Flipchip工艺流程.ppt

1.Metal bump 金屬凸塊-C4 process(IBM)2.Tape-Automated bonding 捲帶接合-ACF process3.Anisotropic conductive adhesives 異方向性導電膠-ACP process4.Polymer bump 高分子凸塊-C4 process5.Stud bump.打線成球-ACP process(Matsushita)Flip Chip conductive method-connect to Substrate/PCBC4:controlled collapse chip connectionACF:anisotropic conductive filmACP(ACA):anisotropic conductive Adhesive paste Kingbond Training Course Kingbond Training CourseVarious flip chip technologiesPS:WIT(Wire interconnect technology)TAB(Tape-automated bonding)Kingbond Training CourseVarious flip chip technologies Kingbond Training CourseStud BumpFlip Chip BondUnderfill Cure ovenCure ovenSBB ProcessC4:Controlled Collapse Chip Connection Process Kingbond Training CourseReflow ovenFlip chip bonderFlux cleanerUnderfill dispenserCure oven1.Flux coating or re-printing2.MountingHeatingCleaningDispensingHeatingWafer bumpBump by solderACP:Anisotropic Conductive Paste ProcessReflow ovenFlip chip bonderUnderfill dispenserCure ovenThermosettingDispensingHeating1.Print the ACA 2.AlignmentWafer bumpBump by Ag Kingbond Training CourseACF:Anisotropic Conductive Film ProcessACF Pre-setterFlip chip bonderPress and cure equipmentACF Pre-setting1.Mounting2.Heating3.Press1.Heating2.PressWafer bumpBump by Au Kingbond Training CourseOvercoat with polymide and open the bump areas.Pattern wettable base metalCoat chip with polymide,open vias over each padUsed dry-film lift-off process to define base metal and solder on each padPattern aluminum to re-route I/O to on area arrayConventional chip with aluminum I/O pads around the perimeterTack,Flux&ReflowPrint,Place&Reflow Kingbond Training CourseFCT Bump StructureSilicon waferUBM-Under Bump MetallurgySolder BumpFinal Metal PadDie PassivationWafer Bump Kingbond Training Course1.蒸鍍 Evaporation 2.濺鍍 Sputter 3.電鍍 Electroplating4.印刷 Printed solder paste bump5.錫球焊接 Solder ball bumping or Stud bump bonding(SBB)6.無電鍍鎳 Electroless nickel technologiesMetal bump methodUBM Kingbond Training Course1.95Sn/5Pb,97Sn/3Pb 高溫錫鉛合金2.63Sn/37Pb 低溫錫鉛合金3.Ni 鎳4.Au 金 5.Cu 銅Material of solder bump Kingbond Training CourseSilicon Wafer arrives with an aluminum based final metal pad and die passivation.Wafer can be probed prior to bumping.Wafer bump(Printed method)Process:Wafer clean Kingbond Training CourseThe Under Bump Metallurgy is added by FCT through sputtered layers of Al,Ni-V,&CuWafer Bump(Printed method)Process:Sputter UBMAl/Ni/Cu(Au)Kingbond Training CourseUBM consist 3 layer:1.Adhesion layer:Ti,Cr,TiW 提供鋁墊(Al pad)與護層(Passivation layer)有較強之黏著性2.Wetting layer:Ni,Cu,Mo,Pt 高溫迴焊時錫球可完全沾附而成球3.Protective layer:Au 保護 Ni,Cu等免於被氧化.Wafer Bump(Evaporation method)Process:Sputter UBM Kingbond Training CourseApply photoresist,Pattern and develop Wafer Bump(Printed method)Process:Photo-resist Kingbond Training CourseEtch to form UBM capWafer Bump(Printed method)Process:Etch UBM Kingbond Training CourseDeposit solder paste and reflow to form bumpWafer Bump(Printed method)Process:Print solder paste&reflowSn/Pb 63/37 低溫95/5高溫 Kingbond Training CourseSample measure bump height,bump shear and bump resistance.Wafer Bump(Printed method)Process:Inspection Kingbond Training Course1.Evaporative bumps are 125 mils in diameter and 100 mils high.2.Plated bumps are 125-175 mils in diameter and 25-100 mils high.The typical size of a bump before reflow:Kingbond Training Course製程名稱製程名稱:晶片背面黏貼晶片背面黏貼Wafer mountingWafer mounting生生產產設備設備:晶片背面黏貼機晶片背面黏貼機檢驗設備檢驗設備:顯微鏡顯微鏡製程製程說說明明:將膠帶黏貼於晶片背面將膠帶黏貼於晶片背面,避免晶避免晶片切割時分離片切割時分離.