红外瞄准镜热电制冷控制电路在温度冲击环境下热性能研.doc

红外瞄准镜热电制冷控制电路在温度冲击环境下热性能研究
Thermal Research of Infrared Sight Thermoelectric Cooler Control Circuit under Temperature Shock Environment

摘要： 本文研究了红外瞄准镜热电制冷控制电路在温度冲击环境下的热性能稳定技术，对系统选择的 ADI 芯片 ADN8830 器件、焊接材料和 PCB 电路板首先进行模型参数及几何参数设定，利用 ANSYYS 工程有限元分析软件对采用 CSP32 分布型热电制冷控制电路进行热冲击加载仿真与波形曲线研究分析，由于整体模型中焊点在 X 方向即焊点竖直方向上的应力应变比其他两个方向大的多，所以对单个焊点局部模型施加热载荷时主要考虑 X 方向的初始应力约束，在分离整体模型中应变最大对角端焊点绝对热载荷应力时，根据热载荷的循环进行插值处理，求得局部模型上下面中节点的塑性应变及热应力。
Abstract: This paper studies the infrared sight thermoelectric cooling control circuit in the temperature of the thermal shock environment stable performance technology the system of choice ADI chip ADN8830 devices welding materials and PCB circuit board first of all the model parameters and geometric parameters setting the use of ANSYYS engineering finite element analysis software using CSP32 distribution pattern of thermoelectric cooling load control circuit for thermal shock wave curve of simulation and research and analysis due to the overall model of solder joints in the X direction of the vertical direction of the stress and strain than the other two the direction of larger therefore the partial model of a single solder joint thermal load imposed by the main consideration for X direction of the initial stress constraint in the separation of the overall model the biggest strain on the angle-side solder joint stress the absolute thermal load depending on thermal load cycle on interpolation processing partial model obtained the following nodes in the plastic strain and thermal stress.
分析结果表明 : 随着温度循环载荷的运行，每个循环的 X 向力最大值不断增大；危险点的塑性应变不断积累，同时结构变形和等效塑性应变最大的位置在第一和第八个焊点处，最终将会造成结构失效。
The results show that: With the temperature cyclic loading operation each cycle of X to the power of the maximum growing; dangerous point in continued accumulation of plastic strain while structural deformation and the location of maximum equivalent plastic strain in the first and eighth a solder joint office will ultimately result in structural failure.

关键词： 光电子学； 热性能研究；温度冲击试验；红外瞄准镜；热电制冷控制电路
Key words: optoelectronics; thermal performance studies; temperature impact test; infrared sight; thermoelectric refrigeration control circuit

1 引言
随着大规模集成电路和电子封装集成度的提高，电子设备及系统正向轻、薄、短、小、低功耗、多功能、可靠性等方面发展，但是集成电路的发热量也越来越高 [1] 。
1 Introduction
With the large scale integrated circuits and electronic packaging integration of the raise electronic equipment and systems being light thin short small low power multi-function reliability and so the development of integrated circuits but have an increased heat The higher [1].
为了适应已经出现的超高速、高发热、多端子、窄节距等要求，在保障芯片性能的同时尽量实现高密度封装。
That has emerged in order to meet the ultra-fast high fever multiple terminals narrow pitch etc. in the protection of chip performance while minimizing high-density packaging.
如今，集成电路的可靠性在军用产品的地位和产品本身的质量要求已经同等重要，如何提高和保证军用电子产品的可靠性已经成为电子产品生产和军品研究部门的共同研究课题，而微电子封装的可靠性是保证军品电子产品整体可靠性的技术关键 [2] 。
Today the reliability of IC products in the military status and the quality requirements of the product itself has been equally important how to improve and ensure the reliability of military electronic products has become the electronic product manufacturing and military research joint research projects while the microelectronic packaging reliability is to ensure the overall reliability of military electronics technical key [2].
电子封装及电路板组件在工艺或服役过程中，因为环境过高引起热膨胀在封装结构内产生热应力应变，从而导致电子封装的电、热或机械失效，所以军用电子产品的电子封装的可靠性是该技术领域的关键，研究和分析电子封装的可靠性，也是当前各个相关研究机构的重点研究课题 [3] 。
Electronic packaging and circuit board assembly in the process or service process because the environment caused by excessive thermal expansion of the package structure heat generated within the stress and strain leading to electronic packaging of electricity heat or mechanical failure so military electronics products electronic packaging and reliable sex is the key technology research and analysis of the reliability of electronic packaging but also in various related research institutions currently a key research project [3].
要对电子封装整体和各个部件进行研究与分析，主要有两种方法：第一种是试验方法，该方法主要包含有压阻式应变计试验测量法、激光干涉仪测验应变法、结合热循环条件的应力测试方法。
Want to package as a whole and the various components of electronic research and analysis There are two main ways: the first is a test method which consists mainly of a piezoresistive strain gauge test measurements laser interferometer test strain method combined with thermal cycling conditions of stress testing methods.
但是由于试验条件的限制，封装尺寸较小，服役环境的试验模拟困难等因素，使得采用该试验方法进展缓慢 [4] 。
However due to testing conditions the package size small and difficult to simulate service environment factors such as the pilot making slow progress in adopting the test method [4].
第二种是数值模拟的方法，具体采用计算机仿真软件的方法，对试验试件进行热冲击过程软件仿真模拟，对芯片、焊料、 PCB 板、热介质等进行材料参数与结构参数设置，然后进行热加载及求解，最后得到仿真数据结果分析，结果对红外瞄准镜的生产和环境试验的研究具有指导意义 [5] 。
The second is the numerical simulation method the specific method of using computer simulation software for thermal shock testing specimens the process of software simulation on the chip solder PCB thermal media etc. of material parameters and structural parameters of setting and then heat load and solving the final results obtained simulation data analysis the results of infrared sight to the production and environmental testing of guiding significance for the study [5].

