LXES15AAA1-153 esd静电保护二极管-tvs二极管 村田_骊微电子.PDF

Ceramic ESD Protection Device LXES*A series Document No.LX1-1111 Rev1.2p1/18 1.This specification shall be applied to the ESD Protection Device.LXES15AAA1-133 LXES03AAA1-134 LXES15AAA1-153 LXES03AAA1-154 2.Part Number ConfigurationLXES 15 A AA 1 133 Product ID（LXES=ESD Protection device）Dimension CodeUnit:mm Code Dimension 03 0.6 x 0.3 15 1.0 x 0.5 Type(A:Ceramic ESD)Control CodeNumber of channelSerial NumberRoHS CompliantHalogen freeT/R only.MSL 1深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p2/18 3.CONSTRUCTION,DIMENSIONS3-1 DIMENSIONSUnit:mm Size L W T a b 0603 0.600.03 0.300.03 0.33 max 0.150.05 0.20 min 1005 1.000.05 0.500.05 0.33 max 0.200.10 0.40 min 3-2 Circuit Diagram TERMINAL CONFIGURATION This device is bi-directional.3-3 Product Weight P/N Weight mg LXES03AAA1-154 LXES03AAA1-134 0.2 LXES15AAA1-133 LXES15AAA1-153 0.5 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p3/18 4.CHARACTERISTICS4-1-1 Ratings(LXES15AAA1-133)Parameter Symbol Ratings Units Rated Voltage VDC15 V VAC 040 V Operating Temperature TOP-40 to+85oC Storage Temperature TSTO-40 to+85oC Frequency:1MHz4-1-2 Ratings(LXES03AAA1-134)Parameter Symbol Ratings Units Rated Voltage VDC6.3 V VAC 040 V Operating Temperature TOP-40 to+85oC Storage Temperature TSTO-40 to+85oC Frequency:1MHz4-1-3 Ratings(LXES15AAA1-153/LXES03AAA1-154)Parameter Symbol Ratings Units Rated Voltage VDC 4 V VAC 025 V Operating Temperature TOP-40 to+85oC Storage Temperature TSTO-40 to+85oC Frequency:1MHz4-2 Electrical Characteristics(T=25 deg.C)Chip size mm Part NoCapacitance ESD IEC 61000-4-2(Air)ESD IEC 61000-4-2(Contact)Symbol C-Unit pF kV kV Test condition 1MHz Vbias=0V 0603 LXES03AAA1-154 0.05 typ 15 15 LXES03AAA1-134 0.035typ 15 15 1005 LXES15AAA1-133 0.05 typ 15 15 LXES15AAA1-153 0.05 typ 15 15 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p4/18 4-3 Typical Characteristic LXES03AAA1-134 ESD Waveform(IEC61000-4-2：8kV Contact)Voltage Capacitance Characteristic LXES03AAA1-154 ESD Waveform(IEC61000-4-2：8kV Contact)Voltage Capacitance Characteristic LXES15AAA1-133 ESD Waveform(IEC61000-4-2：8kV Contact)Voltage Capacitance Characteristic 0 50 100 150 200 250-10.0 0.0 10.0 20.0 30.0 40.050.0 Voltage VTine nsec0 50 100 150 200 250 300 350 400-10 0 10 20 30 40 50 Voltage VTime nsec深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p5/18 LXES15AAA1-153 ESD Waveform(IEC61000-4-2：8kV Contact)Voltage Capacitance Characteristic 0 50 100 150 200 250 300-10 0 10 20 30 40 50 Voltage VTime nsec深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p6/18 5.Reliability TestNo.Items Specifications Test Methods Number Result (Fail)1 Vibration Resistance No severe damages Satisfy dimension specifications Solder specimens on the testing jig(glass fluorine boards)shown in appended Fig.1 by a Pb free solder.The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock.Frequency :102000 Hz Acceleration:196 m/s2 Direction :X,Y,Z 3 axis Period :2 h on each directionTotal 6 h.22 G(0)2 Shock Solder specimens on the testing jig(glass fluorine boards)shown in appended Fig.1 by a Pb free solder.The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock Acceleration :14,700 m/s2 Period :0.3 ms.Cycle :3 times 22 G(0)3 Deflection Solder specimens on the testing jig(glass epoxy boards)shown in appended Fig.2 by a Pb free solder.The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock.No damage with 1.6mm deflection 22 G(0)4 Soldering strength(Push Strength)LXES03A series 2N Minimum LXES15A series 3N MinimumSolder specimens onto test jig shown below.Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken.Pushing force is applied to longitudinal direction.22 G(0)5 Solderability of Termination 95%of the terminations is to be soldered evenly and continuously.Immerse specimens first an ethanol solution of rosin,then in a Pb free solder solution for 30.5 sec.at 2455 C.Preheat :100-120 C,60 sec.Solder Paste:Sn-3.0Ag-0.5Cu Flux:Solution of ethanol and rosin(25%rosin in weight proportion)22 G(0)6 Resistance to Soldering Heat(Reflow)Appearance Electrical specifications No severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Preheat Temperature :150-200 C Preheat Period :120+/-60 s High Temperature :217 High Temp.Period :105+/-45 s Peak Temperature :260+0/-5 C Specimens are soldered twice with the above condition,and then kept in room condition for 24 h before measurements.22 G(0)Pushing Direction Jig Specimen 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p7/18 No.Items Specifications Test Methods Number Result(Fail)7 High Temp.Exposure AppearanceElectrical SpecificationsNo severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Temperature:85+2/-0 C Period :1000+48/-0 h Room Condition:2 24 h 22 G(0)8 Temperature Cycle Set the specimens to the supporting jig in the same manner and under the same conditions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the following table.Set it for 2 to 24 h at room temperature,then measure.Step Temp(C)Time(min)1 Min.Operating Temp.