软硬结合板简介及关键参数介绍.ppt

按一下以編輯母片標題樣式,按一下以編輯母片文字樣式,第二層,第三層,第四層,第五層,*,*,按一下以編輯母片標題樣式,按一下以編輯母片文字樣式,第二層,第三層,第四層,第五層,*,*,Rigid-Flex Presentation,1,Content,:,Material Introduction,Design rule,Standard Process Flow,Open Discussion,2,1.,軟板基材薄膜種類,聚脂樹脂,(Polyester,PET)-,尺寸熱安定性不如,PI,Aramid,纖維布,-,高吸水性，單價及使用性並不理想,強化型介電材料,撓曲性較差且供應者與使用者不多,氟素樹脂膜,-,無法在高溫下維持尺寸的穩定,聚亞醯胺樹脂,(Polymide,PI)-,熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不,錯電氣特性故最常使用。,Material Introduction,3,2.,聚亞醯胺基材種類,依軟板結構分為兩大類,1.,有接著劑三層軟板基材,(3L FCCL),2.,無接著劑二層軟板基材,(2L FCCL),兩者分屬不同製造過程，製造方式與材料特性不同。,3L,應用在大宗軟板產品，,2L,用在較高階軟板製作上，例：軟硬複合板、,COF,。,以單面板為例,COPPER,PI,銅箔基板,(FCCL),高尺寸安定需求,高密度線路需求,耐化性需求,電氣特性需求,耐燃性需求,環保需求,COPPER,Adhesive,PI,銅箔基板,(FCCL),2L-FCCL,3L-FCCL,Material Introduction,4,2-1.,聚亞醯胺薄膜簡介,聚亞醯胺薄膜,(Polyimide,簡稱,PI),，外觀呈黃棕色，是由芳香族的雙酐類,及雙胺類合成聚亞醯胺酸高分子,(,簡稱,PAA),，之後經高溫熱化脫水形成。,2-2.,品目型號說明,各家標示項目不盡相同，,以台虹,3L-FCCL,為例：,Material Introduction,5,3.2L-FCCL,製造方式與比較,Production Method,Cross-Section,塗佈法,(Casting),濺鍍法,(Sputtering),壓合法,(Lamination),Chill roll,PI film,Target,Vaccum,Chamber,PAA,Heater,PAA,Heater,Copper foil,Plating Cu,Sputter metal,PI film,Copper foil,PAA,Copper foil,TPI,PI film,Material Introduction,6,3.2L-FCCL,製造方式與比較,方法,塗佈法,(Casting),濺鍍法,(Sputtering),壓合法,(Laminate),銅箔選擇性,ED,RA,限,ED,ED,RA,銅箔厚度,薄銅,(9um),有良率問題,可自由控制厚度,薄銅,(9um),有良率問題,雙面板製造性,較複雜與困難,相對容易,相對容易,接著特性,優,尚可,優,生產性,優,差,尚可,基板透明性,尚可,(,有改善空間,),優,優,成本,低,高,中,生產廠商代表,Nippon Steel,（新日鐵）,Sumitomo Metal,(,住友）,Ube,(,宇部興業,),Material Introduction,7,資料來源：,JMS,；工研院,IEK-ITIS,計劃,(2004/3),4.,全球,FCCL,廠商,3L FCCL/2L FCCL,概況,Manufacturer,Adhesive type,Adhesiveless type,ARISAWA,TORAY,Nippon Steel(,新日鐵,),NIKKAN,Nippon Mektron(NOK),UBE(,宇部興產,),Mitsui Chemical(,三井化學,),Dupont(,杜邦,),3M,THINFLEX(,台虹,),表量產,表小量產、試產或送樣中,Material Introduction,8,CVL,Cover lay,Structure,Remark,1.Protect circuit,2.Isolation,PI film,Adhesive,Release paper,Material Introduction,9,Structure,Remark,PP,Non-flow or Low-flow PP,BS,Thickness:15um,25um,40um,Bonding material,1.,PP,Prepreg,1.,BS,Bonding sheet,Release paper,Adhesive,PET film,Epoxy&,Glass fiber,Material Introduction,10,EMI material,1.,Silver film,Structure,Remark,Ex:SF-PC5000,SF-PC1000(32um),SF-PC5000(22um),SF-PC5500(22um),Material Introduction,11,Content,:,Material Introduction,Design rule,Standard Process Flow,Open Discussion,12,Working Panel Size,Popular Working Panel Size,B.Usable area,Border(A,B),and Routing Path(C),Structure type,MIN.A,MIN.B,MIN.C,MIN.C*,Inch,mm,Inch,mm,Inch,mm,Inch,mm,PCB(1 press),0.47,11.43,0.65,16.51,0.1,2.54,0.31.0,7.6225.4,PCB(2 press),0.55,13.97,0.70,17.78,0.1,2.54,0.31.0,7.6225.4,HDI(1 press),0.55,13.97,0.70,17.78,0.1,2.54,0.31.0,7.6225.4,HDI(2 press),0.65,16.51,0.80,20.32,0.1,2.54,0.31.0,7.6225.4,HDI(3 press),0.75,19.05,1.00,25.4,0.1,2.54,0.31.0,7.6225.4,18X20 inch,457.2 x 508 mm,Width X,Length Y,C,C,A,B,PCB,PCB,PCB,PCB,*PCB with 1.G/F Design2.Impedance coupon,Design Rule,13,Optimized.Array Size,16“X19.685”,4.4212“x4.6”,(77%),3.517“x4.6”,(77%),4.4212“x3.425”,(77%),3.517“x2.72”,(76%),17“X19.685”,4.4212“x4.8”,(76%),3.517“x4.8”,(76%),4.4212“x3.675”,(77%),3.517“x2.92”,(76%),18“X19.685”,4.4212“x5.1”,(76%),3.517“x5.1”,(76%),4.4212“x3.925”,(78%),3.517“x3.12”,(77%),Panel type,Panel size,Optimized Panel Utilization,Design Rule,14,NF Prepreg,NF Prepreg,FCCL,NF Prepreg,NF