湿度敏感元件控制.doc

SPEC.NO.:
PROD-公用-A029

作业指示
PAGE :
12 OF 12124

WORK INSTRUCTION (PROD)
REVISION ：
A3
MODEL
公用
ISSUE DATE ：
2006-6-22
工序名称
湿度敏感元件控制
工序编号 ：
A029

工序操作所用设备及工具:
WT:
TO:[PE(SMT)(A)主管];[IE(A) MGR];
操作图示：

操作说明：

注意事项：

REVISION/AMENDMENT HISTORY
DATE
REV NO.
PAGE
DESCRIPTION

工序操作所用设备及工具:
WT:
TO: [PE(SMT)(A)主管];[IE(A) MGR];(SMT);(IPQC);

描述 DESCRIPTION

作为一般要求，物料不允许在以下条件下存储：
As a general requirements, materials are not allowed to be stored:

阳光直接照射，即使通过窗户也不行。
In direct sunshine, not even through windows.
靠近加热器，冷却器，湿度调节器和光源。
Close to heater, cooler, humidifier and light source.
靠近室外以致一再超过温度和湿度范围。
Close to outdoors so that temperature/humidity limits are repeatedly exceeded.

通过元件包装或湿度防护袋(MBB)内的如下标志可以识别是湿度敏感元件。参考(FP-R-016)静电防护/湿度敏感元件清单。
Moisture sensitive devices can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Refer for the ESD/Moisture Sensitive Component List.

Moisture-Sensitive Devices

50
40%
60%
30%
20%
10%
Humidity Indicator

Warning if Pink – Change Desiccant
Read at Lavender between Pink and Blue
箭头所指变粉红则须烘烤

元件湿度敏感度表
Table for Moisture Sensitive Device
等级
Level
储存环境要求
Environment Conditions
装配时间
Assembly Time
备注
Remarks
1
温度£30°C,湿度 85%RH Temperature£30°C,humidity 85%RH
无限制
Unlimited
非湿度敏感元件
Moisture-insensitive comp.
2
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
1年
1 year

2a
温度£30°C, 湿度 60%RH
Temperature£30°C,humidity 60%RH
4周
4 weeks

3
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
168小时
168 hours

4
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
72小时
72 hours

5
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
48小时
48 hours

5a
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
24小时
24 hours

6
T温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
标贴上注明时间
Time on Label (TOL)
需使用前烘烤
Need to bake before use
OSP PWB
T温度£30°C, 湿度 640%RH Temperature£30°C,humidity 40%RH
24小时
24 hours
最大保存期限为6个月
Max. shelf life of 6 months

拆封包装前看包装是否有破损，检查湿度显示卡(HIC)，看是否超出上面1.3所规定的外界条件。
Check that MBB is not broken, and Humidity Indicator Card (HIC) reading is not greater than the Environment Conditions stated in 1.3 above.
PWB的库存最多为5个等级。板要平放在架子上以避免损坏。
Only 5 levels, on the top of PWB stock. And panels must be stored on flat shelf to prevent warpage.
如果MBB损坏或HIC读数超过上面元件湿度敏感度表显示的外界条件，物料/元件要退回给供应商或烘烤，参考下面的湿度敏感元件烘烤设定表。否则填写粘在物料盘上或元件袋上的湿度敏感元件记录表。在上面元件湿度敏感度表所显示的贴装时间内使用物料。
If the MBB is broken or HIC reading is greater than Environment Conditions indicated in Table for Moisture Sensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below. Otherwise, fill up Humidity sensitive parts label, stick on the component reel or MBB and use the materials before the time indicated under “Assembly Time” in Table for Moisture Sensitive Device above.
湿度敏感元件烘烤设定表
Table for Baking Moisture Sensitive Devices
条件
Condition
湿度敏感元件在无保护的环境中暴露的时间Moisture Sensitive Component Unprotected exposure time in ambient
烘烤条件
Baking condition
1
超过48小时但是小于168小时暴露时间
如果是JEDEC等级5a或者6,超过24小时暴露时间
时间
More than 48 hour but less than 168 hour exposure from the requirement
In case of JEDEC class 5a or 6, more than
24 hours exposure.