+0/-3 303 2 Max.Operating Temp.+3/-0 303 22 G(0)9 Humidity(Steady State)Temperature：852 Humidity：8090%RH Period：1000+48/-0 h Room Condition：2 24 h 22 G(0)10 Low Temp.Exposure Temperature：-402 Period：1000+48/-0 h Room Condition：2 24 h 22 G(0)Fig.1 Reference Land Pattern Unit:mm Size a b c 0603 0.25 0.8 0.3 1005 0.4 1.2 0.5 Notes:this land layout is for reference purpose only.深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p8/18 Fig.2 Testing board Mounted situationTest methodLandLand pattern is same as figure1 Glass-fluorine board t1.6mm Copper thickness over 35 mm(Unit:mm)(Unit:mm)(Unit:mm)45 45 CHIP R2305020deflection 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p9/18 6.Tape and Reel Packing(1)LXES03A1）Dimensions of TapeUnit:mm Symbol L W T a b c d e f Size(0.67)(0.37)0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 1.55+/-0.05(2)LXES15A series2）Dimensions of ReelUnit:mm Symbol L W T a b c d e f Size(1.12)(0.62)0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 1.55+/-005 edcbafFeeding direction深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p10/18(3)Dimensions of ReelUnit:mm(4)PackagingP/N pcs/reel LXES03AAA1-154 LXES03AAA1-134 15,000 LXES15AAA1-133 LXES15AAA1-153 10,000 Symbol a b c d e Size 2.0+/-0.5 13.0+/-0.2 9.0+1.0/-0 60+1.0/-0 180+0/-1.5 d e c b a 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p11/18(5)Taping Diagrams1)LXES03A series1 Feeding Hole:As specified in(1)(2)2 Hole for chip:As specified in(1)(2)3 Cover tape :50 m m in thickness4 Base tape:As specified in(1)(2)Chip Feeding Direction Feeding Hole 1 2 3 3 4深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p12/18 2)LXES15A series1 Feeding Hole:As specified in(1)2 Hole for chip:As specified in(1)3 Cover tape :50 m m in thickness4 Base tape:As specified in(1)5 Bottom tape :50 m m in thickness Chip Feeding Direction Feeding Hole 2 3 431 5深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p13/18(6)Leader and Tail tape(7)The tape for chips are wound clockwise,the feeding holes to the right side as the tape is pulledtoward the user.(8)Material:Base tape.Paper Reel .Plastic Base tape,Reel and Top tape have an anti-ESD function.(9)Peeling of force:0.11.0 N in the direction of peeling as shown below.165 to 180 0.11.0N Cover tape Tail tape(No components)ComponentsNo components Feeding direction Leader tape(Cover tape alone)Over160mm Over100mm Over400mm Base tape 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p14/18 NOTICE 1.Storage Conditions:To avoid damaging the solderability of the external electrodes,be sure to observe the following points.-Store products where the ambient temperature is 15 to 35 C and humidity 45 to 75%RH.(Packing materials,In particular,may be deformed at the temperature over 40 C.).-Store products in non corrosive gas(Cl2,NH3,SO2,Nox,etc.).-Stored products should be used within 6 months of receipt.Solderability should be verified if this periodis exceeded.This product is applicable to MSL1(Based on IPC/JEDEC J-STD-020)2.Handling Conditions:Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of ceramics structure.Handle with care if products may have cracks or damages on their terminals,the characteristics of products may change.Do not touch products with bear hands that may result in poor solderability.3.Standard PCB Design(Land Pattern and Dimensions):All the ground terminals should be connected to the ground patterns.Furthermore,the ground pattern should be provided between IN and OUT terminals.Please refer to the specifications for the standard land dimensions.The recommended land pattern and dimensions is as Muratas standard.The characteristics of products may vary depending on the pattern drawing method,grounding method,land dimensions,land forming method of the NC terminals and the PCB material and thickness.Therefore,be sure to verify the characteristics in the actual set.When using non-standard lands,contact Murata beforehand.4.Notice for Chip Placer:When placing products on the PCB,products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle.To prevent products from damages,be sure to follow the specifications for the maintenance of the chip placer being used.For the positioning of products on the PCB,be aware that mechanical chucking may damage products.