PCB 清洁作业办法.doc

品 質 管 理 系 統
Quality Management System

明泰電子科技（常熟）有限公司

2011/11/21

PCB 清潔作業辦法
Clean work instructions of PCB
Approved by
Checked by
Department
Prepared by
張金華
陳下平
SMT課
豐道坤

Revision History
Date
Rev.
Description
Editor
2011/05/10
A
INITIAL RELEASE.
豐道坤
2011/07/27
B
修改內容5.7.5
陳下平
2011/11/21
C
修改內容5.5，5.7.5.原5.2.3，5.7.5刪除，增加5.4.3

2012/02/29
D
大幅度修改
吳學精

This document contains confidential proprietary information and is the property of ALPHA Networks Inc. The contents of this document may not be disclosed to unauthorized persons without the written consent of ALPHA Networks Inc.

CS103-0106-C 6 / 6
明泰電子科技（常熟）有限公司
PCB 清潔作業辦法
Clean work instructions of PCB

2011/11/21
1.0 目的 Purpose
為了盡可能的避免洗板造成的品质问题，規範PCB印刷不良處理方式及清潔方法。
For as far as possible avoids the quality question which washes the board to create, standard PCB prints the bad processing mode and the clean method.
2.0 範圍 Scope
錫膏印刷、點膠、貼片偏移，亂件不良之P CB。
The printing, glue and SMD migration, disorderly a adverse P CB
3.0 權責單位Responsible Department
SMT課
SMT section
4.0 定義 Definition
無 Noting
5.0 作業內容 Content
5.1工程師P/R或T/R時在PCB上加一層試板膜調試印刷效果，待調試正常後再撕掉試板膜正常印刷，避免調試不良造成洗板。
Engineers P/R or T/R in PCB when adding a layer test plate printing effect, wait for membrane debugging normal tear off again after test plate printing, avoid debugging membrane normally caused by poor wash boards
5.2印刷不良之PCB處理方式
Printing adverse of PCB processing method.
5.2.1印刷空焊、錫少、漏印由產線工程師或產線領班組長負責採用重印的方法處理，避免洗板。
Printing empty welding, tin less by its engineer is responsible for the production line adopts a reprint of approach, avoid washing board.
5.2.2印刷短路、錫尖由操作員對其進行修正，使用針筆去除印刷短路部份。
Printing short-circuits, the tin point carries on the revision after it。
5.2.3 印刷偏移不超過PAD三分之一者直接流至後段待觀察。
The printing displacement of no more than one half PAD flow directly to treat the observation to the observe
5.2.5 點膠拉絲、孔塞、點膠偏移由操作員對其進行修正。
Dispensing wiredrawing, hole plug, dispensing offset by an operator to its amended.
5.2.6 點膠量不足及漏點膠由操作員用手動方式進行補點膠。
Dispensing quantity deficiency and with by an operator which glue dispensing for manually.
5.2.7 以上所有動作進行後都需在PCB 板邊位置貼上黃色圓形標籤，標籤上注明處理位置，
提醒T/R段人員注意確認，沒有板邊的PCB板貼在v-cut或roating位置。
All of the following actions must be in PCB after treatment with red bad label, position to remind T/U section researchers note.

5.3 印刷不良必須要清洗之類型
Printing bad must clean the types
5.3.1 整體印刷偏移超過PAD三分之一者需進行全面清洗。
Overall the printing displacement more than one half PAD thorough cleaning players must.
5.3.2 印刷空焊、錫少、漏印採用重印後之嚴重偏移(偏移超過Pad 1/3)需進行全部清洗。
Printing empty welding, tin less by the serious after its reprint shifts (offset over Pad with half) need to undertake all the cleaning.
5.3.3 清洗之PCB需在板邊位置或v-cut,roating位置貼上紅色圓形清洗Label，以示目檢重點檢查，檢查OK品由總檢人員將清洗Label撕除後流至下制程。
The PCB with cleaning to clean Label, in order to show visual inspection key check, check OK product by the inspection personnel will clean Label tore except
5.4 清洗PCB使用工具
Cleaning PCB tools
橡膠鏟刀、聚合物手套、PC-25、氣槍、鋼網擦拭紙、毛刷、放大鏡
Mask, polymer gloves, PC-25, air gun, dustlessness cleaning paper, brush, hand glass
5.5清洗作業步驟
Cleaning steps
5.5.1 將印刷、點膠不良之PCB，平放於清洗臺面上(如圖一)。
Will printing, dispensing adverse PCB, lie in cleaning mesa (figure 1).
5.5.2 使用橡膠鏟刀將PCB上的錫膏尽可能的铲除干净(如圖二)。
Spray scattered to apply in the block of cleaning solvent(figure 2).

