连接器铜材选用.ppt

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,Metalex Enterprise,鎧蔚企業有限公司,Presentation,2,今日主題,材料需求,for 3C,產品連接器,物理,/,機械特性 基礎簡介,&,對產品的影響,高性能銅合金,3,連接器所需要的效能,銅材所必需具備的條件,高接觸力,/Normal Force,高降服強度,/Yield Strength,好的散熱性及低溫升,完成較低的接觸阻抗,高的導電率,/Conductivity,折彎角度小,/,微型化產品,優異的折彎性,/,低,R/T,比,交變應力不失效,/,高插拔次數,優異的抗疲勞強度,/Fatigue Strength,材料需求,for 3C,產品連接器,位移形變小,/,下壓行程有限但需高接觸力,符合環保標準,無環境有害物質,/ROHS,高楊氏,/,彈性系數,Youngs Modulus,高熱傳導係數,/Thermal Conductivity,持久的高接觸力,/,高溫環境下工作,高的抗應力鬆弛,/Stress Relaxation,4,Tensile Test,抗拉測試,5,F,F,Tensile Test/,抗,拉測試,6,L,o=,50,mm,Lf=50 mm+A,A,Lo=5 mm,5 mm+A,A,5 mm,A,10 mm,A,50 mm,Tensile Test/,抗,拉測試,A,50 mm,=L,f,-L,o,x 100%,L,o,Lo-Original Length,/,原始長度,Lf-Final Length,/,最終長度,7,Tensile Test,/,抗拉測試,R,m,Tensile strength,R,p0.2,Yield strength,Rupture,0.2%,Total elongation,Stress,MPa,=(L,f,-L,0,)/L,0,x 100%,R,p0.2,R,m,Elongation%,Youngs Modulus E,8,Stress,MPa,R,p0.2,Elongation%,Yield Strength/,降服強度,降服強度越高，要使材料產生永久變形的力量也越大。適合需要高接觸力的產品。,9,Stress,MPa,Elongation%,Youngs Modulus,楊氏,/,彈性系數,楊氏系數越大斜率越陡，在相同形變下，有較高之接觸力。適合,下壓行程有限但需高接觸力的產品。但須配合降服強度。,E ,10,影,響,成型性能/折,彎,性能的因素,material/temper,材料/,狀態種類,bending direction,折,彎,方向,thickness,厚度(,通常,0.25 mm),beam width,折,彎寬,度(,通常,3 mm),Bending direction,Bending direction,good way,bad way,Rolling direction,11,r=0,90,V-shape die,Punch with bending radius,r,o,180,U-shape die,r,o,Punch with,bending,radius,specimen,影,響,成型性能/折,彎,性能的因素,bending angle,折,彎,角度,bending radius,折彎半徑,f,orming speed,成型速度,f,orming in steps,成型步驟,12,Electrical Current Sent,Current Received,In 2 seconds,Electrical Current Sent,Current Received,In 5 second,導電率的高低將影響接觸阻抗的表現,導電率,/Conductivity,13,維克氏硬度,硬度,=,材料抵抗凹陷的力量,薄的材料與過小的力量會增加數據的誤差,維克氏硬度機測試材料厚度,0.5 mm,以下誤差甚大,故測試材料厚度,0.5 mm,以下的數據只可為參考值,抗拉,/,降伏強度才能夠更精確的表達材料強度,(,也就是能得到更高的接觸力,),14,Load,Vickers,HV,Diagonal,Load,Brinell,HB,Diameter,Load,Rockwell,HRB,HR30T,Indentation depth,硬度測量法,维克氏,布氏,洛氏,當端子在有接觸力的情況下,1),時間,2),溫度,-,將是材料產生應力鬆弛,(,形變量的產生,),最主要的因素,Load,Time,Time,t,0,0,L,應力鬆弛,16,40,50,60,70,80,90,100,100,1000,10000,K55-C70250,K75-C18070,C,5190,time(h),remaining stress(%),K88-C18080,K57-C70350,Relaxation 150 C,Thermally stress relieved samples,應,力,釋,放比照,-150 C,條,件下,Relevance for,automotive,applications,C5210,YCUT-F-H,應力鬆弛的比例*原始的強度,=,最終保留的強度,K57(C7035),雖然鬆弛較,K55(C7025),嚴重，但最終強度依然較高,17,銅合金,for,連接器運用,各式材料特性的重要性,導電率,/,熱傳導係數,Electrical/thermal,conductivity,折彎性,/Bendability,楊氏係數,/Youngs Modulus,抗應力鬆弛,/,Stress relaxation,resistance,降服強度,/Yield strength,通訊,&,電腦,18,超級鈦銅,-YCuT-FX,*需要高壽命及高接觸力之開闢,switch,和連接器,(Battery,socket,min USB,等,),Tensile strength R,m,MPa,62,0,76,0,65,0,78,0,69,0,80,0,608-725,Yield strength R,p0,2,MPa,min.,50,0,min.,585,min.,655 550-650,Elongation A,50,%min.,10,min.,7,min.,5,min.,6,HV (,1,8,0,-,22,0,)(,20,0,-,24,0,)(,22,0,26,0,),(,180,220,),El.conductivity%IACS,43.1,43.1,43.1,43.1,R,620 R650 R690 TR02,(TM00)(TM02)(TM03),Min.Bend Radius 90,Good way,0,1,1.5 1,Bad way,0,1,1.5,3,Temper,Wieland,K,55(C7025),高性能铜合金,*需要高接觸力,低阻抗及在高溫環境下有較佳之抗應力鬆弛,可運用在連接器,(phone Jack,、,LVDS,、,I/O conn,、,等,),，,也適合應用在汽車端子及,IC,導線架材料上。