build sample
120. 按照：according to
121. 成品：finished
122. 做变更：make the change
123. 相类似：similar to
124. 规格：specification
125. 下移：shift down
126. 垂直地：vertically
127. 水平的：horizontally
128. 增大：increase
129. 缩小：decrease
130. 表面处理：Surface Finishing 
131. 波峰焊：wave solder
132. 钻孔数据：drilling data
133. 标记：Logo
134. Ul 标记：UL logo,或者Ul Marking
135. 蚀刻标记：etched marking
136. 周期：date code
137. 翘曲：bow and twist
138. 外层：outer layer 或者 external layer
139. 内层：inner layer 或者 internal layer
140. 顶层：top layer
141. 底层：bottom layer
142. 元件面：component side
143. 焊接面：solder side
144. 阻焊层：solder mask layer
145. 字符层：legend layer (silkscreen layer or over layer)
146. 兰胶层：peelable SM layer
147. 贴片层：paste mask layer
148. 碳油层：carbon layer
149. 外形层：outline layer(profile layer)
150. 白油：white ink
151. 绿油：green ink
152. 喷锡：hot air leveling (HAL)
153. 电金,水金：flash gold
154. 插头镀金：plated gold edge-board contacts

155. 金手指：Gold-finger
156. 防氧化：Entek (OSP)
157. 沉金：Immersion gold (chem. Gold)
158. 沉锡：Immersion Tin(chem.Tin)
159. 沉银：Immersion Silver (chem. silver)
160. 单面板：single sided board
161. 双面板：double sided board
162. 多层板：multilayer board
163. 刚性板：rigid board
164. 挠性板：flexible board
165. 刚挠板：flex-rigid board
166. 铣：CNC (mill , routing)
167. 冲：punching
168. 倒角：beveling
169. 斜面：chamfer
170. 倒圆角：fillet
171. 尺寸：dimension
172. 材料：material
173. 介电常数：Dielectric constant
174. 菲林：film
175. 成像：Imaging
176. 板镀：Panel Plating
177. 图镀：Pattern Plating
178. 后清洗：Final Cleaning
179. 叠层：stacking structure (stack-up)
180. 污染焊盘：contaminate pad
181. 分孔图：drill chart 或者drill map
182. 度数：degree
183. 被…覆盖：be covered with
184. 负公差：minus tolerance
185. 标靶盘： target pad
186. 外形公差：routing tolerance
187. 芯板：core
188. 半固化片 Prepreg
189. 阻抗线impedance trace
190. 评估 estimate
191. 玻纤显露 Fiber Exposure
192. 底铜 base copper
193. 工作搞 working Gerber
194. 原稿 original art work
195. 放宽 relax
196. 挖空 blanking 或者 cut-out
197. 一般性阻焊油墨 general resist ink
198. 孔位错误 mis hole location
199. 压合周期 press cycle
200. 毛边 serrated edges
201. 跳印 skip printing
202. 气泡 blistering
203. 隔离焊盘 isolated pad
204. 泪滴 tear drops
205. 箭头 arrows
206. 加大 Enlarge
207. 压合周期 press cycle
208. 毛边 serrated edges
209. 跳印,漏印 skip printing
210. 宽度与厚度的比值 width-to-thickness ratio
211. 调整 adjust
212. 铜箔基板 copper claded laminates
213. 线路露铜 copper exposure
214. 孔内异物 dirty hole
215. 椭圆形 elliptical set
216. 纤维突出 fiber protrusion
217. 填充料 filler
218. 互相连通 interconnection
219. 改善方案 implementation
220. 板料使用率 material use factor
221. 回路,网络 network
222. 缺口 nick
223. 氧化 oxidation
224. 剥离(剥落) peeling off
225. 补线不良 poor touch-up
226. 品质等级 quality classification
227. 对位孔 registration
228. 拒收 rejectable
229. 树脂含量 resin content
230. 排列电阻 resistor network
231. 锣刀（铣刀） routing bit
232. 孔内沾文字 S/L on hole
233. 孔内绿漆 S/M on hole
234. 线路沾锡 solder on trace
235. 金手指沾锡 solder on G/F
236. 废框 scrap
237. 封孔处理 sealing
238. 间距不足 spacing non-enough
239. 靶位孔 target hole
240. 测试线路 test circuit
241. 热应力试验 thermal stress
242. 厚度分布 thickness distribution
243. 薄基板,内层板 thin core
244. 线路缺口及针孔 track nick & pin hole
245. 裁切线 trim line
246. 真平整 true leveling
247. 真正位置的孔 true position
248. 万用型 universal
249. 气化室 vaporizer
250. 仓库 warehouse
251. 契尖角 wedge angle
252. 线细 width reduce
253. 良率 yield
254. 渗铜,渗入,灯芯效应 wicking
255. 允收 acceptable
256. 试样点 coupon location
257. 经核准的，被认可的 approved
258. 超越胜过,超过其他 exceed
259. 牛皮纸 kraft paper
260. 孔壁破铜 Hole void
261. 孔位破出 Hole breakout
PCB生产—经典流程—英文培训教程
A. 开料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B. 钻孔(Drilling)
b-1 内钻(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Laser Drilling )(Laser Ablation )
b-5 盲埋)孔钻孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检( Touch-up)
c-8 化学前处理,化学研磨( Chemical Milling )
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
c-10 显影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
d-3 铆钉组合(eyelet )
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆/绿油): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)

h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡( Vertical Hot Air Solder Leveling)
j-3 超级焊锡(Super Solder )
j-4. 印焊锡突点(Solder Bump)
K. 成型(Profile)(Form)
k-1 捞型(N/C Routing ) (Milling)
k-2 模具冲(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽( VCut)(V-Scoring)
k-5 金手指斜边( Beveling of G/F)
L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)
l-1 AOI 光学检查( AOI Inspection)
l-2 VRS 目检(Verified & Repaired)
l-3 泛用型治具测试(Universal Tester)
l-4 专用治具测试(Dedicated Tester)
l-5 飞针测试(Flying Probe)
M. 终检( Final Visual Inspection)
m-1 压板翘 Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包装及出货(Packing & shipping)
m-4 目检( Visual Inspection)
m-5 清洗及烘烤( Final Clean & Baking)
m-6 护铜剂(ENTEK Cu-106A)(OSP)
m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)
m-8 冷热冲击试验(Thermal cycling Testing)
m-9 焊锡性试验( Solderability Testing )

N. 雷射钻孔(Laser Ablation)
N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)
N-2 雷射曝光对位孔(Laser Ablation Registration Hole)
N-3 雷射Mask制作(Laser Mask)
N-4 雷射钻孔(Laser Ablation)
N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)
N-6 Blaser AOI (after Desmear and Microetching)
N-7 除胶渣(Desmear)
N-8 微蚀(Microetching )
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