SMT贴装及焊接标准.ppt

1-,*,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,華碩電腦,(,股,),公司,主 機 板,PCBA,外 觀 允 收 標 準,Workmanship Standard,編號：附件一,日期：,DEC.05,1999,版本：,3,理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,零件組裝工藝標準,-,晶片狀,(Chip),零件之對準度,(,組件,X,方向,),SMD Assembly workmanship criteria-Chip component alignment(X Axis),1.,晶片狀零件恰能座落在焊,墊的中央且未發生偏出，,所有各金屬封頭都能完全,與焊墊接觸。,1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.,1.,零件橫向超出焊墊以外，但,尚未大於其零件寬度的,50%,。,(X,1/2W),1.The component shifted off the pad and shift length shall less 1/2 chip width,1.,零件已橫向超出焊墊，大,於零件寬度的,50%(MI),。,(X1/2W),1.The component shifted off the pad and shift length over 1/2 chip with,允收狀況,(Accept Condition),X1/2W,X1/2W,330,X1/2W,X1/2W,註,:,此標準適用於三面或五面,之晶片狀零件,This standard only be used for 3 or 5 face terminations chip component,w,w,330,330,理想狀況,(Target Condition),拒收狀況,(Reject Condition),1.,晶片狀零件恰能座落在焊墊,的中央且未發生偏出，所有,各金屬封頭都能完全與焊墊,接觸。,1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.,1.,零件縱向偏移，但焊墊尚保,有其零件寬度的,25%,以上。,(,Y1,1/4W),2.,零件縱向偏移，但零件端電,極仍蓋住焊墊為其零件寬度,的,25%,以上。,(,Y2,1/4W),Component is shifted towards longest part of the chip,but the termiuad end of chip still on the land,1.The Pad length not be cover by chip(Y1)shall over 1/4 chip width(W),2.1/4 width of the land for solder fillet to form.,1.,零件縱向偏移，但焊墊未,保有其零件寬度的,25%(MI),。,(Y1,1/4W),2.,零件縱向偏移，但零件端,電極蓋住焊墊小於其零件,寬度的,25%,。,(Y2,1/4W),3.Whichever is rejected.,允收狀況,(Accept Condition),W W,330,330,Y2,1/4W,330,Y1,1/4W,Y2,1/4W,Y1,1/4W,SMT,零件組裝工藝標準,-,晶片狀,(Chip),零件之對準度,(,組件,Y,方向,),SMD Assembly workmanship criteria-Chip component alignment(Y Axis),理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,零件組裝工藝標準,-,鷗翼,(Gull-Wing),零件腳面之對準度,SMD Assembly workmanship criteria-Gull-Wing footprint alignment,1.,各接腳都能座落在各焊,墊的中央，而未發生偏,滑。,1.All the leads footprint is centered on the lands,1.,各接腳已發生偏滑，所偏,出焊墊以外的接腳，尚未,超過接腳本身寬度的,1/2W,。,(X1/2W),2.,偏移接腳之邊緣與焊墊外,緣之垂直距離,5mil,(0.13mm),。,(S5mil),1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead,2.The clearance(S)between lead shifted off and land shall over 5 mil,允收狀況,(Accept Condition),W,S,X,1/2W,S,5mil,X1/2W,S,5mil,1.,各接腳已發生偏滑，所偏,出焊墊以外的接腳，已超,過接腳本身寬度的,1/2W,(MI),。,(X,1/2W),2.,偏移接腳之邊緣與焊墊外,緣之垂直距離,5mil,(0.13mm)(MI),。,(S,5mil),3.Whichever is rejected.,理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,零件組裝工藝標準,-,鷗翼,(Gull-Wing),零件腳趾之對準度,SMD Assembly workmanship criteria-Gull-Wing toe alingnment,1.,各接腳都能座落在各焊,墊的中央，而未發生偏,滑。,1.All the leads footprint is centered on the lands,1.,各接腳已發生偏滑，所偏,出焊墊以外的接腳，尚未,超過焊墊側端外緣。,1.The lead had shifted and footprint not over the end of land,1.,各接腳側端外緣已,超過焊墊側端外緣,(MI),。