科学研究方法与实践吴文刚老师市公开课获奖课件省名师优质课赛课一等奖课件.ppt

Title,Level 1,Level 2,Level 3,Level 4,Level 5达,*,Institute of Microelectronics,本资料仅供参考，不能作为科学依据。谢谢。本资料仅供参考，不能作为科学依据。本资料仅供参考，不能作为科学依据。谢谢。本资料仅供参考!,科学研究方法与实践,北京大学信息科学技术学院,School of Electronics Engineering and Computer Science,Peking University,06 October,1/73,第八讲：,专业期刊、会议 介绍及论文投稿,微电子学专业,2/73,Two topics to address:,How to do,high quality research,How to get,high publication counts,Motivation,On the other hand,Good,research work may,not,result in publication in top journals/conferences,Tactics,play a significant role to get a work published,3/73,Outline,一、北京大学微电子学专业硕士,培养发表论文标准,二、微电子学专业相关期刊、会议,举例介绍,三、关于论文投稿,4/73,数量标准,硕士,研究方向,及毕业情况,所需论文总数,SCI论文数,EI论文数,申请专利或普通学术期刊或所列国际会议论文数,硕士硕士,正常毕业,1,0,1,0,2,0,0,2,提前毕业,2,1,0,1,博士硕士,(4-8年制),ULSI所,MEMS所,3,1,1,1,SOC所,3,0,2,1,博士硕士,(5-8年制),正常毕业,ULSI所MEMS所,5,2,2,1,6,1,4,1,SOC所,5,0,4,1,提前毕业,ULSI所MEMS所,8,4,3,1,SOC所,8,2,5,1,5/73,质量标准(1a),北京大学信息学院认可微电子学与固体电子学期刊目录,A类期刊（1Nano Letters (9.960),Lab on a Chip (5.821),Applied Physics Letters (3.977),Nanotechnology(3.037),IEEE Electron Device Letters (2.716),Journal of Microelectromechanical Systems,IEEE (2.659),Biomedical Microdevices(2.551),Journal of the Electrochemical Society(2.387),Journal of Micromechanics and Microengineering (2.321),IEEE Transactions on Electron Devices (2.052),IEEE Transactions on Microwave Theory and Techniques (2.027),Electrochemical and Solid-State Letters(2.009),IEEE Journal of Solid-State Circuits,(2.002),IEEE Transactions on Nanotechnology (1.909),Sensors and Actuators A/B (1.434/2331),6/73,质量标准(1b),北京大学信息学院认可微电子学与固体电子学期刊目录,A类期刊（2）,Thin Solid Films (1.666),Semiconductor Science and Technology (1.586),IEEE Microwave and Wireless Components Letters(1.424),IEEE Transactions on Circuits and Systems I-Fundamental Theory and Applications(1.139),Electronics Letters (1.063),7/73,质量标准(2),微电子学与固体电子学方面其它高水平期刊,Journal of Applied Physics (2.316),Smart Materials and Structures (1.51),Chinese Physics (1.497),Microelectronic Engineering (1.398),Chinese Physics Letters (1.135),Solid-State Electronics (1.159),IEEE Journal of Sensors (1.117),IEEE Transactions on Circuits and Systems ii Analog and Digital Signal Processing (0.922),Microsystem Technologies (0.673),ACTA MECHANICA SINCA (机械学报)(0.605),Microwave and Optical Technology Letters (0.568),IEICE Transactions on Electronics (0.508),Science In China Series E/F (0.328/0.454),Chinese Journal of Electronics (0.185),半导体学报,电子学报（中、英文版计算机学报（中、英文版）,8/73,质量标准(3a),其它相关高水平期刊（1）,Biosensors and Bioelectronics (4.132),IEEE Photonics Technology Letters (2.353),Journal of Physics D,(2.077),IEEE Transactions on Biomedical Engineering (2.302),Solid State Communication (1.556),Journal of Electronic Materials,(1.504),Journal of Vacuum Science&Technology A/,B (1.394/1.597),Acta Physica Sinica(物理学报)(1.242),Japanese Journal of Applied Physics,(1.222),IEEE Circuits&Devices,(1.22),Microscale Thermophysical Engineering (0.962),IEEE Transactions on Magnetics (0.938),IEEE Transactions on Computer-Aided Design Of Integrated Circuits and System (0.838),Microelectronics Reliability (0.815),IEEE Transactions on Dielectrics and Electrical Insulation (0.771),Journal of Infrared and Millimeter Waves(红外与毫米波学报)(0.755),9/73,质量标准(3b),其它相关高水平期刊（2）,IEEE Transactions on Consumer Electronics (0.727),International Journal of Circuit Theory and Applications (0.686),Microelectronics Journal (0.651),Sensors and Materials,(0.585),International Journal of Electronics (0.459),Journal of Materials Science&Technology(材料科学技术)(0.384),Solid State Technology,(0.293),Analog Integrated Circuits and Signal Processing (0.277),Electrical Engineering (0.068),10/73质量标准(4),其它相关汉字期刊,光学学报,北大学报,固体电子学研究与进展,材料研究学报,通信学报,激光与红外,仪器仪表学报,测试技术学报,机械工程学报,功效材料与器件学报,压电与声光,中国机械工程,传感技术学报,11/73,质量标准(5),北京大学信息学院认可微电子学与固体电子学会议目录,A类会议（1）,International