PCBA检验标准规范专业资料.doc

PCBA检查规范

编 号：
版 本：V1.0
生效日期：

1．修订状况表
修订历史
版本
阐明
作者
审核
批准
生效日期

2．术语表
术语表
名称
阐明

目 录
1. 目(PURPOSE) 1
2. 范畴(SCOPE) 1
3. 名词解释(WORDS EXPLANATION) 1
4. 参照文献(REFERENCE DOCUMENT) 1
5. 职责(RESPONSIBILITY)…………………………………………………………………… ….……………1
6. 作业流程及内容(Flow chart and content)……………………………………………………………..….1
7. 修订权限(AUTHORITY OF MODIFICATION)………………………………………………………………2
8. 附件(ATTACHMENT)………………………………………………………………………………………….2
8.1 附件一(PCBA)……………………………………………………………………………………...4
8.2 附件二(机构类)…………………………………………………………………………………….42
8.3 附件三(其他)……………………………………………………………………………………….52

PCBA检查规范
1 目(Purpose)
建立产品外观目视检查原则，使产品检查之鉴定有所依循，同步藉由检查资料回馈分析建立良好workmanship,防止不良之发生.
To establish the standard inspection of product cosmetic for operation to follow，and establish well workmanship by feedback and analyzing the inspection document to void failure.

2 范畴(Scope)
本规范合用于所有产品(含半成品及成品PCBA)外观目视检查，包括自行生产制造之PCBA，委托外包生产制造之PCBA，以及外购入厂组立或单独包装出货之PCBA等.
It fits all product(containing product and PCBA) appearance inspection，including PCBA made by self or by other company and other.

3 名词解释(Words explanation)
无(None)

4 参照文献(Reference document)
ANS/IPC-A-610D

5 职责(Responsibility)
5.1 生产单位(Production unit):
负责产品检查之执行.
Be responsible for doing product inspection
5.2 质量管理部(Quality unit):
负责产品规格之制定及产品品质之抽样检查管制
Be responsible for making product specification and controlling the spot check of product quality

6 作业流程及内容(Flow chart and content )
6.1检查前准备(preparation for inspecting):
检查前须先确认所使用工具,材料,胶,清洁剂等,与否合乎规定. 检查PCBA 时必要配戴防静电手套或防静电手环，而成品有外壳某些则不在此限.
Before inspecting，be sure of the tool，material，glue，cleanser，etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge )，but the finished good with。
6.2
若有检查原则未规范异常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。
It is not means the product accept or reject that the standard of inspection have some abnormal ，but should feed back to engineer to confirm.
6.3
检查环境规定光线充分,以目视为主,辅以放大镜和卡尺
6.4
外观检查项目基准参见附件一~三。
The item of cosmetic inspection standard reference Appendix 1 to 3.

7 修订权限(Authority of modification)
本规范由质量管理部工程师撰写，经研发单位及生产单位会签，由质量管理部最高主管核准后实行，修改程序亦同.
This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit，and then approve by Quality manager. Modify procedure as the same above.
8 附件Attachment ( 含登记表单)
8.1 附件一：PCBA
Appendix 1：PCBA
8.2 附件二：机构类
Appendix 2：Mechanical
8.3 附件三：其他
Appendix 3：Other

附 件 预 览 总 表
附件一：PCBA类
附件二：机构类(Mechanical)
附件三：其他(Other)
1 SMT零件(SMT component)
1-1 焊点规格(Soldering
SPEC)
1-2 焊点异常(Soldering
abnormal)
1-3 零件损坏(Component
damage)
1-4 点胶(Staking adhesive
gluing)
1 外壳(Housing)
1 标签(Label)

2 托架,承座(Chassis)
2 Barcode
3 铭板(Overlay)
3 包装袋(PE bag)
4 散热片(Heat sink)
4 外箱(Carton)
5 绝缘片(Insulator)
5 Housing
6 螺丝,螺帽,垫片(Screw nut)

7 DC series converter 系列成品外观检查原则
2 Dip 零件(DIP component)
2-1 焊点规格(DIP SPEC)
2-2 引脚突出(Lead protrusion)
2-3 通孔(PTH)
2-4 插件外观(Appearance)
2-5 点胶(Adhesive gluing)
2-6 DIP高翘(DIP component
lifted)
8 Transformer
9 Shielding cover 外观检查原则

3 PCB
3-1 marking
3-2 外观(Surface
appearance)
3-3 焊锡性(Solderability)
4 Connector，PIN & 金手
指(Golden finger)
5 其他(Other)
5-1 螺丝(Screw)
5-2 跳线(Jump)

附件一：PCBA类
1 SMT零件(SMT component)

1-1 焊点规格(Soldering SPEC)
1-1-1 Chip 零件(Chip component)

