1、ASMCMLT Ball Size&Gold Remain Issue-Smaller capillary CDATS WB Process ASMuDie source:Chi-Mei 14 x 17mil chipuPad Opening:P Pad 94um,N Pad 92umuBonding Method:BSOB 2 wiresuDevice:3020 18 columns x 8 rows uBall shear spec:42guBall size spec:Max 85umuGold remain spec:50%uGold Wire:K&S AW99 1mil (EL 2-
2、7%BL 9g)uCapillary:GAISER 1551-13-437GM 65(6x120D-8D-10)(CD:2.5mil(63.5um)Tip:6.5mil Hole:1.3mil)Material Background&Spec P PadN PadASMuMachine type:Harrier S/N TE019-052uSoftware version:Machine Name:HarrierSystem Version10.01.33 rev 8SiteGenericPR7.12 Rev 9BQM 1.06 (1.13)WH4.76Servo(Z)1.42Servo(XY
3、)1.26Heater30ABonder5.25Date/TimeTue Jun 6 16:03:22 2006 ref:64.07Material BackgroundASMParameter SettingScrub only applied to P PadASMDatauP Pad ball size&thicknessuP Pad Ball Shear(g)uN Pad ball size&thicknessuN Pad Ball Shear(g)ASMResult photoBest P PadBest P PadBest N PadBest N PadWorst P PadWor
4、st P PadWorst N PadWorst N PadASMAfter Shear Gold Remain100%P padP padP padP padN padN padN padN pad70%90%80%ASMSummary ResultuWith smaller CD capillary,smaller ball size can be achievedEnhancer F2 increased to 28(was 20)Scrub T1&Amplitude also increased uBoth P&N pads able to achieve 50%gold remain
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