常用质量英文缩写.ppt

常用质量英文缩写,品保部,:,柴昌敏,Quality-,质量,QC-Quality Control,控制,指挥,检查,-,质量控制,QA-Quality Assurance,保证信任,-,质量保证,QE-Quality Engineering,工程学巧妙的处理,-,质量工程,QS-Quality System,系统体制方式,-,品质系统,TQC-Total,合计，全体，全面,Quality Control-,全面品质控制,TQA-Total,全面，合计,Quality Assurance,保证信任,-,全面品质保证,TPM-Total,全面，合计,Production,生产，产品制品文艺作品,Management,管理,-,全面生产管理,IQC-In-coming quality control,来料品质控制,IPQC-In-process,制程,quality control,制程品质控制,FQC-Final,结尾最终，（任何报纸）最后一版,quality control,最终品质控制,FQA-Final quality assurance,最终品质保证,OQC-Output quality control,出货品质控制,OQA-Output quality assurance,出货品质保证,QE-Quality Engineer,质量工程师,SQE-Supplier quality engineer,供应商质量工程,SQA-Strategy Quality Assurance,策略质量保证,DQA-Design Quality Assurance,设计质量保证,MQA-Manufacture Quality Assurance,制造质量保证,VQA-Vendor Quality Assurance,供货商质量保证,SSQA-Sales and Service Quality,Assuranc,销售服务质量保证,PC-Personal Computer,个人计算机,JIT-Just In Time,及时,ISO-International Organization for Standardization,国际标准化组织,3C-Computer,信息,Communication,通信,Consumer electronic,消费性电子,ZD-Zero Defect,零缺点,I/O-Import/Output,输入,/,输出,PDCA-PPlan,计划,-DDo,实施,-CCheck,检查,-AAction,处理,5W1H-WWhen,什么时间？,-WWhere,什么地点？,-WWho,什么人？,-WWhat,什么事？,-WWhy,原因是什么？,-H-How to,怎么做？,5M-M1-Man,人员,-M2-Machine,机器,-M3-Material,物料M4-Method,方法,-M5-Measurement,环境,4M1T-M1-Man,人力资源,-M2-Material,物力资源,-M3-Money,财力资源,-M4-Method,技术资源,-T-Time,时间资源,7S-S1,Seiri,整理 分类,-S2,Seiton,整顿 规则,-S3,Seiso,清扫 清洁,-S4,Seiketsu,清洁 保持,-S5,Shitsuke,教养 文化（文明）,-S6Save,节约,-S7-Safety,安全,SMT-Surface Mount Technology,表面贴装技术,SMD-Surface Mounted Devices,表面贴装器件,DIP-Dual In-line Package SMD,双列直插式封装技术,ESD-,ElectroStatic,Discharge,静电放电,MSE-Moisture Sensitive Element,潮湿敏感元件,SOP-Standard Operate Procedure,标准作业规范,SIP-Standard Inspection Procedure,标准检验规范,BOM-Bill of Material,物料清单,IS-Inspect Standard,检验规格,CPU-Central Processing Unit,中央处理器,IC-Integrated Circuit,集成电路,LED-Light-Emitting Diode,发光二极管,QST-Quality Show Team,质量指导小组,QIT-Quality Improvement Team,质量改进小组,QCC-Quality Control Circle,质量改进圈（品管圈）,CAT-Corrective Action Team,改正行动小组,CAR-Corrective Action Request,改善动作报告,P/N-Part/Number,料号,Lot No-Lot Number,批号,Defect-,缺陷,CRI-Critical,严重的,MAJ-Major,主要的,MIN-Minor次要的,AQL-Accept Quality Level,品质允收水准,LRR-Lot Reject Rate,批退率,AOQ-Average Output Quality,平均出厂水准,FAI-First Article Inspect,初件检验,FPIR-First Product Inspect Record,初件检验记录,PCB-Printed Circuit Board,印刷电路板,PCBA-PCB Assembly,贴装后的,PCB,NG-Not Good,不良,DPHU-Defect Per Hundred Unit,每一百个单位缺陷数,DPPM-Defect Parts Per Million,百万分几率,DCC-Document Control Center,文件管制中心,PCC-Product Control Center,生产管制中心,IE-Industry Engineering,工业工程师,TE-Test Engineering,测试工程师,PE-Product Engineering,产品工程师,ME-Mechanical&Electrical Engineer,工艺工程师,ISO/TS16949 5,大核心手册,FMEA-FailuremodeandeffectsAnalysis,失效模式及后,SPC-StatisticalProcessControl,统计制程管制,MSA-MeasureSystemAnalysis,量测系统分析,APQP-AdvancedProductQualityPlanning,andControlPlan,产品质量先期策划和控制计,PPAP-ProductionPartApprovalProcess,生产件批准程序,ICT-In Circuit Test,在线测试,ATE-Auto-Test Equipment,全自动测试设备,Capacitor-,电容,Resistor-,电阻,Inductance-,电感,Switch-,开关,Resistor Network-,排阻,序号,缺陷中文名称,缺陷英文缩写,1,沾胶,SG(Stick Glue),2,冷焊,CS(Cold solder),3,多件,EP(Excess Part),4,多锡,ES(Excess Solder),5,浮高,FL(Float Part),6,外来异物,FM(Foreign Material),7,反白,FP(Flip Part),8,金手指沾锡,GF(Gold Finger),9,少锡,IS(Insufficient Solder),10,空焊,OP(Open),11,漏件,PM(Pass Missing),12,撞件,IP(Impact Part),13,极性贴反,RP(Reversed Part),14,锡珠,SB(Solder Ball),15,锡孔,SH(Solder Hole),16,组件放歪,SP(Skewed Part),17,移位,MP(Moving Position),18,连焊,SS(Solder short),19,锡尖,ST(Solder Tip),20,组件立起,立碑,TP(Tombstone Part),21,侧立,SU(Stand-Up),22,虚焊,US(Unsolder),23,错件,WP(Wrong Part),24,PAD,脱落,PE(PCB Error),25,PCB,断裂,PB(PCB Break),26,PCB,烘焦,PO(PCB Overheated),27,线路短路,PCS(PCB Circuit Short),28,管脚弯曲,BP(Bend Pin),29,组件功能失效,CD(Component defect),30,组件损坏,DP(Damaged Part),31,误测,NTF(No Test Fail),32,待分析,TBA(To BE Analysis),The END,