12 hours(+10,-2 hrs)
@ 60oC +/-5°C
RH £5%
2
超过168小时暴露时间
More than 168 hours exposure
168 hours @ 60oC +/-5°C
RH £5%
OSP PWB
超过24小时暴露时间
More than 24 hours exposure
5 hours @ 60oC +/-5°C
RH £5%

打开湿度防护袋，填写湿度敏感元件记录表(见3.2)，并贴在物料盘上。
Upon opening the MBB, fill up Humidity Sensitive Parts label (see 3.2 below) and stick it on the component reel or tray.
如果停产很长时间，湿度敏感元件超出了元件湿度敏感度表所显示的贴装时间，湿度敏感元件或物料要放进电热炉或密封包装。
If production will stop for a long time, and/or moisture sensitive components exceeds “Assembly Time” indicated in Table for Moisture Sensitive Device, moisture sensitive components/materials should either be stored at humidity control cabinet, or vacuum seal the components.
当需要烘烤时，参考上面1.7电热炉设定表格。参考 DI-43-0011电热炉操作指引。
When baking is needed, refer to the table above (1.7) for the setting of oven. Refer to DI-43-0011 for the Heating Oven Operation and instructions.
静电防护/湿度敏感元件清单(FP-R-016)应由SMT制程工程师更新填写，并由主管或经理确认。
ESD/Moisture Sensitive Component List (FP-R-016) should be updated by SMT Process Engineer and to be verified by Supervisor/Manager.

参考文件 REFERENCE DOCUMENTS

记录 RECORDS
静电防护/湿度敏感元件清单(由PRT保管11年)
ESD/Moisture Sensitive Component List Form.
湿度敏感元件记录表。
Humidity Sensitive Parts label

湿度敏感元件记录表

Humidity sensitive parts label
开封时间
使用期限
开始使用时间
Open-time
Duration
Start Ssage

使用结束时间
开始储存时间
开始烘烤时间
Stop Usage
Start Storing
Start Baking

REVISION/AMENDMENT HISTORY
DATE
REV NO.
PAGE
DESCRIPTION
2004-8-30
A0
4
First Issue

工序操作所用设备及工具:
WT:
TO:[PE(SMT)(A)主管];[IE(A) MGR];
操作图示：

操作说明：

注意事项：

REVISION/AMENDMENT HISTORY
DATE
REV NO.
PAGE
DESCRIPTION

工序操作所用设备及工具:
WT:
TO: [PE(SMT)(A)主管];[IE(A) MGR];(SMT);(IPQC);
目的:
建立NAMTAI SMT车间湿度敏感元件管理程序
Build the Moisture sensitive devices manage process for Namtai SMT workshop.

描述 DESCRIPTION

作为一般要求，物料不允许在以下条件下存储：
As a general requirements, materials are not allowed to be stored:

阳光直接照射，即使通过窗户也不行。
In direct sunshine, not even through windows.
靠近加热器，冷却器，湿度调节器和光源。
Close to heater, cooler, humidifier and light source.
靠近室外以致一再超过温度和湿度范围。
Close to outdoors so that temperature/humidity limits are repeatedly exceeded.

湿度敏感元件可以通过下列附在元件包装上或在湿度袋子内侧的标语来鉴别。特别是IC，
检查其外部的标语和以下的湿度敏感度控制程序。
Moisture sensitive devices can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Especially IC, check for this logo outside and follow moisture sensitivity control procedure.
Moisture-Sensitive Devices 湿度敏感元件

元件湿度敏感度表
Table for Moisture Sensitive Device

等级

Level
储存环境要求
Environment Conditions
装配暴露时间
Assembly Open Time
备注
Remarks
1
温度£30°C,湿度 85%RH Temperature£30°C,humidity 85%RH
无限制
Unlimited
非湿度敏感元件
Moisture-insensitive comp.
2
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
1年
1 year

2a
温度£30°C, 湿度 60%RH
Temperature£30°C,humidity 60%RH
4周
4 weeks

3
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
168小时
168 hours

4
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
72小时
72 hours

5
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
48小时
48 hours

5a
温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
24小时
24 hours

6
T温度£30°C, 湿度 60%RH Temperature£30°C,humidity 60%RH
标贴上注明时间
Time on Label (TOL)
需使用前烘烤
Need to bake before use
OSP PWB
T温度£30°C, 湿度 640%RH Temperature£30°C,humidity 40%RH
24小时
24 hours
最大保存期限为6个月
Max. shelf life of 6 months

拆封包装前看包装是否有破损，检查湿度显示卡(HIC)，看是否超出上面2.3所规定的外界 条件。
Check that MBB is not broken, and Humidity Indicator Card (HIC) reading is not greater than the Environment Conditions stated in 1.3 above.
Warning if Pink – Change Desiccant
Read at Lavender between Pink and Blue
箭头所指变粉红则须烘烤
60%
50%
40%
30%
10%
20%
Humidity Indicator

如果湿度包装袋子破损或湿度显示卡的读数大于以上环境指示表上的指示数据，物料/元件必须退还给卖主或参照以下湿度敏感元件烘烤设定表去烘烤。
If the MBB is broken or HIC reading is greater than Environment Conditions indicated in Table for Moisture Sensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below.