Prepreg,L1,L2,L3,L4,L5,L6,Flex area,Rigid Area,Transition Zone,Rigid Area,Design Rule,15,FCCL,FCCL:Flex Copper Clad Laminate,CVL:Cover layer,Stiffener:FR4/PI/Stainless base Reinforcement,Low flow Prepreg:Resin scale flow lower than normal type,BS:Bonding Sheet,SF:Silver Foil(EMI shielding),Partial CVL,Component on flex,Plus II-stack via,Squeeze out(from Low flow Prepreg),Terms&Definition:,Design Rule,16,UMT Standard,UMT Advanced,1,e,SMT pad(edge of pad)to board edge spacing,Rigid/Flex,400um,300um,2,d,Shield can(edge of ground)to board edge spacing,Rigid/Flex,300um,200um,3,d,Ground plane to board edge spacing,Rigid/Flex,300um,200um,4,d,Power plane to board edge spacing,Rigid/Flex,300um,200um,5,c,Trace(edge of trace)to board edge spacing,Rigid/Flex,400um,250um,6,a,Micro-via(edge of pad)to board edge spacing,Rigid/Flex,400um,300um,7,b,Plated through hole(edge of pad)to board edge spacing,Rigid/Flex,400um,300um,8,b,Non plated through hole to board edge spacing(no pad),Rigid/Flex,300um,200um,9,b,Buried via(edge of pad)to board edge spacing,Rigid/Flex,400um,300um,d,Flex Area,Board edge,Board edge,a,b,c,Flex Area,Board edge,Board edge,e,Flex Area,Board edge,Board edge,Trace and component pad at transition zone:,Design Rule,17,UMT Standard,UMT Advanced,10,F,Adhesive squeeze out,Rigid/Flex,0.80mm,0.50mm,11,G,Minimum flex width,Flex,2.00mm,1.00mm,12,H,Flex outline radius,Flex,1000um,500um,13,I,Milling path,Rigid/Flex,1.00mm,0.80mm,G,H,Rigid PCB,Rigid PCB,F,I,Flex area,Mechanical design at transition zone:,Design Rule,18,Item,Design Issue,UMTStandard Guideline,UMTAdvanced Guideline,S1,Minimum S1 bending to board edge distance,1.00mm,0.80mm,S2,minimum flexible area(edge of FPC)to board edge spacing,2.00mm,1.50mm,S1,Flexible area,Rigid area,S2,Mechanical design at transition zone:,Design Rule,19,Rigid section,Rigid section,Punch with,hard die,requirement,UMT suggest to place,radius 0.50mm,.,(Change from right angle to radius.Only UV laser cutting can make it right angle.),Before,Before,After,After,Mechanical design for flex radius:,Design Rule,20,Rigid section,Rigid section,Radius only 0.2mm,Punch with,hard die,requirement,UMT suggest to place,radius 0.50mm,.,(Change from right angle to radius.Only UV laser cutting can make it right angle.),Before,After,Mechanical design for flex radius:,Design Rule,21,UMT suggest to make this,waste slot,as,min.,1.50mm wide,.,Rigid section,Rigid section,1.25mm,Nominal 2.00mm,Or min.1.50mm,Before,After,Mechanical design for flex outline:,Design Rule,22,UMT suggest to make these corners as full,radius,.,Rigid section,Rigid section,Key points:,The quality of appearance inspection for these corners will be better.,(Burr-both rigid and flex material will be less than previous design.,Before,After,Mechanical design for flex outline:,Design Rule,23,UMT suggest to place two pcs in zero degree direction and the other two pcs,in 180 degree rotation,.,Y,X,Rigid section,Rigid section,Key Points:,All outline should be symmetrical.,(Incl.waste material slot),Mechanical design for panelization:,Design Rule,24,Provide tear resistance,UMT suggest to place recessed slot at the transition zone.,Rigid section,Rigid section,Key Points:,A recess slot would decrease the stress.,Recommended slot