Electron Devices Meeting,(IEDM),International Solid-State Circuits Conference(ISSCC),IEEE International Conference on Micro Electro Mechanical Systems(IEEE MEMS Conference),International Conference on Solid State Sensors,Actuators and Microsystems(Transducers),Symposium on VLSI Technology(VLSI),m,TAS,Custom Integrated Circuits Conference(CICC),The European Solid-State Device Research Conference/The European Solid-State circuits Research Conference(ESSDERC/ESSCIRC),International Conference on Simulation of Semiconductor Process and Devices(SISPAD),Design Automation Conference(DAC),International Test Conference,International Conference on Computer-Aided Design,12/73,量化标准(6),微电子学与固体电子学方面其它高水平会议,International Reliability Physics Symposium,SISPAD,SSDM,ICSICT,IEEE Sensors,Confernce,Europe Sensors,13/73,Outline,一、北京大学微电子学专业硕士,培养发表论文标准,二、微电子学专业相关期刊、会议,举例介绍,代表性学术期刊,代表性学术会议,三、关于论文投稿,14/73,EDL vs.T-ED(1),A big portion of EDL submission is rejected and transferred to T-ED as,brief report,due to,Not enough novelty,Not enough interest,Not in right size&format,Not in good timing,Howeveranother route to publish,IEEE Electron Device Letters was one of the most-cited journals,ranking,number,ten,/,fifteen,(in/)in electrical and electronics engineering,according to the annual Journal Citation Report(/edition)published by the Institute for Scientific Information.,IEEE Transactions on Electron Devices was the,number,eighteen,most-cited journal in electrical and electronics engineering in,according to the annual Journal Citation Report(edition)published by the Institute for Scientific Information.,15/73,EDL,Winning Tactics,Novelty/originality,Timing,Stay in focus,References,Always include all related papersThe author could be one of your reviewers!,Failing factors,Not new,Already published somewhere else,Too broad discussion,Too long,Too many figures,Major reference not cited,EDL vs.T-ED(2),16/73,JSSC,Contributed papers may be of a,tutorial or research nature,but the latter must be,original,and must not duplicate descriptions or derivations available elsewhere.,This JOURNAL publishes papers of broad interest in the area of,solid-state circuits,which may be digital,analog,microwave,or optoelectronic in nature:,integrated circuits and large scale integration,are of principal interest.Included are the design,testing and application of,circuits,and,subsystems,as well as closely related topics in,device technology,and circuit theory.,The subject matter should therefore relate to the analysis,design,and performance of solid-state circuits that may contain combinations of transistors,diodes,bulk-effect devices,and magnetic devices,etc.,17/73,EL,T-MTT,JQE,SSC,SSE,TSF,IEEE Journal of Quantum Electronics was the,number,four,most-cited journal in electrical and electronics engineering,in,according to the annual Journal Citation Report(edition)published by the Institute for Scientific Information.,18/73,JMEMS,JMM,SNA,SNB,IEEE/ASME Journal of Microelectromechanical Systems was the,number,eight,/,nine,(in,/),most-cited journal in electrical and electronics engineering,according to the annual Journal Citation Report(,/,edition)published by the Institute for Scientific Information.,19/73,APL vs.JAP,Weekly,prompt,publication of,up-to-date,work bearing on,applications,of,physics,to,all branches,of science,engineering,and modern technology,Two issues per month,20/73,CPL,CP,21/73,Top Cited Journals for Five Technology Categories,(#Science References from 1983-Patents to Journal Articles),22/73,Top Cited Journals for Five Technology Categories,(#Science References from 1983-Patents to Journal Articles),23/73,Top Cited Journals for Five Technology Categories,(#Science References from 