2 温度冲击试验
这里使用 TST-05B 型温度冲击试验装置 适合于半导体器件、电子产品和其它军用设备在周围大气温度急剧变化条件下的适应性试验。
2．Temperature Impact Test
TST-05B model used here the temperature shock test device suitable for semiconductor devices electronic products and other military equipment rapid changes in the surrounding air temperature the adaptability test under the condition.
温度控制器采用进口可编程温度控制器，进口 LED 数显（ P 、 I 、 D +S 、 S 、 R ）微电脑集成控制，温度传感器采用 Pt100 铂电阻，制冷机组采用进口德国谷轮半封闭压缩机组，制冷方式采用二元复叠压缩制冷，冷却方式采用水冷（冷却水水压： 0.2 ～ 0.4MPa ，水温：≤ 30 ℃） 冷凝器采用板式换热器，加热器和冷却器采用镍铬合金电加热器、翅片式冷却器，循环风采用机轴流风机，气动气缸采用提篮在高、低温室转换驱动器，空气压缩机采用提供驱动气缸的压缩空气 温度预热上限 / 预冷下限
Programmable temperature controller temperature controller of imports and import LED digital display (P I D + S S R) micro-computer integrated control using Pt100 platinum resistance temperature sensor refrigeration units imported German Copeland Semi-hermetic Compressor Units cooling method using the dual-cascade compression refrigeration cooling method using water-cooled (cooling water pressure: 0.2 ~ 0.4MPa water temperature: ≤ 30 ℃) condenser with plate heat exchangers heaters and coolers use of nickel-chromium alloy electric heater fin-type coolers axial fan circulating air using machines pneumatic cylinder with basket in high and low temperature chamber to convert the drive air compressors used compressed air to provide a driving cylinder the temperature limit preheat / pre-cooling limit ＋ 180 ℃ / － 75 ℃，满足 GJB4239-2001 、 GJB150.6-86 和 MIL-STD-810F 标准 [6] 。 + 180 ℃ / - 75 ℃ to meet the GJB4239-2001 GJB150.6-86 and MIL-STD-810F standard [6].