width:,Min.,1.50mm,;Nominal,:2.00mm,Mechanical design for transition zone:,Design Rule,25,Mechanical design for bending criteria:,Radius&Flex length,Design Rule,26,Content,:,Material Introduction,Design rule,Standard Process Flow,Open Discussion,27,TYPE 1,(,STANDARD PROCESS),TYPE 2,(PMF PROTECT FLEX),LASER CUTTING,(For Remove FR4),TYPE 3,(FR4 PROTECT FLEX),CONTENT:,28,TYPE,1,PROCESS(Standard),(For Flex,Without,Edge Finger or SMT Pads),29,Unimicron,Unimicron,(TYPE 1),A.Stack up&Structure 3+(2F)+3,30,(L45),Flex Material,Wait for,Combination,With,Rigid material,Cover layer,Material,Lamination,(Flex core with CVL),CVL-Cutting,Mechanical Drilling(I),Inner Layer,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Oxide Treatment,P.T.H&,Copper Plating,Laminate Cutting,(TYPE 1),B.Process Flow-Flex(L4-L5),Sub process,Main process,31,L36,Plus I Process,Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Ply-Up Of Layer,Lamination,L45-core,Blind&,Copper Plating,Laser Drilling,Blaser AOI,Inner Layer,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Oxide Treatment,Wait for Build up,to,L27,Non flow Prepreg,Material,Prepreg Routing,(TYPE 1),B.Process Flow-Rigid-Flex(L3&L6)Plus I,Sub process,Main process,32,L27,Plus II Process,Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Ply-Up Of Layer,Lamination,L36-core,Blind&,Copper Plating,Laser Drilling,Blaser AOI,Inner Layer,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Wait for Build up,to,L18,Non flow Prepreg,Material,Prepreg Routing,Oxide Treatment,(TYPE 1),B.Process Flow-Rigid-Flex(L2&L7)Plus II,Sub process,Main process,33,L18,Plus III Process,Lay Up,Lamination,L27,-core,Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),P.T.H&,Copper Plating,Mechanical Drilling(I),Laser Drilling,Blaser AOI,Outer Layer,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical inspection),Solder Mask,Immersion Gold,Routing,Hard Die Punching,O/S Testing,OQC,Packing&Shipping,Non flow Prepreg,Material,Prepreg Routing,(TYPE 1),B.Process Flow-Rigid-Flex(L1&L8)Plus III,Sub process,Main process,34,TYPE,2,PROCESS(PMF Protect Process),(For Flex,With,Edge Finger or SMT Pads),35,Unimicron,Unimicron,(TYPE 2),A.Stack up&Structure 1+(1+2F+1)+1,36,(L34),Flex Material,Tooling Drill,Laminate Cutting,Inner Layer L3/L4,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical,inspection),Wait for Combination With,Rigid material,Cover layer,Material,Lamination,(Flex core with,CVL),CVL-Cutting,Pumice,Stiffener,Material,Stiffener Shearing,Lamination,(Flex core with,stiffener),PMF,Material,PMF Shearing,Lamination,(Flex core with PMF),Baking,Lamination,Flex core with PMF,Sub process,Main process,Plasma,Brown Oxide,B.Process Flow-Flex(L3-L4),(TYPE 2),37,Build Up L2-L5,(Plus I),Wait for Build up,to L1/L6,PP Cutting,Lamination,(with flex core),Blaser AOI,Mechanical Drill,(L2-L5),Plug via,buried via L2-L5),Scrubbing,Inner Layer L2/L5,(image transfer),AOI,(automatic optical,inspection),Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical,inspection),Laser Drilling,(L2-L3/L4-L5),P.T.H&,Copper Plating,DES Line,(develop,etch,strip),B.Process Flow-Rigid-Flex(L2&L5)Plus I,(TYPE 2),Sub process,Main process,38,L1-L6,Process,Lay up,Lamination,Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical,inspection),L25-build