1983-Patents to Journal Articles),24/73,Top Cited Journals for Five Technology Categories,(#Science References from 1983-Patents to Journal Articles),25/73,Top Cited Journals for Five Technology Categories,(#Science References from 1983-Patents to Journal Articles),26/73,IEDM(1),IEEE International Electron Devices Meeting is the,annual,technical meeting of Electron Devices Society.,Over the last,54 years,the IEEE/IEDM has been the,worlds primary,forum for reporting,breakthroughs,in the broadest cross-section of technology,design,manufacturing,physics and the modeling of,semiconductors and other electronic devices,.Topics range,from deep submicron CMOS transistors and memories to novel displays and imagers,from compound semiconductor materials to nanotechnology devices and architectures,from micromachined devices to smart-power technologies,etc.,The,top,technical forum in electron devices,Annual“get-together”event for the community,Papers from,industry,universities,and,national labs,all around the world,Wide spectrum of devices(electronics,photonics,MEMS,etc.),Very strict paper selection process,27/73,IEDM(2),8,Sub-areas,CMOS Devices,CMOS and Interconnect Reliability,Detectors,Sensors and MEMS,Integrated Circuits and Manufacturing,Modeling and Simulation,Process Technology,Quantum Electronics and Compound Semiconductors,Solid-State and Nanoelectronic Devices,Increased participation in the areas of,nanotechnology,MEMS,molecular electronics,and optoelectronic devices,is desired.,28/73,IEDM(3a),IEDM Winning,Tactics,Stay in the,right timing,Assemble your,selling points,Pay attention to details,Submit to the“right”sub-area,IEDM Winning,Strategy,Build up your groups reputation,Stay in the,leading-edge,Focus on certain areas(one or two),Continued“commitment-to-excellence”,Major Reasons for Rejection,Not new,Not interest enough to IEDM,Not enough process data(hide!),Not good enough device I-V curve,Lousy title,Poor figures or format,And,29/73,IEDM(3b),Three,Most Important Factors,Selling points,Paper title,Figures&images,Selling Points:,Eyeball Stopper,A winning paper has several“eyeball stoppers”in different places,Something,new,Good/,unique,explanation,Nice figures/TEM images,Innovative,approach,Leading-Edge Data,Best I-V data,Thinnest EOT for high-k,Highest mobility for strain-Si,Aggressively scaled device,New device&process concept,Abstracts for review must clearly state,The,purpose,of the work,The,manner and degree,to which it advances the art,Specific new,results that have been obtained and their,significance,30/73,IEDM vs.EDL,IEDM,Comprehensive,report(major report),Once a year,EDL,Well focused(,narrow topic,),Quick report(timely progress),Can I submit a paper to both IEDM&EDL?Absolutely no EDL submission,before,IEDM,IEDMs policy,Committee member objection,OK to submit EDL,after,IEDM,Not just simply a“sub-set”of IEDM figures,!,Some new data/figures included,!,31/73,ISSCC(1),The International Solid-State Circuits Conference is the,foremost,global forum for presentation of advances in,solid-state circuits,and,Systems-on-a-Chip,.The Conference offers a,unique opportunity,for engineers working at the cutting edge of IC design to maintain,technical currency,and to network with leading experts.,32/73,ISSCC(2),Original papers are solicited in subject areas including,but not limited to,the following:,ANALOG,DATA CONVERTERS,HIGH-PERFORAMNCE DIGITAL,IMAGERS,MEMS,MEDICAL&DISPLAYS,LOW-POWER DIGITAL,MEMORY,RF,TECHNOLOGY DIRECTIONS,WIRELESS,WIRELINE,33/73,ISSCC(3),The ISSCC Conference,theme,is“,System Integration for Life and Style,”,The ISSCC Conference,theme,is“,The 4 Dimensions of IC Innovation,”,The Conference,theme,is“,Multimedia for a Mobile World,”,The Conference,theme,is“,Entering the Nano-Electronic