笔记本结构设计经验教训NB-ME-Design-Lesson-learnPPT课件.ppt

NB ME Lesson LearnCase 1Issue:Hinge boss crackCase 1Root cause/Solution:Case 1Root cause/Solution:Case 2Issue:Hinge Bracket brokenCase 2Root cause/Solution:Case 2Root cause/Solution:Case 3Issue:E-sata Jack InterferanceCase 3Root cause/Solution:For strength concerned to EC hinge supportCase 3There are different type JackRD check Molex only(no plastic),foxconn and tyco have plastic 0.7mm high interfere 0.3mm Root cause/Solution:Case 3Root cause/Solution:Case 4Issue:Smile gapRoot cause/Solution:1.Refer to the picture,the dimension of the center of the axis to the iron surface is 15.55mm0.1mm.2.Old hinge actual date for 5 units as below:(1)15.48mm (2)15.43mm (3)15.43mm(4)15.40mm (5)15.45mmST:Reduce rubber heightLT:Add height of AxisCase 5镭镭雕区域雕区域非非镭镭雕区域雕区域Issue:Power button UV coating peel offCase 5Root cause:ProcessCoating thicknessSubstrateBlack base coatingPrimer(Base coating)PlatingUV coating15 m8 m1.01.5 m815 m镭雕Colory一般控制在1012 m中 制 程 雷雕工雷雕工艺为艺为整个工整个工艺艺的最后一道，的最后一道，UV层层破坏后没有保破坏后没有保护动护动作。作。镭镭雕机功率雕机功率设设定定过过高，高，镭镭雕后周雕后周边边区域碳化；区域碳化；镭雕机功率设定为额定功率的80%，约78W，频率为1200HzCase 5Solution:降低降低镭镭雕机功率雕机功率 镭雕机功率降为额定功率的60%，约56W，频率不变 变变更工更工艺艺流程，雷雕工流程，雷雕工艺艺放在放在UV coating之前，雷雕后通之前，雷雕后通过过UV保保护护Black base coatingPrimer(Base coating)PlatingUV coating15 m8 m1.01.5 m815 m镭雕中 制 程Case 6Issue:Noise at K-lock location機器做open/close 時，hinge的搖擺帶動K-lock BKT運功，其噴漆面與base摩擦產生異音.Root cause:1.K-lock BKT與base的gap設計值為0;2.K-lock BKT與base接觸面為噴漆光面;3.K-lock BKT與hinge有鎖附關係;Case 6Solution:1.Short term:K-lock BKT噴漆面打磨為粗糙面/K-lock與base的結合面 加點酒精.2.Long term:Base 偷肉0.2mm,增加base與K-lock的GAP的GAP,避免面對面的摩擦.Case 7gap max 1.1-1.2mm(spec0.8mm)Issue:Gap between Top and BaseCase 7Root cause:ME StructureCase 7Root cause:top shielding結構薄弱，結構薄弱，screw鎖附時鎖附時產產生一個反向的力，生一個反向的力，導致卡勾瞬間導致卡勾瞬間脫脫離影響會微量的下陷；離影響會微量的下陷；Case 7Root cause:base 上卡勾的上卡勾的support rib 在卡合面以下，且為斜面卡合在卡合面以下，且為斜面卡合，卡合受力後卡合受力後base卡勾向卡勾向內內變形，導致卡合量丟失；變形，導致卡合量丟失；Case 7在在top shielding兩個鎖兩個鎖screw位置的中間加位置的中間加1pcs rubber，rubber Z軸干涉量軸干涉量0.5mm，形成一個，形成一個跷跷跷跷板的支點；板的支點；Solution:Case 7此位置的卡勾卡合方式由斜面卡合改平面卡合，並將此位置的卡勾卡合方式由斜面卡合改平面卡合，並將BASE 卡勾背面的卡勾背面的support rib 加高到卡合面以上加高到卡合面以上1mm的位置；的位置；Solution:Case 8Issue:UV Coating peel off from TP panel Nissha IMR already be with hard coat,and another Akzo UV coating is on the IMR.But Akzo UV coating cannot be good to mix with IMR hard coat.So UV coating is easy to peel off on TP PlateRoot Cause:Case 8Solution:Case 8ST:Change to use Nissha IMR foil which is without hard coat.LT:Move IMR foil back to PMMACase 9Issue:Hook of Battery Latch brokenCase 9Root Cause:link link 卡勾後側卡勾後側base base 上的上的support support 面積太小且為面積太小且為R R 角結構，導致對卡勾配合面的角結構，導致對卡勾配合面的supportsupport不不夠夠；Case 9Link與battery配合的卡勾根部及卡勾轉角處加0.5mm 的R角後Solution:Case 10Issue:Thermal Block interference with CPUSpring PlateCu BaseHeat spreaderInterferenceThermal module interference with CPU.Cause system shut-down.Case 101.Thermal Team do not request thermal vendor to use what kind of assembly method to fix spring plate,Cu-base and heat spreader.(Thermal team side)2.Thermal vendor Auras used wrong method(雞眼釘 Copper rivet)to fix contact structure,resulting 雞眼釘 interfere with CPU capacitor.(Vendor side)FixRoot Cause:Case 10Root Cause:雞眼釘干涉Copper rivet 雞眼釘雞眼釘 pit is 0.35 mmMylar thickness is 0.1 mmTotal thickness is 0.45 mm2D Dimension of AMD the Gap between CPU die and capacitor is only about 0.2 mmCase 10Solution 1:抽拉銅柱固定方式抽拉銅柱固定方式製程方式：製程方式：Cu heat spreader 先抽拉出銅柱，先抽拉出銅柱，之後再放入一個鉚合模鉚合彈片，之後再放入一個鉚合模鉚合彈片，銅塊。銅塊。此方式可確保此方式可確保 heat spreader 面限高為零！面限高為零！限高 0 mmSolution:Case 10Solution:製程：製程：Cu heat spreader 先經一套鉚合模，先經一套鉚合模，鉚入實心銅柱，接下來在進另外一鉚入實心銅柱，接下來在進另外一套鉚合模，鉚合彈片及銅塊。此方套鉚合模，鉚合彈片及銅塊此方式需用到兩套鉚合模，故成本較高。式需用到兩套鉚合模，故成本較高。但此方式亦可但此方式亦可確保確保 heat spreader 面面限高為零！限高為零！限高 0 mmSolution 2:鉚接實心銅柱固定方式鉚接實心銅柱固定方式Case 11Issue:RAM door rib short to RAM capacitance as press the door Root Cause:Case 11Solution:1.Add mylar on ram door rib to prevent this risk.2.Have ec to cancel this rib to enlarge gap.Case 12Issue:1.No post or No power 2.MB can power on when press N.Bridge by fingerCase 12FA:Case 12FA:Dye-PryCase 12FA:Dye-PryCase 12FA:Cross SectionCase 12FA:Cross SectionCase 12FA:Cross SectionBased on above analysis(crack location and multiplex crackinterface),suspect the Crack may caused by external stress.Case 12FA:Strain gaugeCase 12FA:ME structureCase 12FA:Proposal for solutionCase 12FA:Proposal for solutionCase 12FA:Retest with solution