深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p15/18 5.Soldering Conditions:Carefully perform preheating so that the temperature difference(DT)between the solder and products surface should be in the following range.When products are immersed in solvent after mounting,pay special attention to maintain the temperature difference within 100 C.Soldering must be carried out by the above mentioned conditions to prevent products from damage.Contact Murata before use if concerning other soldering conditions.Soldering method Temperature Soldering iron method DT=130 C Reflow method-Soldering iron method conditions are indicated below.Kind of iron Item Ceramics heater Soldering iron wattage=18 W Temperature of iron-tip=350 C Iron contact time within 3 sec-Diameter of iron-tip:f3.0 mm max.-Do not allow the iron-tip to directly touch the ceramic element.Reflow soldering standard conditions(Example)Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt%or less.60-180 secDTTemperature(C)Pre-heatingTime(s.)217 C60-150 sec.Cooling down slowly255-260 C20-40 secMAX260 C150 C200 C255 C深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p16/18 Amount of Solder Paste:-Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of theexternal electrodes.If too much or little solder is applied,there is high possibility that the mechanicalstrength will be insufficient,creating the variation of characteristics.Chassis Lead wire of leaded component Soldering iron Solder resist High Chip Amount of solder paste Chip Chip PCB Land Solder(Grounding solder)Solder resist Solder resist Lead wire of component mounted later深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p17/18 6.Cleaning Conditions:Any cleaning is not permitted.7.Operational Environment Conditions:Products are designed to work for electronic products under normal environmental conditions(ambient temperature,humidity and pressure).Therefore,products have no problems to be used under the similar conditions to the above-mentioned.However,if products are used under the following circumstances,it may damage products and leakage of electricity and abnormal temperature may occur.-In an atmosphere containing corrosive gas(Cl2,NH3,SOx,NOx etc.).-In an atmosphere containing combustible and volatile gases.-In a dusty environment.-Direct sunlight-Water splashing place.-Humid place where water condenses.-In a freezing environment.If there are possibilities for products to be used under the preceding clause,consult with Murata before actual use.If product malfunctions may result in serious damage,including that to human life,sufficient fail-safe measures must be taken,including the following:(1)Installation of protection circuits or other protective device to improve system safety(2)Installation of redundant circuits in the case of single-circuit failure8.Limitation of Applications:The products are designed and produced for application in ordinary electronic equipment(AV equipment,OA equipment,telecommunication,etc).If the products are to be used in devices requiring extremely high reliability following the application listed below,you should consult with the Murata staff in advance.-Aircraft equipment.-Aerospace equipment-Undersea equipment.-Power plant control equipment.-Medical equipment.-Transportation equipment(vehicles,trains,ships,etc.).-Traffic signal equipment.-Disaster prevention/crime prevention equipment.-Data-procession equipment.-Application which malfunction or operational error may endanger human life and property of assets.-Application which related to occurrence the serious damage-Application of similar complexity and/or reliability requirements to the applications listed in the above.深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p18/18!Note:Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product.Product specifications are subject to change or our products in it may be discontinued without advance notice.This catalog is for reference only and not an official product specification document,therefore,please review and approve our official product specification before ordering this product.深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司