Integrated-Circuit Era,”,34/73,IEEE MEMS Conference(1),Reflecting the rapid growth of the MEMS field and the commitment and success of its research community,the IEEE MEMS Conference,series,has evolved into a,premier,annual event,in the MEMS area.In recent years it has attracted over,600,participants and has presented more than,215,select papers in non-overlapping,oral and poster,sessions.Despite its size,it has remained committed to a single-session formatthus favoring the strong interaction of attendees among each other and with exhibitors.,IEEE-MEMS conference does not accept papers published at other international conferences or journals.If your paper is published before,November 1,?at any international conference or journal and if it does not contain substantially new information,your contribution will be withdrawn automatically.This will happen even if you have been notified about abstract acceptance before!,35/73,IEEE MEMS Conference(2),The major areas of activity in the,development of MEMS,solicited and expected at this conference include but are not limited to:,Design,simulation and analysis tools with experimental verification,Fabrication technologies and processes,Silicon and non-silicon materials,Electro-mechanical integration techniques,Assembly and packaging approaches,Metrology and operational evaluation techniques,System architecture,The major areas of activity in the,application of MEMS,solicited and expected at this conference include but are not limited to:,Mechanical,thermal,and magnetic sensors and actuators,and systems,Opto-mechanical microdevices and microsystems,Fluidic microcomponents and microsystems,Microdevices for data storage,Microdevices for biomedical engineering,Micro chemical analysis systems,Microdevices and systems for wireless communication,Microdevices for power supply and energy harvesting,Nano-electro-mechanical devices and systems,Scientific microinstruments,36/73,IEEE MEMS Conference(3a),Paper Classification List(1):,Design,Analysis,and Theoretical Concepts with Experimental Verification,Synthesis and analysis methods;design techniques for devices and systems;CAD tools;modelling approaches with experimental verification;theoretical concepts in sensing;actuation and system integration.,Materials and Device Characterization,New materials;known materials under new operating conditions;measurement of properties;calibration and compensation;failure analysis;degradation mechanisms and drift;reliability.,Fabrication and Packaging Technologies,Etching and deposition processes;3-D fabrication,bonding;process integration;surface modification;batch packaging;micro-assembly.,Biomedical and Chemical Micro Sensors and Systems,Micro-total-analysis systems;implantable devices;drug delivery;micro-PCR systems;chemical and biochemical sensors;microfluidic systems.,Mechanical and Physical Micro Sensors and Systems,Inertial(accelerometers,gyroscopes,shock sensors);resonant;force,pressure,and shear;electromagnetic(non-optical);acoustic;thermal devices and systems.,37/73,IEEE MEMS Conference(3b),Paper Classification List(2):,Actuators,Mechanical actuators(electrostatic,thermal,acoustic,piezoelectric,magnetic,phase transition based);pumps,valves.,Micro-Optical Devices and Systems,Mirrors;gratings;switching arrays;beam and phase shaping devices;communication subsystems.,Wireless Communication Micro Devices and Systems(non-optical),RF/millimeter wave/micro wave components;switches;filters;sensor network communication.,Nanoelectromechanical Devices and Systems,Carbon-nanotubes;molecular machinery;nanoelectronic devices with sensing applications;connection of nanoscale devices to the micro and macro world.,Power MEMS&Energy Harvesting,Microminiaturized fuel cells,power generato