PCB-工艺流程.ppt

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,印制电路板（,PCB）,制作流程,),深圳市博敏电子有限公司,1,一、多层板内层制作流程,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,显 影,DEVELOPING,曝 光,EXPOSURE,压 膜,LAMINATION,去 膜,STRIPPING,蚀刻铜,ETCHING,黑化处理,BLACK OXIDE,烘 烤,BAKING,LAY-UP,预叠及叠板,后处理,POST TREATMENT,压 合,LAMINATION,内层图形转移,INNERLAYER IMAGE,预叠及叠板,LAY-UP,蚀 刻,I/L ETCHING,钻 孔,DRILLING,压 合,LAMINATION,内层制作流程,INNER LAYER PRODUCT,MLPCB,AOI,检查,AOI INSPECTION,裁 板,LAMINATE SHEAR,DOUBLE SIDE,2,二、多层板外层制作流程,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,孔金属化,P.T.H.,钻 孔,DRILLING,外层图形转移,OUTERLAYER IMAGE,图形电镀铜/锡,PATTERN PLATING,检 查,INSPECTION,前处理,PRELIMINARY,TREATMENT,图形电镀铜,PATTERN PLATING,蚀 刻,ETCHING,全板镀铜,PANEL PLATING,外层制作,OUTER-LAYER,O/L ETCHING,蚀 刻,TENTING,PROCESS,DESMER,除胶渣,E-LESS CU,孔金属化,前处理,PRELIMINARY,TREATMENT,退 锡,T/L STRIPPING,去 膜,STRIPPING,压干膜,LAMINATION,镀 锡,T/L PLATING,曝 光,EXPOSURE,3,三、外形制作和成品检查流程,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,阻焊印制,LIQUID S/M,外观检查,VISUAL INSPECTION,成 形,FINAL SHAPING,检 查,INSPECTION,测 试,ELECTRICAL TEST,出货检查,O Q C,成 品,PACKING&SHIPPING,印制阻焊油,S/M COATING,前处理,PRELIMINARY,TREATMENT,曝 光,EXPOSURE,DEVELOPING,显 影,POST CURE,后烘烤,预干燥,PRE-CURE,热风整平,HOT AIR LEVELING,OSP,表面防氧化处理,O S P(Entek Cu 106A),HOT AIR LEVELING,G/F PLATING,镀金手指,化学镍/金,E-less Ni/Au,For O.S.P.,字符印制,SCREEN LEGEND,选择性镀镍/金,SELECTIVE GOLD,4,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,附件：典型多层板制作流程,1.,内层开料,2.,内层线路压膜,5,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,4.,内层线路显影,3.,内层线路曝光,6,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,5.,内层线路蚀刻,6.,内层线路去膜,7,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,7.,叠板,8.,层压,LAYER 2,LAYER 3,LAYER 4,LAYER 5,LAYER 1,LAYER 6,8,大家有疑问的，可以询问和交流,可以互相讨论下，但要小声点,9,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,9.,钻孔,10.,孔金属化,10,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,11.,外层线路压膜,12.,外层线路曝光,11,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,13.外层线路显影,14.,图形电镀铜/锡,12,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,15.,外层去膜,16.,外层蚀刻铜,13,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,17.,退锡,18.,阻焊印制,14,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,19.,浸金或热风整平,15,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,四、,PCB,各制程物料消耗,COPPER FOIL,Epoxy Glass,1、下料裁板,物料消耗,：,2、拼板废弃的覆铜板,1、成品加工板料消耗,16,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Photo Resist,2、内层图形转移,物料消耗：,1、干膜或湿膜（光致油墨）,17,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Artwork,(,底片),Artwork,(,底片),光源,3、曝光,物料消耗,：,Photo Resist,曝光后,1、菲林,2、,UV,灯管,18,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Photo Resist,4、内层显影,物料消耗,：,1、显影液（碳酸钾等）,19,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Photo Resist,5、内层蚀刻,物料消耗,：,1、蚀刻液,2、蚀刻含铜废液,20,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,6、去膜,物料消耗,：,1、,NaOH,21,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,7、黑化/棕化处理,物料消耗,：,1、,22,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Layer 1,Layer 2,Layer 3,Layer 4,Copper Foil,Copper Foil,Inner Layer,8、叠板和层压,物料消耗,：,1、半固化片（,PP,料）,2、层压垫纸（垫膜）,3、边/废料（,PP,料和垫膜等）,23,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,墊木板,鋁板,10、钻孔,物料消耗,：,1、钻咀,2、铝板,3、垫板,24,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,11、孔金属化与全板镀铜,物料消耗,：,1、凹蚀（除胶渣）液,2、整孔剂,3中和剂、预浸剂,4、活化剂、加速剂,5、沉铜液,6、镀铜液,7、废槽液的回收,25,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,Photo Resist,12、外层图形转移,物料消耗,：,1、干膜或湿膜（光致油墨）,2、网版,3、胶带及校正纸张,26,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,13、外层曝光,曝光后,1、黄/黑菲林,2、,UV,灯管,27,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,14、外层显影,物料消耗,：,1、显影液（碳酸钾等）,28,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,15、图形电镀铜/锡,1、除油剂,2、粗化液,3、镀铜液,4、镀锡液,5、铜球和锡条,6、添加剂,29,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,16、去膜,1、NaOH,30,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,17、外层蚀刻铜,1、蚀刻液,2、蚀刻含铜废液,31,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,18、退锡,1、退锡液,32,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,19、阻焊印制,1、阻焊绿油,2、网版,3、胶带及校正纸张,33,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,S/M A/W,光源,物料消耗,：,20、阻焊曝光,1、菲林,2、,UV,灯管,34,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,物料消耗,：,21、阻焊显影,1、显影液（碳酸钾等）,35,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,BTI 94V-0,R105,物料消耗,：,22、字符的印制,1、字符油墨,2、网版,36,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,BTI 94V-0,R105,物料消耗,：,23、表面涂覆（,OSP）,1、除油剂,2、粗化液,3、,OSP,溶液,37,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,制作：博敏R&D,END,38,BROAD,TECHOLOGY INC.,BROAD,TECHOLOGY INC.,39,