本项目试验样品（控制电路部分）附近测量系统的温度应在试验温度的± 2 ℃以内，其温度梯度不超过 1 ℃ /m ，或总的最大值为 2.2 ℃（试验样品不工作）。 The project of the test sample (control circuit part) near the temperature measuring system shall be the test temperature within ± 2 ℃ the temperature gradient of no more than 1 ℃ / m or total maximum value of 2.2 ℃ (the test sample does not work).
控制传感器附近空气的相对湿度应在被测试值的± 5% 以内，绝对湿度相当于 35 ℃时 50% 的相对湿度。
Control sensor in the vicinity of air relative humidity should be tested value within ± 5% absolute humidity is equivalent to 35 ℃ 50% relative humidity. 气压波动范围是± 10% 。 Pressure fluctuation range is ± 10%.
试验样品附近空气速度不超过 1.7m/s 。 Air velocity in the vicinity of the test sample does not exceed 1.7m / s. 为了限制热辐射，试验箱（室）内壁的温度与试验温度之间的差不超过试验温度（按照 K 值计算） 3% ，这个规定适合整个试验箱（室）内壁，而试验样品不经受任何不符合这一项目规定的其它加热和冷却因素。
To limit the heat radiation the chamber (room) wall temperature and test temperature does not exceed the difference between the test temperature (in accordance with K value) 3% this requirement for the entire chamber (room) wall while the test sample is not subjected to any not in conformity with the provisions of this project to other heating and cooling elements.
温度变化率不得超过 10 ° C/min [7] 。 The temperature change rate should not exceed 10 ° C / min [7]. 如图 1 是本次进行试验的红外瞄准镜光学镜头和其它核心部件（主要包含控制电路、微测辐射热计阵列探测器和光学变焦镜），微测辐射热计阵列采用法国 ULIS 公司生产的 UL01011 型 320×240 a -Si 阵列，配上光学镜头和显示设备，可以构成热成像系统。 Figure 1 is to test this infrared sight optical lenses and other core components (mainly contains the control circuits micro-bolometer detector array and optical zoom lens) micro-bolometer arrays produced using France ULIS UL01011-type 320 × 240 a-Si array coupled with optical lenses and display devices can constitute a thermal imaging system.
控制电路是自主开发的电源电路、信号处理电路和温度控制电路，具体见图 2 所示，其中信号处理电路是控制电路的核心部分。 Control circuit is self-developed power supply circuit signal processing circuit and temperature control circuit specifically as shown in Figure 2 in which signal processing circuit is the core of the control circuit.

图 1 光学镜头和其它核心部分 Figure 1 optical lenses and other core parts of 图 2 控制电路部分 Figure 2 control circuit part of the

Fig.1 lenses and other parts of core Fig.2 Control circuit Fig.1 lenses and other parts of core Fig.2 Control circuit

试验样品应该在正常试验的标准大气压下进行安装，并且尽可能安装在试验设备中央。 Of the test sample should be the standard test in the normal atmospheric pressure for installation and test equipment as installed in the Central. 温度冲击试验的具体步骤是： Temperature impact test concrete steps are:

（ 1 ）将瞄准镜控制电路取下，包装完好分别进行高低温环境冲击试验； (1) Remove the sight control circuit packaging intact were the high-low temperature impact test;

（ 2 ）将瞄准镜控制电路呈非工作状态，水平置于低温试验箱内，温度控制在 -55 ℃± 2 ℃，恒温 1h ，或者试验样品达到温度稳定，以时间长者为准； (2) Sight control circuit was non-work status the level of low-temperature tests placed inside a temperature controlled at -55 ℃ ± 2 ℃ temperature 1h or the test sample to reach temperature stability a time whichever;

（ 3 ）低温结束后，在 5min 内将瞄准镜控制电路置于高温试验箱内，温度控制在 125 ℃± 2 ℃，恒温 1h 或者试验样品达到温度稳定，以时间长者为准； (3) low temperature after the end of the 5min control circuit within sight placed inside high-temperature tests the temperature controlled at 125 ℃ ± 2 ℃ temperature 1h or the test sample to reach temperature stability a time whichever;

（ 4 ）高温结束后，然后在 5min 内再次输入 -55 ℃± 2 ℃低温试验箱内，恒温 1h 或者试验样品达到温度稳定，以时间长者为准。 (4) after high temperature and then again within 5min type -55 ℃ ± 2 ℃ low temperature testing box at constant temperature 1h the temperature or the test sample to achieve stability in a time whichever.

（ 5 ）重复上面（ 2 ）、（ 3 ）和（ 4 ）的试验。 (5) Repeat the above (2) (3) and (4) experiment. 照此进行 5 个循环周期，待瞄准镜恢复常温进行测试。 Do the same for five cycles when tested at room temperature to restore sight.