Defect
Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less
零件偏移D>50% W 或D>50% P 拒收

Defect
Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less
零件偏移D>50% W 或D>50% P 拒收

Defect
Any end overhang (B)
零件超过pad 拒收

Defect
Component in reserved to lacquer to go to circuit to form a short circuit
零件在有保护漆之线路上导致短路拒收

Acceptable
End joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less
零件焊点宽度C>50%W or C>50% P 允收

Acceptable
Maximum fillet height (E) may overhang the lend or extend onto the of the end cap metallization，but not extend further onto the component body
锡高超过金属端,但未延伸至零件本体允收

Defect
Solder fillet extends onto the component body
锡延伸到零件本体上拒收

Defect
Minimum fillet high (F) is less than 25% termination high (H)，or fillet high (F) is less than 0.5mm
High voltage capacitance minimum fillet high (F) is less than 50% termination high (H)，or fillet high (F) is less than 0.75mm
爬锡高度 F<25% H 或 F<0.5mm 拒收
高压电容爬锡高度 F<50% H 或 F<0.75mm 拒收

Defect
Insufficient solder
锡局限性拒收

Defect
Insufficient end overlap
空焊拒收

1-1-2 圆柱体零件(Cylindrical End Cap Termination)

Defect
Side overhang (A) is greater than 50% of component diameter,(W),or land width (P),whichever is less
零件直径突出A>50% W or >50% P. 拒收

Defect
Any end overhang (B)
零件超过pad 拒收

Acceptable
End joint width (C) is minimum 50% component diameter (W) or land width (P),whichever is less
零件连接直径宽度C≧50% W or 50% P 允收

Acceptable
Side joint length(D) is minimum 50% length of component termination(T) or land length(S)，whichever is less
侧面焊点长度D≧50%T or 50%S 允收

Defect
Solder fillet extends onto the component body
锡延伸到零件本体上拒收

Acceptable
Minimum fillet heitht(F) is solder thickness(G) plus 25% diameter(W) of the component end cap
焊锡高度F≧25%(G+W) 允收

Acceptable
End overlap(J) between the component termination and the land is minimum 50% the length of the component termination(T)
零件末端与PAD重叠某些J≧50%T 允收

Defect
End overlap(J) is less than 50% of the length of component
零件末端与PAD重叠某些J<50%T 拒收

1-1-3 Leadless chip

Defect
Side overhang (A) exceeds 50% castellation width (W)
侧面偏移 A>50% W 拒收

Defect
End joint width (C) is less than 50% castellation width (W)
零件末端焊点宽度 C<50% W 拒收

Defect
Minimum side joint length (D) is less than 50% minimum fillet height (F) or land length external to package (S),whichever is less
零件末端焊点长度 D<50% S 或50% F 拒收

Defect
Minimum fillet height (F) is 25% castellation height H)
焊锡高度 F<25% H 拒收

Defect
Any end overhang (B)
零件超过pad 拒收

Defect
Minimum fillet height (F) is 25% castellation height (H)
焊锡高度 F<25% H 拒收

1-1-4 扁平、L 型和翼型引脚(Flat Ribbon，L，and Gull Wing Leads)

Acceptable
Maximum overhang (A) is not greater than 50% lead width (W)
侧面偏移 A≦50% W 允收

Defect
Side overhang (A) is greater than 50% lead width (W)
侧面偏移 A>50% W 拒收

Defect
Minimum end joint width (C) is less 50% lead Width (W)
焊点宽度 C<50% W 拒收

Defect
Side joint length(D) is less than 80% of lead length (L)
焊锡长度 D<4/5 L 拒收

Defect
Solder touches the body or end seal of high-lead configuration component
焊锡延伸至零件本体上或封装末端 拒收

Acceptable
爬锡高度：Fillet 接触到正面吃锡面 允收
Defect
Solder touches package body
锡延伸到零件本体上 拒收

Acceptable
Transformer high voltage pin’s solder is over the A corner portion ,but ex no function pin (for all inverters，except special case)
变压器高压Pin吃锡度已达到A 处(第一弯角处) 允收

Acceptable
Solder is over the B portion(for all inverters，except special case)
吃锡度超过B 处 允收

Defect
Solder is already over the B portion，and bobbin had Been damaged by iron .
Bobbin 被烙铁烫伤 拒收

Defect
Minimum heel fillet height (F) is less than 25% lead thickness (T)
焊锡高度 F< 25% T 拒收

Defect
Side overhang (A) is greater than 50% lead width/ diameter (W)
零件偏移 A>50% W 拒收

Defect
Minimum end joint width (C) is less than 50% lead width/diameter (W)
焊锡宽度 C<50% W 拒收

