ASM-自动焊线机器介绍Au-wire-bonding-process演示幻灯片.ppt

Click to edit Master title,Click to edit Master text styles,Second level,Third level,*,page,*,Section 9.3 Basic Au Wire Bond Process,3/2/2025,1,Contents,Basic Introduction,Gold Wire Bonder,Bonding Sequence,Material&Tools,Bond Quality,3/2/2025,2,Basic Introduction,Understand an IC Package,IC Manufacturing Flow,Wire Bonding Introduction,3/2/2025,3,Cross-section of an IC Package,Die,Gold Wire,Lead Frame,3/2/2025,4,Wafer Grinding,Die Bonding,Wafer Saw,Toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder Ball,Placement,Singulation,Packing,IC Manufacturing Flow,Dejunk,Trim,Solder,Plating,Solder,Plating,Forming/,Singulation,Trim/,Forming,BGA,SURFACE,MOUNTPKG,THROUGH,HOLE PKG,3/2/2025,5,Gold Wire Bonding,Die Pad,Lead,Gold wire,Ball Bond,(1st Bond),Wedge Bond,(2nd Bond),3/2/2025,6,Wedge Bonding,3/2/2025,7,What technique is used in Gold Wire Bonding?,3/2/2025,8,Wire Bonding Techniques,There are three basic wire bonding techniques:,Thermosonic bonding:utilizes temperature,ultrasonic and low impact force,and ball/wedge methods.,Ultrasonic bonding:utilizes ultrasonic and low impact force,and the wedge method only.,Thermocompression bonding:utilizes temperature and high impact force,and the wedge method only.,3/2/2025,9,Thermocompression vs Thermosonic,Thermocompression,welding usually requires interfacial temperature of the order of 300C.This temperature can damage some die attach plastics,packaging materials,and laminates,as well as some sensitive chips.,Thermosonic,weldingthe interface temperature can be much lower,typically between 100 to 150C,which avoids such problems.The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.,3/2/2025,10,Advantages of ThermosonicMetallurgical joining is more reliable than conductive particles and adhesive joining.,Process cycle time can be reduced from several minutes to less than 10 seconds.,Lower manufacturing cost per unit.,3/2/2025,11,Wirebonding,Operating Temperature,Wire Materials,Pad Materials,Note,Thermo-compression,300-500C,Au,Al,Au,High pressure,no ultrasonic energy,Ultrasonic,25C,Au,Al,Al,Au,Low pressure in ultrasonic energy,Thermosonic,100-240C,Au,Cu,Al,Au,Low pressure in ultrasonic energy,Comparison of Different Wire Bonding Techniques,3/2/2025,12,What are the important parameters in Gold Wire Bonding?,3/2/2025,13,Bonding Parameters,Thermosonic Bonding,Pressure(Force),Amplify&Frequency(Power 138KHz),Welding Time(Bond Time),Welding Temperature(Heater),High Power,3.2W max,Low Power,1.6W max,Ultra-Low Power,0.8W max,Power-mW,Vib.-um,Power-mW,Vib.-um,Power-mW,Vib.-um,3200,3.21,1600,2.26,800,1.59,3/2/2025,14,SiO,2,Si,Bonding Principle,Al,Pressure,(Force),Vibration,(Power),Contamination,Moisture,Al,2,O,3,Glass,Heat,3/2/2025,15,Next to Gold Wire Bonder,3/2/2025,16,Gold Wire Bonder,Machine Roadmap,Understand Individual Part,Machine Specification,Bonding Temperature,3/2/2025,17,ASM Gold Wire Bonder Roadmap,Machine Model(ATS),AB308,AB309,AB309A,AB339,AB339Eagle,Eagle60,Eagle60AP,Harrier,Twin Eagle,HummingBird,Eagle50?,3/2/2025,18,ASM Gold Wire Bonder,Machine Model(ATS)Description,Eagle60-00,IC Applications,Eagle60-01,TO-92,Eagle60-02,Opto(Bent Leadframe)Applications,Eagle60-03,Vertical LED or Opto Applications,Eagle60-08,Power&Hybrid Device Applications,Eagle60-09,Power&Hybrid Device Applications,3/2/2025,19,Matching,Eagle60AP,Eagle60-03,HummningBird,Harrier,Twin Eagle,.,.,.,.,.,A,C,E,D,B,3/2/2025,20,Eagle60AP,Machine Introduction,3/2/2025,21,Eagle60 vs Eagle60AP,Eagle60,Eagle60AP,Fine pitch,35,m.,30,m.,Speed,60+ms.,60 ms.,Bondhead,Digital bondhead,New bondhead with 810%faster,Bond Placement Accuracy,3,m 3 sigma,2.5,m 3 sigma,Loop Types,Standard looping database,Additional Escargot,Flex,Bell loop,Optics,Programmable,Ball