,20,Wieland K57(C7035),高性能铜合金,Tensile strength R,m,MPa770-900 840-970,Yield strength R,p0,2,MPa,750-850,810-920,Elongation A,50,%4 1,HV (220-280)(240-300),El.conductivity%IACS,50,45,TM04 TM06,Min.Bend Radius 90,10 mm sample width,Good Way(0,35/0.15mm)2.0/1.5 2.5/2.0,Bad Way (0.35/0,15 mm)2.0/1.5 2.5/2.0Temper,*需要高接觸力,低阻抗及在高溫環境下有較佳之抗應力鬆弛,可運用在連接器,(phone Jack,、,LVDS,、,I/O conn,、,等,),，,也適合應用在汽車端子及,IC,導線架材料上。,Tensile strength R,m,MPa,4,0,0,48,0,46,0,54,0,5,3,0,-,61,0,Yield strength R,p0,2,MPa,min.,30,0,min.,37,0,min.,46,0,Elongation A,50,%,min.,8,min.,5,min.,2,HV (,1,2,0,-,1,5,0,)(,1,4,0,-,1,7,0,)(,1,5,0,190),El.conductivity%IACS,77.6,77.6,77.6,R4,0,0,R,46,0,R,530,Min.Bend Radius 90,Good way,0,0,.,5,1,Bad way,0,0,.,5,1,Temper,Wieland K,75(C18070),高性能铜合金,*需要通過大電流及產生較低的溫升,可運用在,switch,開闢,LED,連接器,(power conn,等,),Tensile strength R,m,MPa 480 560,540 630 520-620,Yield strength R,p0,2,MPa,min.450 min.520 min.500,Elongation A,50,%,min.7 min.2 min.7,HV (140-170)(150-180)(160 190),El.conductivity%IACS,80 80 80,R480 R540 TR08,Min.Bend Radius 90,Good way,0,0,.,5,2,Bad way,0,0,.,5,3,Temper,Wieland K88,(C18080),高性能铜合金,*需要通過大電流及產生較低的溫升,可運用在,switch,開闢,LED,連接器,(power conn,等,),0,2%Yield strength in MPa,500,550,600,650,700,750,800,850,900,950,0,1,2,3,4,5,90 MBR Bad way r/s,SUPRALLOY,一般,/,Standard,r=bending radius,s=strip thickness,Bending 90 Bad Way,B18-SUPRALLOY,小晶粒磷青銅,24,B18-,SUPRALLOY,小晶粒磷青銅,180,折彎,比較對象,C5210 0,15 mm,180,折彎,with r=0,2 mm,badway,日本,C5210-EH,降服強度,=650Mpa,Wieland B18 SUPRALLOY,-R685,降服強度,=,685 MPa,r,Cracks:,一般日本磷青銅已出現裂紋,!,B18-SUPRALLOY,:,儘管高強度依然完 美成型且表片平滑,!,25,疲勞強度,Wieland B18 SUPRALLOY,*疲勞強度尚有,54%,的,Tensile strength!(,一般銅材約,30%35%),26,B18(C5210)SUPRALLOY,小晶粒磷青銅,-Datasheet values,Temper,Tensile,Strength,MPa,Yield,St,rength,MPa,Elongation,A50%,Hardness,HV,For Info only,MBR 90,Max r/t,GW BW,R590,(H),590-705,Min.540,Min.20,185-235,0 0,R685,(EH),685-785,Min.650,Min.15,210-260,0 0.5,R735,(SH),735-835,Min.700,Min.9,230-270,0 2,R800,(ESH),800-900,Min.775,Min.5,250-290,1 4,*為一折彎性,(,可,180,度對折壓扁而不斷裂,),極佳的磷青銅,R800,強度已相當接近鈹銅及鈦銅,可運用於各種連接器,(,且價格便宜,),27,Wieland B20(C5240)-Datasheet valuesTemper,Tensile,Strength,MPa,Yield,St,rength,MPa,Elongation,A50%,Hardness,HV,For Info only,MBR 90,Max r/t,GW BW,hard,(H),650-750,Min.580,Min.20,200-240,0 0,Extra,Hard,(EH),750-850,Min.650,Min.12,230-270,0,5 1,Spring,(SH),850-950,Min.780,Min.5,250-290,3 4,Extra,Spring,(ESH),950-1050,Min.900,Min.1,260-310,-,