Defect
Side joint length (D) is less than 80% lead length
焊锡长度 D 不大于 4/5 引脚长度拒收

Defect
Solder touches the package or end seal
焊锡延伸至零件本体上或封装末端拒收

Defect
Minimum side joint height (Q) is less than solder thickness (G) plus 50% diameter (W) of round lead or 50% thickness of lead at joint side (T) for coined lead
焊锡高度Q6 J形引脚 (J Leads)

Defect
Side overhang (A) is greater than 50% W
偏移宽度 A>50% W 拒收

Acceptable
Minimum end joint width (C) is 50% lead width (W)
焊锡宽度 C≧50%W 允收

Defect
Side joint fillet (D) less than 150% lead width
焊锡宽度 (D) 不大于150% 引脚宽度(W) 拒收

Defect
Solder fillet touches package body
焊锡延伸至零件本体上 拒收

1-1-7 I形引脚 (Butt/I Joints)

Defect
Any toe overhang (B)
侧边突出 拒收

Defect
End joint width (C) is less than 75% lead width (W)
焊锡宽度 C<75%W 拒收

Defect
Solder touches package body
焊锡延伸至零件本体上 拒收

Defect
Fillet height (F) is less than 0.5mm[0.02inch]
焊锡高度(F)不大于0.5mm 拒收

1-1-8 向内L型引脚(Inward formed L-shaped ribbon leads)

Defect
End joint width(C) is less than 50% lead with(W)
Side overhang(A) is greater than 50%W
Minimum fillet height(F) is less than 25% E
焊锡宽度C<50%W 拒收
偏移宽度A>50%W 拒收
焊锡高度F<25% 拒收

Acceptable
Minimum end joint width(C) is greater than 50% lead with(W)
焊锡宽度 C≧50%W 允收

1-1-9 BGA 零件(Area array/Ball grid array )

Defect
More than 50% overhang
偏移50% 拒收

Defect
Solder bridge
锡桥 拒收
Dark spots in X-Ray view the bridge between solder joints
在X-Ray下焊点间桥接或 拒收
Solder open
锡散开 拒收
Missing solder
漏锡 拒收
Solder ball(S) that bridge more than 25% of the distance between the leads
锡珠超过焊点间距25% 拒收

Defect
Fracture solder connection
锡裂 拒收

1-2 焊点异常(Soldering abnormal)
1-2-1 侧立(Mounting on side)

Defect
Chip resistance mounting on side
电阻侧立 拒收
Acceptable
Chip capacitance & Inductance minimum type is less than 1206，mounting on side and no more than five(5) chip on each assembly are mounted side ways
电容,电感类零件不大于1206(含)如下，且单面少于5pcs 允收

1-2-2 翻件(Mounting upside down)

Acceptable
Element of chip component with exposed deposited electrical Element is mounted toward board
能导通 允收

1-2-3 墓碑(Tombstone)

Defect
Chip component standing on their terminal end(Tombstone)
墓碑 拒收

1-2-4 共平面 (Coplanarity)

Defect
One lead or series of leads on component is out alignment and fails to make proper contact with the land
零件一种或各种引脚变形，不能与pad 正常接触 拒收

1-2-5 锡未完全熔化(Reflow not complete)

Defect
Incomplete reflow of solder paste
锡未完全熔化 拒收

1-2-6 空焊 (Nonwetting)

Defect
Solder has not wetted to the land or termination
空焊 拒收

1-2-7 冷焊(Dewetting，Disturbed solder)

Defect

Characterized by stress lines from movement in the connection while solidifying
冷焊 拒收

1-2-8 锡裂(Fractured solder)

Defect
Fractured or crack solder
焊锡断裂或破裂 拒收

1-2-9 针孔/吹孔(Pinholes/Blowholes)

Defect
Blowholes，pinholes，voids，etc
焊锡连接浮现气泡,气泡,空白,流出物等 拒收

Acceptable
焊点上紧临零件脚气孔/针孔,一种焊点只容许有一种,且其大小须不大于零件脚面积1/4 允收

Acceptable
焊点上未紧临零件脚气孔/针孔,一种焊点容许有不超过两个(含),且其大小须不大于零件脚面积1/4 允收

1-2-10 锡桥(短路)[Solder bridge(short)]

Defect
A solder connection across conductors that should not be joined
锡桥(短路) 拒收

Acceptable
On the same PAD，solder bridge(short) across conductors
同PAD上两焊点短路 允收
On the same trace(Visualization) but not same PAD，solder bridge(short) across conductors
目视同线路不同PAD短路 允收

1-2-11 锡珠(Solder ball)