湿度敏感元件烘烤设定表
Table for Baking Moisture Sensitive Devices
湿度敏感元件在无保护的环境中暴露的时间Moisture Sensitive Component Unprotected exposure time in ambient
烘烤条件
Baking condition
如果元件超过2.3—2.4所规定的条件
If component exceed the requirement on 12.3 – 12.4
1.一般要求烘烤(Norma baking condition):
A3
24hrs
@ 120oC +/-5°C
2.元件供应商有标明按照要求按照其要求烘烤.
If component supplier provide baking
condition please baking by supplier request.

3.下表为参考条件:
Below sheet is only reference condition.
24hrs
@ 120oC +/-5°C

3.储存与管理(Storage and manage MSC)

3.1 PE工程师根据如元件湿度敏感级别情况制作”湿度敏感级别清单”
Refer to moisture sensitivity level of the component PE engineer make on list “MSD level list”
IC在使用前需要在料盘上或包装带上贴上“湿度敏感元件管理标签”并写上开口时间和日期在包装袋上来监控其开放时间。
Upon using it, put on the “MSC manage lable”and write the open time and date on the package to monitor the opening time
P/N

可用的装配时间

开封时间及日期

序号
开始时间及日期
截止时间及日期
备注
1

2

3

4

5

6

7

8

9

10

再次储存时间

剩余装配时间

A3

如:一IC的湿度等级为:3,刚拆开湿度包装的可用的装配时间为:168H;
For example:One moisture sensitive component level is 5,upon opening the MBB, Can be use asssembly time:168H;
可用的装配时间为:168H
Can be use asssembly time:168H;
开封时间及日期为:2005.10.18 AM9:00;
Open time and date: 2005.10.18 AM9:00;
如果是盘装IC将每盘IC拿出的“开始时间及日期”, “截止时间及日期”分别记录在对 应的序 号 位置.
If the ic package is tray please Note note the “Start use time”, “End use time” of every tray on the serial number.
再次保存在湿度控制柜里或真空封装的时间为:2005.10.19 AM9:00;
Stored at humidity control cabinet, or vacuum seal the components again time: 2005.10.19 AM9:00
剩余装配时间为:144H;
Remain assembly time:144h
下次再使用时的可用的装配时间:144H
Next time use the component again the can be use asssembly time:144h

如果生产将停止很长一段时间，或湿度敏感元件会超过在湿度敏感元件表上所示的“装配时间”，湿度敏感元件/物料应该保存在湿度控制柜里，或真空封装元件。
If production will stop for a long time, and/or moisture sensitive components will exceeds “Assembly Time” indicated in Table for Moisture Sensitive Device, moisture sensitive components/materials should either be stored at humidity control cabinet, or vacuum seal the components.

3.2 如果包装袋因某些原因比如程序下载或生产已完成并且元件过剩才开封。湿度包装袋应该重新封装，如果开封时间没有超过表2.3规定的开封时间，且没有必要去烘烤除非超出规定的开封时间。
If MBB is to be open due to some reason such as program downloading or production is completed and excess component. MBB bag should be re-sealed if open time does not exceed the required open time listed on 1.3, and there’s no need to bake unless it exceeds the require open time.

4. 监督(Monitor)
IPQC负责对所有涉及到的湿度敏感元件/物料及湿度控制柜进行监控
IPQC take charge to monitor all MSC and humidity control cabinet.

5.生效日期(Become effective date)
本文发布之日起开始生效
Begin the file issued it become effective.
REVISION/AMENDMENT HISTORY
DATE
REV NO.
PAGE
DESCRIPTION
2004-8-30
A0
4
First Issue
2005-3-24
A1
4
修订内容
2005-10-18
A2
4
修订内容
2006-6-17
A3
6
修订内容

PREPARED BY
CHECKED BY
APPROVED BY
雷友农/2006-6-17
胡新/2006-6-22
黄家军/2006-6-22
REV: May. 27, 01-A1