Formation Monitoring,Standard,8x faster,Capacitance non-stick detection,Standard,10 x faster,3/2/2025,22,Low impact force,Real time Bonding Force monitoring,High resolution z-axis position with 0.4 micron per encoder step,Fast contact detection,Suppressed Force vibration&Fast Force response,Fast response voice coil wire clamp,Bond Head ASSY,3/2/2025,23,X Y TableLinear Motor,High power AC Current Amplifier,DSP based control platform,High X-Y positioning accuracy of+/-3 um3,sigma,Resolution of 0.2 um per encoder step,3/2/2025,24,W/H ASSY,Indexing resolution of 1um per encoder step,Fully programmable indexer&tracks,Motorized window clamp with soft close feature,Output indexer with leadframe jam protection feature,Tool less conversion window clamps and top plate enables fast device,3/2/2025,25,Bonding System,Bonding Method,Thermosonic,(TS),BQM Mode,Multi-mode with programmable BQM,Bd,Wire Size,15.2um up to 76.2um(Au,Cu),Wire Length0.6 to 8mm,Bonding Accuracy+/-2.5um 3 sigma,Bonding Area54mm X 65mm(LF Width,72mm),54mm X(137-LF,Width)mm,Bonding Speed+60ms for 2mm Wire(Q loop),Bond Force Range,1,400 gram,Loop Type,Q-Auto,Square&,Penta,Loop Height Range,316 mil,XY Resolution,0.2 um,Z Resolution,0.4 um,Fine Pitch Capability,30 um pitch 0.6 mil wire,No.of Bonding Wires,up to 3000,Program Storage,1000 programs on Hard Disk,Transducer System,138KHZ,Eagle60AP Machine Specifications(1),3/2/2025,26,Vision System,Pattern Recognition Time,60 ms/point,Pattern Recognition Accuracy,0.37 um,Lead Locator Detection,12 ms/lead,Minimum Lead Pitch,80,um,Post Bond Inspection,1,st,2,nd,Bond and Wire Tracing,Depth of Field,3.5X(320um),8X(100um),Facilities,Single Phase 110 VAC(optional 100/120/200/210/220/230/240 VAC,Floor Spacing,720mm(width)X 820mm(length)X 1600mm(height),Eagle60AP Machine Specifications(2),3/2/2025,27,Material Handling System,Indexer Resolution,1um,Leadframe Position Accuracy,2 mil,Applicable Leadframe,W=23 90 mm bonding area in Y=65mm,L =140 295 mm,T =0.1 0.8 mm,Applicable Magazine,W=16 100 mm(Maximum),L =140 295 mm,H =180 mm(Maximum),Magazine Pitch,2.4 10 mm(0.09”0.39“),Device Changeover,4 minutes(within same LF type),Package Changeover,1000,4,90/1004,8,11,75%),3/2/2025,122,Inter-metallic Layer Thickness,X=Kt1/2,Where X is the inter-metallic layer thickness,t is the time and K is the rate constant which is calculated by following:,K=Ce-E/KT,Where C is the rate constant,e is the activation energy,K is the Boltzman constant,and T is the temperature in absolute scale.,3/2/2025,123,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contactball bond weld area,Bonding pad,h,(A)Unsheared,C,L,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached to wire-except for regionsof intermetallic voiding,Ball separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyed ball and metal)on pad in bond interaction area,(D)Ball bond-bonding pad interface separation(typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ballattached to wire,Bonding pad,C,L,Ball sheared too high(off line,etc.)only aportion of shoulder andball top removed,Interfacial contact,ball bond weld area,(B)Wire(ball top and/or side)shear,C,Ball bond,C,L,Test specimen,Specimen clamp,Shearing ram,Bonding pad,Major portion of ball attached to wire,Interfacial contact-ball bond weld area intact,(C)Below center line shear,ball sheared through(typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Pad metallization separates fromunderlying surface,Residual pad on ball ball-pad interfaceremains intact,(E)Bond pad liftsTest specimen,Specimen clamp,C,Ball bond,C,L,Bonding pad,Bonding pad lifts,taking portion of underlying substrate material with it,(F)Cratering,Residual pad and substrate attachedto ball,ball-pad interface remainsintact,Shear