up I,Copper Reduction,(by chemical),Electro-plating,(filled via),Laser Drilling,(L1-L2/L5-L6),Blaser AOI,Mechanical Drill,P.T.H&,Copper Plating,Outer Layer L1/L6,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical,inspection),Routing-2,O/S Testing,OQC,Packing&Shipping,Solder Mask,Immersion Gold,Routing-1,Remove,rigid waste area,above flex area,PSF Lamination,(cover rigid area),Plating hard gold,(finger on flex),Remove PSF,Flex Punch,PP routing,B.Process Flow-Rigid-Flex(L1&L6)Plus II,(TYPE 2),Sub process,Main process,39,LASER CUTTINGDIAGRAM,40,LASER CUTTING DIAGRAM FOR CAP REMOVAL,Step 1,Transition Line,Transition Line,Step 2,Step 3,Laser stop(target)copper design in L2/5,Laser Drill from top to L2&bottom to L5,Etch away target copper in L2&5,Remove FR4 cap above Flex along with laser cutting path,41,TYPE,3,PROCESS(FR4 Protect Process),(For Flex,With,Edge Finger or SMT Pads),42,(TYPE 3),A.Stack up&Structure 2+(2F)+2,43,B.Process Flow-Flex(L3-L4),(L34),Flex Material,Mechanical Drilling(I),P.T.H&,Copper Plating,Laminate Cutting,Inner Layer&DES,(image transfer),AOI,(automatic optical inspection),Oxide Treatment,Wait for,Combination,With,Rigid material,Cover layer,Material,Lamination,(Flex core with CVL),CVL-Drilling,Lamination,Flex core with CVL,CVL-Punch,Sub process,Main process,Sub process,Main process,(TYPE 3),44,B.Process Flow Rigid Inner Core,Rigid,Inner Core Process,Wait for Build up,to L25,Bonding Sheet,Material,BS Drilling,Core drilling,Laminate Cutting,Inner Layer&DES,(image transfer),AOI,(automatic optical inspection),CORE-Cutting,Soft Bonding,(Core with BS),BS-Punch,Sub process,Main process,(TYPE 3),Bonding Sheet(BS),Inner core(one side copper),45,B.Process Flow Rigid-Flex(L2&L5)Plus II,L25,Process,Lamination,(Flex with Rigid ),Micron via,Copper Plating,Inner Layer&DES,(image transfer),(L2/L5),AOI,Oxide Treatment,Wait for Build up,to L16,Rigid,Rigid,Flex,Conformal Mask,(image transfer),DES Line,(develop,etch,strip),AOI,(automatic optical,inspection),Laser Drilling,(L2-L3/L4-L5),Rigid core Laminate,with Flex core,(PRESS),Sub process,Main process,(TYPE 3),46,B.Process Flow Rigid-Flex(L1&L6)Plus II,L16,Process,Lay up,Lamination,Laser Drilling,L25-core,P.T.H&,Copper Plating,Drilling,Outer Layer&DES,(Image transfer),(L1/L6),AOI,Solder mask,Remove FR4,Above Flex,Immersion Ni/Au,Printing of Legend,CNC Routing(2),O/S Testing,Final Punch,Blaser AOI,OQC,Packing&Shipping,Conformal Mask,(Image transfer),DES Line,(develop,etch,strip),AOI,(Automatic optical,inspection),Sub process,Main process,(TYPE 3),CNC Routing(1),47,Thank you,48,L Type,U Type,Z Type,Measure Method:,1.Pretreatment:Reflow 2 cycles,2.According customers condition to test,3.Static:above 30cycles,，,Dynamic:Until fail.,Criteria:Resistance change rate 10%,Reliability on flex:Bending test,49,A,B,B,A,B,Measure Method:,1.Pretreatment:Reflow 2 cycles,2.According customers condition to test,3.Static:above 30cycles,，,Dynamic:Until fail.,Criteria:Resistance change rate 10%,Reliability on flex:Sliding Test,50,Measure Method:,1.Pretreatment:Reflow 2 cycles,2.Criteria:Resistance change rate 10%,Reliability on flex:Torsion test,51,Measure Method:,1.Pretreatment:Reflow 2 cycles,2.Criteria:Resistance change rate 10%,Reliability on flex:G/F crack Test,52,