(圖一) (圖二)
5.5.3使用擦拭紙清潔PCB表面殘錫、殘膠後, 再倒入PC25溶劑至PCB開設的孔壁內，以小刷來回的輕刷，並用擦拭紙將殘留的溶劑及錫膏紅膠擦掉(圖三、圖四) 。
Using wipe paper clean surface residual tin, PCB after incomplete glue, garnish solvent to open hole wall of PCB, within the light with a brush, brush and back and forth wipe paper will remain the solvent and erase the solder paste red rubber (figure 3, figure 4).

(圖三) (圖四)
5.5.4再以空氣槍將PCB上貫穿孔(Through hole)位置可能殘留之錫膏紅膠吹出(圖五) 。
Will use the air gun will pass through PCB (Through hole) on the perforation to remain the tin cosmetics rubber to blow out (Figure five).
5.5.5將PCB翻面清洗，重覆步驟圖二至圖四將PCB開孔皆清洗乾淨。
The PCB turn surface cleaning, repeat steps figure 2 to figure 4, will open holes are clean PCB.
5.5.6清洗後，再以擦拭紙擦拭PCB表面及使用空氣槍清潔一次。然後用10倍的放大鏡檢查Fine Pitch元件，via hole，金手指。并貼上红色圆形標簽(貼標簽位置为板边位置，没有板边选取v-cut或roating位置)
After the clean, uses the wipe paper to clean the PCB surface and using air gun clean again. Then using the 10 times of magnifying glasses inspect Fine Pitch components, via hole, gold finger. And labeled white triangle label, (Pastes the label position take not to affect printing as the selection principle.)
5.5.7將PCB清洗時間及送至產線時間填寫在上；然後請領班或組長檢查是否還有錫膏紅膠殘留，如清洗OK立即上線生產，如有殘留物請继续清洗。依照上述步驟再執行一次。
The PCB cleaning time and sent to production line fill in <>, and the PCB was sent to production line. That ask to IPQC which the solder paste red rubber whether there is residual, If cleaning OK production immediately on line and making outdata sheet > if any residue please send to PCB cleaning area in accordance with the above steps again. (figure 6)
5.5.8清洗後之PCB流至T/U段，由T/U段人員目檢确认是否OK，并在洗板记录表上签名
After cleaning the PCB flow to T/U segment, by T/U segment of the operator visual inspection and OK scanning cleaning the barcode (A059 PCB).
5.5.9由作業員將貼有红色圆形標簽的PCB送至X-RAY處檢查零件吃錫狀況。OK後產線作業人員撕掉红色圆形標簽流至下一站。
By the operator will PCB labeled white triangle label sent to X - RAY solder inspect parts situation. OK later production line homework personnel tear white triangle tag flow to the next station.

(圖五) (圖六)

5.6注意事項 Notes:
5.6.1使用空氣槍做清潔時，請在垃圾桶上方作業，以避免錫膏顆粒飛濺。
Use air gun doing the cleaning, please in the trash homework to avoid above the solder paste particles splashes.
5.6.2有金手指及天線的PCB在清洗時，需用高溫膠將金手指處貼蓋,以免損傷。(圖七)
清潔後移除金手指和其他區域的保護膠帶。
When PCB clean with the gold fingers and antenna, need high temperature glue will gold finger place, avoid injury posted cover. (figure 7)
After cleaning removed gold finger and other regional protection tape.
5.6.3如一整塊連板中有單塊或多塊NG板，在清洗之前需用小刀在NG塊內劃損作記號，以免清凈后與好的單塊混亂。(圖八)
If a piece of single block of even pull or more pieces NG boards, before clean needs to use the knife to delimit in the NG block damages makes the symbol, in order to avoid after cleaning, and the good monolith is chaotic. (Figure 8)

(圖七) (圖八)
5.6.4清洗OK後的PCB立即上線生產(清洗後之PCB產線在半小時內必須上線生產)
After cleaning OK PCB to make the PCB to line the production immediately (The PCB production line after cleaning must on-line production in half an hour)
5.6.5 若目前的清洗方式無法滿足客戶的要求時,則不做清洗的動作.為盡可能避免印刷不良.在每次換線時,使用該機種之1pcs PCB板貼上試印膠膜試印，調試OK後方可正常印刷,公板如圖九。若印刷失敗,請按”5.2”方法作業，並用防焊膠貼於板邊，注明印刷不良位置，以利T/U重點檢查處理.例下圖例.（圖十）。
If the current cleaning method cannot meet the requirements of customers, they don't clean. For as far as possible to avoid poor printing . In every time it printing line, please use this model type preparation the communal board to try print, debugging OK rear can normal printing. Communal board as shown in figure 9. If printing failure, please click "5.2" method, and prevent weld glue homework stick in plate edge, marked Printing bad position, With convenient T/U key check processing. Below image (figure 10).

(圖九) （圖十）
6.0相關文件: Related documents
鋼板清洗機使用管理辦法
Steel washer use management approach
CSF-0788
< PCB cleaning record > CSF-0788

7.0附件: accessory
無 Nothing