,1.The lead had shifted and footprint had over the end of land(MI),允收狀況,(Accept Condition),W W,已超過焊墊側端外緣,理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,零件組裝工藝標準,-,鷗翼,(Gull-Wing),零件腳跟之對準度,SMD Assembly workmanship criteria-Gull-Wing heel alingnment,1.,各接腳都能座落在各焊,墊的中央，而未發生偏,滑。,1.All the leads footprint is centered on the lands,1.,各接腳已發生偏滑，腳跟,剩餘焊墊的寬度，最少保,有一個接腳厚度,(XT),。,1.The lead had shifted the length from lead heel to end of land(X)shall be over the thickness of land(T),1.,各接腳己發生偏滑，腳跟剩,餘焊墊的寬度，已小於接腳,厚度,(XT)(MI),。,允收狀況,(Accept Condition),T,X,T,X,T,T,XT,理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,焊點性工藝標準,-,鷗翼,(Gull-Wing),腳面與腳跟焊點最小量,SMD solder joint workmanship criteria-Minimum solder of Gull Wing footprint,1.,引線腳的側面,腳跟吃錫良好,2.,引線腳與板子焊墊間呈現凹面,焊錫帶。,3.,引線腳的輪廓清楚可見。,1.side face and footprint have good solder fillet,2.concave fillet between land and lead,3.the shape(profile)of lead be clearly visible,1.,引線腳的底邊與板子焊墊間的,銲錫帶至少涵蓋引線腳長的,2/3L,以上。,2.,腳跟,(Heel),焊錫帶涵蓋高度,h,大於零件腳,1/2,厚度。,(h1/2T),。,3.,腳跟,(Heel),沾錫角需,90,度。,1.Width of solder fillet between lead and land(X)shall over 2/3 lead footprint(L),2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle,90on heel,1.,引線腳的底邊與板子焊墊間的,銲錫帶不足涵蓋引線腳長的,2/3L,。,2.,腳跟,(Heel),焊錫帶涵蓋高,度,h,小,於零件腳,1/2,厚度。,(h=2/3L,L,X2/3L,h,1/2T,T,h1/2T,T,理想狀況,(Target Condition),SMT,焊點性工藝標準,-,鷗翼,(Gull-Wing),腳面焊點最大量,SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint,1.,引線腳的側面,腳跟吃錫良好。,2.,引線腳與板子焊墊間呈現凹面,焊錫帶。,3.,引線腳的輪廓清楚可見。,1.side face and footprint have good solder fillet,2.concave fillet between land and lead,3.the shape(profile)of lead be clearly visible,1.,引線腳與板子焊墊間的焊錫連,接很好且呈一凹面焊錫帶。,2.,引線腳的側端與焊墊間呈現稍,凸的焊錫帶。,3.,引線腳的輪廓可見。,1.Good solder flow up and concave fillet between land and lead,2.Concave solder fillet between side face of lead and land,3.The shape(profile)of lead(footprint)be clearly visible,1.,焊錫帶延伸過引線腳的,頂部,(MI),。,2.,引線腳的輪廓模糊不清,(MI),。,3.Whichever is rejected.,1.solder flow cover the end(TIP)of lead,2.The shape(profile)of lead not be visible clearly,3.Whichever is rejected,拒收狀況,Reject Condition),允收狀況,(Accept Condition),理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,焊點性工藝標準,-,鷗翼,(Gull-Wing),腳跟焊點最大量,SMD solder joint workmanship criteria-Minimum solder of Gull Wing Heel,1.,腳跟的焊錫帶延伸到引線上彎,曲處底部,(B),與下彎曲處頂部,(C),間的中心點。,註：,：引線上彎頂部,：引線上彎底部,：引線下彎頂部,：引線下彎底部,1.Solder flow up to the center between B,C point on the heel of lead,1.,腳跟的焊錫帶已延伸到引線,上彎曲處的底部,(B),。,1.solder flow up to B point on the heel,1.,腳跟的焊錫帶延伸到引線上,彎曲處的底部,(B),，延伸過,高，且沾錫角超過,90,度，才,拒收,(MI),。,1.Solder flow up over(cross)B point and the wetting angle over 90 degree,允收狀況,(Accept Condition),沾錫角超過,90,度,A,B,D,C,理想狀況,(Target Condition),拒收狀況,(Reject Condition),SMT,焊點性工藝標準,-,晶片狀,(Chip),零件之最小焊點,(,三面或五面焊點,),SMD solder joint workmanship criteria-Minimum solder fillet of chip component(3 or 5 face terminations),1.,焊錫帶延伸到晶片端電極,高度的,25%,以上。