Failure Modes,3/2/2025,124,Normal Condition,3/2/2025,125,Material Problem3/2/2025,126,With Ball,Wire,Pad Size,Missing Ball,Wire Broken,Bonding Ball Inspection,Ball Detection,3/2/2025,127,Ball Size,Pad Center,Ball Center,Ball Placement(X,Y),Ball Off Pad,Bonding Ball Inspection(cont.),Ball Measurement,3/2/2025,128,Peeling,1,st,Bond Fail(1),Possible Causes:,Power too much,Base Force not enough,Al pad not fully cured or contamination between Al and oxide layer,3/2/2025,129,Ball Lift,1,st,Bond Fail(2),Ball Lift,Ball Lift With Pad Peeling,Possible Causes:,Base Power not enough,Material problem,3/2/2025,130,1,st Bond Fail(3),Neck Crack,Possible Causes:,RD too high,RH too low,Wrong/over used capillary,Wire Clamp gap too small,Wire problem,EFO Current too large,3/2/2025,131,Off Center Ball,Possible Causes:,Tail Length too long,Wire or Wire Path contamination,EFO Box or cable connection problem,Air,Tensioner,flow too low,1,st Bond Fail(4),Off Center Ball(Golf Ball),3/2/2025,132,1,st Bond Fail(5),Smash Ball,Possible Causes:,Tail Length too short,Wire or E-torch contamination,Tip of tail length swing away from E-torch,Smash Ball,3/2/2025,133,1,st Bond Fail(6),Missing Ball,Possible Causes:,Tail Length too short,Fire Level too low or too high,E-torch tip dirty,2,nd,Bond Power/Force/Search Speed too high,3/2/2025,134,With Weld,Wire,Capillary Mark,Missing Weld,Broken Wedge,Lead,Sufficient Wedge Width&Length,Secure Tool Impression,No Fish Tail,No Damage/Broken Wedge,Bonding Weld Inspection,Weld Detection,3/2/2025,135,Broken Wedge,Possible Causes:,2,nd,Bond Power/Force too high,Lead clamping not enough,2nd Bond Fail(1),Broken Wedge,3/2/2025,136,Possible Causes:,Lead floating or contamination,2,nd,bond time,power,force too small,Over used capillary,2nd Bond Fail(2),Lift Stitch,3/2/2025,137,Possible Causes:,Capillary Geometry,2,nd,bond time,power,force too small,Over used capillary,2nd Bond Fail(3),Stitch Peeling,3/2/2025,138,Wire Short,Possible Causes:,Capillary Geometry,Wire Path problem,Second Bond parameters,Air,Tensioner,problem,Looping Fail(Wire Short 1),Wire Sway,3/2/2025,139,Wire Short,Possible Causes:,Capillary Geometry,Wire Clamp Gap too big,Tail Bent,Air,Tensioner,Force not enough,Looping Fail(Wire Short 2),Loop Base Bent,3/2/2025,140,Wire Short,Possible Causes:,Capillary Geometry,Search Delay setting not optimized,Base strength too weak,increase RD,Looping Fail(Wire Short 3),Excessive Loop,3/2/2025,141,Possible Causes:,Floating leads,Friction along wire path,Trajectory selection is not good,Wire on capillary is not good,Looping Fail(Inconsistent),Inconsistent Looping,3/2/2025,142,Critical Parameters for Bonding,Bond Parameter,Contact Time、Power、Force(for 1,st,&2,nd,Bond),Base Parameter,Base Time、Power、Force(for 1,st,&2,nd,Bond),Reference Parameter,Search Height、Search Speed(for 1,st,&2,nd,Bond),EFO Parameter,Ball Size、FAB Size、EFO Time、EFO Current、EFO Voltage.,Looping Parameter,R.H、R.D、Neck Angle、.,3/2/2025,143,Multi-tier Looping,3/2/2025,144,Stacked Die,Die Thickness 80um,Total Die Height 850um,3/2/2025,145,Ultra Low Loop,Bell Loop,Escargot Loop,Loop Height,Minimum,32,m.,Maximum,42,m.,Mean,37,m.,Loop Height,Minimum,40,m.,Maximum,47,m.,Mean,44,m.,3/2/2025,146,Short Wire Looping,Die edge to wire gap27.38,m,m,Die edge to 2nd bond pt.124.3,m,m,3/2/2025,147,J Wire,J wire on 1st and 2nd kink,Provide better wire clearance and mold sweep especially for the corner wires,3/2/2025,148,BSOB/BBOS/Pump Ball,Bond Stitch On Ball,Bond Ball On Stitch,3/2/2025,149,Bond Stitch On Stitch,Side View of 2,nd,Bond,Top View of 2,nd,Bond,Top View of Looping,3/2/2025,150,Multi-Ball&Flex Bump Ball,Top View of Multi-Ball,Side View of Multi-Ball,Flex Bump Ball Shape,Looping for Flex Bump Ball,3/2/2025,151,END,3/2/2025,152,