設備名稱設備名稱:檢驗重點項目檢驗重點項目:1.1.晶片方向晶片方向 Die orientationDie orientation2.2.氣泡氣泡 Air bubbleAir bubble3.3.表面皺紋表面皺紋WrinkleWrinkle製程圖例製程圖例:Kingbond Training CourseProcess:Inspect wafer Kingbond Training Course晶片切割晶片切割Die SawDie Saw生生產產設備設備:晶片切割機晶片切割機檢驗設備檢驗設備:顯微鏡顯微鏡製程製程說說明明:依據晶粒尺寸大小依據晶粒尺寸大小,利用切割刀利用切割刀具具,將晶片切割成將晶片切割成 單顆的晶粒單顆的晶粒.1.1.切割道寬度切割道寬度 Street widthStreet width2.2.崩裂崩裂 CrackCrack製程圖例製程圖例:設備名稱設備名稱:檢驗重點項目檢驗重點項目:Kingbond Training Course上晶片上晶片Flip ChipFlip Chip生生產產設備設備:晶片上片機晶片上片機檢驗設備檢驗設備:X-RAYX-RAY影像觀測機影像觀測機製程製程說說明明:依據晶粒尺寸大小依據晶粒尺寸大小,利用上晶片利用上晶片機將單顆的晶粒機將單顆的晶粒,分別植入基板分別植入基板或模組或模組.1.Bump1.Bump定位與定位與焊焊接情形接情形2.2.晶片崩裂晶片崩裂 Crack,Crack,有無短路有無短路,斷路斷路製程圖例製程圖例:設備名稱設備名稱:檢驗重點項目檢驗重點項目:ChipBumpSubstrate/Module Kingbond Training Course上晶片流程上晶片流程Flip Chip flowFlip Chip flowC4 process Kingbond Training Course上晶片流程上晶片流程Flip Chip flowFlip Chip flowACF&ACP Kingbond Training Course填膠填膠Under-fillUnder-fill設備名稱設備名稱:生生產產設備設備:填膠機填膠機檢驗設備檢驗設備:X-RAYX-RAY影像觀測機影像觀測機製程製程說說明明:利用填膠機將已完成植入基板或利用填膠機將已完成植入基板或模組之每單顆的晶粒模組之每單顆的晶粒,分別以填膠分別以填膠注入注入.1.1.有無球有無球脫脫或晶圓偏移或晶圓偏移製程圖例製程圖例:檢驗重點項目檢驗重點項目:Kingbond Training Course Why do you need to underfillWhy do you need to underfillSolder joint reliability for flip chips is based on several factors:Solder joint reliability for flip chips is based on several factors:1.Bump alloy type2.Solder joint height(standoff)3.Distance to neutral point or DNP.(A measurement of the center of mass of the die to the farthest bump on the die,typically the corner bump.)Kingbond Training Course填膠製程填膠製程 Under-fillUnder-fill1.1.毛細作用型毛細作用型 Capillary type):Capillary type):利用毛細力造成膠材之流動利用毛細力造成膠材之流動.2.2.異方向導電膠異方向導電膠(Anisotropic conductive adhesive):(Anisotropic conductive adhesive):低溫製程低溫製程,分膏狀分膏狀(paste)(paste)和膜狀和膜狀(film)(film)3.3.前置型前置型(Pre-applied type):(Pre-applied type):小尺寸晶片小尺寸晶片(6mm),(6mm),點膠點膠(Die attachment)(Die attachment)後再迴後再迴焊焊(Reflow)(Reflow)Kingbond Training Course填膠製程填膠製程 Under-fillUnder-fill製程與材料之限制製程與材料之限制:1.1.加強快速填膠與固化能力加強快速填膠與固化能力2.2.提昇其介面之黏著力提昇其介面之黏著力3.3.較低的吸水率較低的吸水率4.4.提昇低錫鉛球間距提昇低錫鉛球間距內內的流動性的流動性5.5.加強可重工性加強可重工性(rework)(rework)Kingbond Training Course 製程名稱製程名稱:填膠烘烤填膠烘烤Underfill cureUnderfill cure製程製程說說明明:生生產產設備設備:填膠烤箱填膠烤箱檢驗設備檢驗設備:將填膠後之將填膠後之產產品品,利用烤箱進行烘利用烤箱進行烘烤作業烤作業,以消除以消除內內部所留之應力部所留之應力及固化填膠及固化填膠顯微鏡顯微鏡斷層掃瞄機斷層掃瞄機SATSAT製程圖例製程圖例:烘烤烘烤檢驗重點項目檢驗重點項目:1.1.膠體膠體Mold bodyMold body設備名稱設備名稱:Kingbond Training Course 製程名稱製程名稱:雷射正印雷射正印Laser markingLaser marking生生產產設備設備:雷射正印機雷射正印機檢驗設備檢驗設備:將文字將文字/字號以雷射正印到晶片字號以雷射正印到晶片背面區域背面區域,用以辨識用以辨識產產品及批號品及批號追蹤等等追蹤等等.設備名稱設備名稱:顯微鏡顯微鏡製程圖例製程圖例:檢驗重點項目檢驗重點項目:1.1.文字文字內內容容 ContentContent2.2.位置方向位置方向OrientationOrientation3.3.易辨讀易辨讀LegibilityLegibility製程製程說說明明:Kingbond Training CourseEvaporative solder bumping processWafer cleanEvaporation of UBM through metal maskEvaporation of high Pb solder through maskReflow to form solder ballA.B.C.D.95Pb/SnUBM:Cr/Cr-Cu/Cu/AuPolymide passivation Kingbond Training CourseElectroplated UBM w/solder bumping processSputtered UBMApply photoresist,pattern and developApply2nd layer of photo resist.Pattern&develop.Electroplate solderReflow solderA.B.D.E.PhotoresistAluminumTiW/Cu or Cr/CuElectroplate thick Cu layer and AuCopper“Stud”or“mini-bump”C.Pb/SnStrip photoresist and etch the UBMF.Kingbond Training Course