,(h,1/4T),2.,焊錫帶從晶片外端向外延,伸到焊墊的距離為晶片高,度的,25%,以上。,(X,1/4H),1.1/4 component height be fillet by solder at least,2.Solder flow spread on the land shall 1/4 width of component height at least,(Count from tip of component),1.,焊錫帶延伸到晶片端電極,高度的,25%,以下,(MI),。,(h,1/4T),2.,焊錫帶從晶片外端向外延,伸到焊墊端的距離為晶片,高度的,25%,以下,(MI),。,(X,1/4T),3.Whichever is rejected.,允收狀況,(Accept Condition),T,h,1/4 T,X,1/4 T,h1/4 T,X10mil,。,(D,L10mil)(MI),且,10mil,不易被剝除者,L,10mil,不易被剝除者,L 10mil,理想狀況,(Target Condition),拒收狀況,(Reject Condition),允收狀況,(Accept Condition),X0,X0,Y,Y,T,YT,X,1.,各接腳都能座落在各焊,墊的中央，而未發生偏,滑。,1.The footprint of every lead be centered on the land,1.,各接腳已發生偏滑，引線,腳的側面仍保留在焊墊,上,(X0),2.,各接腳已發生偏滑，腳跟,剩餘焊墊的寬度，最少保,有一個接腳厚度,(YT),。,Footprint had shifted,1.Side face still on the land(X0),2.The space from end of land to heel shall over the thickness of lead,1.,各接腳己發生偏滑，引線腳,的側面已超出焊墊,(X0),。,2.,各接腳已發生偏滑，腳跟,剩餘焊墊的寬度，小於一個,接腳厚度,(YT),。,SMT,零件組裝工藝標準,-,功率晶體,(Mosfet),零件之對準度,SMD Assembly workmanship criteria-Mosfet component alignment,L,拒收狀況,(Reject Condition),DIP,零件組裝工藝標準,-,板彎、板翹、板扭,(,平面度,),DIP component Assembly workmanship criteria-board wrapage,中心線,D,1.,板彎,板翹,板扭計算方式：,W=(D*100)/L,W=,彎,(,翹,),度或扭度,(%),D=,半成品板材變形之最大距離,L=,半成品板材之長邊,2.,零件組裝後產生之板彎,板翹,板扭程度趨近於,0%,。,1.,零件組裝後產生之板彎,板翹,板扭程度,W,0.75%,。,允收狀況,(Accept Condition),1.,零件組裝後產生之板彎,板翹,板扭程度,W,0.75%(MA),。,W=(D*100)/L,0.75%,W=(D*100)/L,0.75%,理想狀況,(Target Condition),W=(D*100)/L,0,%,D,拒收狀況,(Reject Condition),DIP,焊錫性工藝標準,-,焊錫性問題,(,錫橋,、短路、錫裂,),DIP soldering workmanship-soldering issue(Bridge,short,crack),錫短路、錫橋,:,1.,兩導體或兩零件腳有錫短路、,錫橋,(MA),。,錫裂,:,1.,因不適當之外力或不銳利之修,整工具，造成零件腳與焊錫面,產生裂紋其長度超過零件腳,外徑,1/2,圈,不影響功能,(MI),。,拒收狀況,(Reject Condition),拒收狀況,(Reject Condition),錫短路、錫橋,:,1.,兩導體或兩零件腳有錫短路、,錫橋,(MA),。,拒收狀況,(Reject Condition),DIP,焊錫性工藝標準,-,焊錫性問題,(,空焊,、錫珠、錫渣、錫尖,),DIP soldering workmanship-soldering issue(missing solder,solder ball,solder dross,solder peak),1.,錫珠與錫渣可被剝除者或不易被剝奪者,直徑,D,或長度,L,10,mil,且,1/2W)(MI),。,3.Whichever is rejected.,拒收狀況,(Reject Condition),拒收狀況,(Reject Condition),空焊,:,焊錫面零件腳與,PCB,焊錫不良超,過焊點之,50%,以上,(,超過孔環之半,圈,)(MA),。,D,L1/2W,L,Pin,寬度,=W,理想狀況,(Target Condition),金手指工藝標準,-,沾錫、沾漆、沾膠、刮傷翹起,Gold finger workmanship,拒收狀況,(Reject Condition),允收狀況,(Accept Condition),沾錫長度,16 mil,單面金手指沾錫點數,3,點,1.,金手指表面無任何沾錫、沾漆,、沾膠現象。,2.,金手指無任何刮傷現象。,1.,同一機板單面之金手指沾錫點,數,3,點，或其中一點長度,16,mil,(MA),。,2.,金手指翹起,(MA),。,3.,金手指刮傷可見鎳層或底材,(MA),。,4.,金手指沾漆、沾膠或其它有影,響信賴度之污染物,(MA),。,5.Whichever is rejected,。,1.,同一機板單面之金手指沾錫點數,3,點,一根金手指只能允許,1,點,且,每點長度,10mil.,2.,金手指無任何,翹起,。,3.,金手指輕微刮傷未見鎳層或底,材。,4.A,區=錫點直徑須,0.25mm,同一,PAD,不可超過一點,同一面不得超過,3,點,含,A,區及,B,區,.,單面金手指沾錫點數,3,點,且沾錫長度,10mil,L,1/3L,1/3L,1/3L,B,區,A,區,接觸區,非接觸區,