Defect
Solder ball dislodge
非附着性锡珠 拒收
Entrapped or encapsulated solder balls that are exceed 0.2mm in diameter
附着性锡珠但锡珠直径大小为0.2mm （含）以上
变压器高压端及高压电容旁有附着性锡珠 拒收
Solder ball attached on high voltage side of transformer or around high voltage capacitor
More than 5 solder balls (diameter less than 0.2mm) per 600mm2
锡珠直径大小为0.2mm 如下但锡珠数量多于 5 颗 / 6 平方公分（含） 拒收
PS:锡珠以静电毛刷刷不掉者,判为附着性锡珠

1-2-12 锡渣(Solder splash)

Defect
Solder splashes that are exceed 0.2mm in length
锡渣长度最长边0.2mm（含）以上 拒收
Solder splashes attached on high voltage side of transformer or around high voltage capacitor
变压器高压端及高压电容旁有锡渣 拒收
More than 5 solder splashes (diameter less than 0.2mm) per 600mm2
锡渣直径大小为0.2mm 如下但锡渣数量多于 5 颗 / 6 平方公分（含） 拒收
PCB 铜箔PAD 沾锡直径不不大于0.7MM 拒收

1-3 零件损坏(Component damage)
1-3-1 裂缝与缺口(Cracks and chip-outs)

Acceptable
Cracks or chip-outs not greater than dimensions L<50%，W<25%，T<25%
缺口尺寸L<50%，W<25%，T<25%可接受

Defect
Any nick or chip-out that exposes the electrodes
任何电极上裂缝或缺口 拒收
Cracks，nicks or any type of damage bodied components
玻璃组件本体上裂缝、刻痕或任何损伤 拒收
Any chip-outs in resistive elements
任何电阻质缺口 拒收
Any cracks or stress fractures
任何裂缝或压痕 拒收

1-3-2 金属镀层(Metallization)

Acceptable
Maximum of 50% of metallization loss of top end area (for each terminal end)
顶部金属镀层损失不不不大于50%,侧面金属镀层不得漏底材 允收

Defect
Metallization loss exceeds 50% of top area
顶部金属镀层损失不不大于50% 拒收

1-3-3 剥落(Leaching)

Defect
Leaching of the terminal ead face exposing ceramic.
剥落导致陶瓷暴露 拒收
Leaching exceeding 25% of component width (W) or component thickness (T)
零件剥落宽度(W)或厚度(T)超过25% 拒收

1-3-4 点胶(Staking adhesive & gluing)

Defect
Adhesive is present in the solder connection area that reduces solder contact to less than 50% of the component termination width
点胶位于待焊区域，导致焊锡宽度不大于50% 拒收

Defect
The glue height above A or below B of crystal
振荡器点胶之高度：高于A或低于B 拒收

Defect
The glue height above A or below B of IC
IC点胶之高度：高于A或低于B 拒收

2 插件零件(DIP component)
2-1 焊点规格(Soldering SPEC)
2-1-1 焊点可接受性规定(Soldering acceptance)

Defect
Nonwetting which results in the solder forming a ball or bead on the surface，much as water beads form on a maxed surface. The fillet will be convex；No feathered edge apparent
不润湿导致焊点表面形成粗糙,灰暗或颗粒状,无光滑表面
焊点移位 拒收
Disturbed solder connection or Cold solder connection
空,冷焊 拒收

2-2 焊点凸出(Lead protrusion)

Defect
The leads protrusion over 2.2 mm
背面脚长不不大于2.2 mm 拒收

脚直径不不大于1.0mm，Connector，变压器Pin无短路及组装干涉问题者脚长可恰当放宽

Defect
Component to give to conduct electricity a circuit a short circuit
零件与导电线路短路 拒收

2-3 通孔[Plated-through holes(PTH)]
2-3-1 通孔填充(PTH-vertical fill of hole)

Defect
Vertical fill of hole is less than 75%
通孔填充不大于75% 拒收

2-3-2 通孔外围焊点-正面(PTH-circumferential wetting-primary side)

Defect
Less than 180° wetting on lead or barrel
引脚和孔壁焊接局限性180° 拒收

2-3-3 通孔外围焊点-背面(PTH-circumferential wetting-secondary side)

Defect
Minimum 270° fillet and wetting (lead，barrel and termination area)
引脚和孔壁焊接局限性270° 拒收

2-3-4 包焊(Lead not discernible)

Defect
Fillet convex，lead not discernible due to excess solder，providing visual evidence of the lead in the hole can be determined on the primary side
由于焊锡过多导致包焊 拒收

Defect
Lead not discernible due to bent lead
由于引脚弯曲导致包焊 拒收

2-3-5 引脚折弯处焊锡(Solder in lead bent)

Defect
Solder in bend area comes in contact with the Component body or end seal
引脚折弯处焊锡接触组件本体或密封端 拒收

2-3-6 陷入焊锡绝缘层(Meniscus in solder)

Acceptable
Exhibit good wetting and lead coating meniscus is not discernible within connection on secondary side
背面焊点需完整,不可空/冷焊且零件