红外瞄准镜环境温度冲击和不合理的温度变化将会诱发一系列的控制电路问题，如呈现局部过热，引起芯片结区烧毁；温度分别不均匀，差异过大，影响信号的传输；材料热稳定膨胀系数不匹配，引起热应力并引起翘曲、裂纹，甚至产生失效和破坏。 Infrared Sight and unreasonable impact on the ambient temperature the temperature change will induce a series of control circuits such as rendering local overheating causing chip junction area burned; temperatures were uneven the difference is too large affecting the signal transmission; materials heat-stable expansion coefficient mismatch caused by thermal stress and cause warping cracks and even produce failure and destruction.
因此，展开红外瞄准镜控制电路在温度冲击环境下热设计和散热技术等热性能研究非常必要的。
Therefore the start control circuit sight infrared temperature thermal shock environment design and thermal performance of cooling technology research is necessary.
芯片产生的热量主要通过两条途径进行传播，一条是热量由芯片结区向外传播，在外表面通过对流和热辐射向外部环境传播；另外一条是经过对流和辐射的形式，部分热量穿过封装内部到达外壳的内表面，再传播到外表面，最后再向外部环境传播。
Generated heat spread mainly through two channels one is the heat from the chip junction area outside the spread of the outer surface by convection and thermal radiation transmitted to the external environment; another one is the result of convection and radiation in the form of some of the heat through the package to reach the inner surface of the internal shell and then spread to the outer surface of the final transmission back to the external environment.
通常第二条途径的传播可以忽略不计，为了在芯片在服役过程中热量能够及时的从封装体内释放出来，可以选择热导率高的基板、粘结剂等材料，用来降低第一条途径中的热阻 [8]
The second means of communication is usually negligible in order to chip in service during the heat can be promptly released from the package body you can choose a high thermal conductivity substrates adhesives and other materials used to reduce the first pathway thermal resistance [8].

3 热应力及有限元模型
红外瞄准镜控制电路由电源电路、信号处理电路和热电制冷控制电路三部分组成，这里展开的是热电制冷控制电路 (thermoelectric cooler ： TEC) 核心部分研究。
3 thermal stress and finite element model
Infrared aiming mirror control circuit from the power supply circuit signal processing circuitry and thermoelectric refrigeration control circuit consists of three parts where start is the thermoelectric refrigeration control circuit (thermoelectric cooler: TEC) the core part of its research.
为了满足微测辐射热计阵列热成像系统的小型化设计需求，热电制冷控制电路设计采用 ADI 公司的 ADN8830 芯片，使得 TEC 达到了高性能、低功耗、小型化的目的，功耗明显降低，环境温度适用范围加大，基本满足了军事应用需求。
In order to meet the micro-bolometer array thermal imaging system design requirements for the miniaturization thermoelectric cooling control circuit design uses ADI's ADN8830 chips makes the TEC to achieve a high-performance low power consumption miniaturization of the purpose of significantly lower power consumption ambient temperature to increase the scope of application basically meet the needs of military applications.
但是对其高低温度冲击的环境适应性，一直是影响瞄准镜正常工作的关键因素，所以展开该方面的研究对瞄准镜的设计和工艺改进具有重要意义 [9] 。 However high and low temperature impact on their environmental adaptability affecting the sight has been a key factor in normal work so the research started in the right sight of the design and process improvement important [9].

3.1 热应力描述

TEC 温控电路采用 ADI 公司的 ADN8830 芯片，对 ULIS UL01011 型微测辐射热计阵列内部集成的 DT3-4 型 TEC 进行控制，实现阵列的温度稳定。
3.1 The description of thermal stress
TEC temperature control circuit using ADI's ADN8830 chips right ULIS UL01011 micro-bolometer array integrated within the DT3-4-based TEC is controlled to achieve the temperature stability of the array.
该器件依赖于负温度系数（ NTC ）热敏电阻感应器件， TEC 目标温度可以从 DAC 电路或外部电阻分压器的模拟端输入。
The device relies on a negative temperature coefficient (NTC) thermistor sensing device TEC target temperature can be from a DAC or an external resistor divider circuit analog-ended input.
循环稳定具有高稳定性，也可以从低噪声放大器的 PID 算法得到补偿，这个补偿电路的值可以二极管热传递函数计算数值或从应用笔记部分给出的查找表获得。
Loop stability and high stability low-noise amplifier can also be compensated for the PID algorithm the value of this compensation circuit diode heat transfer function can be calculated from the application notes part of the value or lookup table given access to. ADN8830 芯片采用的封装是 32-Lead LFCSP 分布形式如图 3 所示，其芯片侧视如图 4 所示。
ADN8830 chip package is a 32-Lead LFCSP distribution of the form shown in Figure 3 the chip side-view shown in Figure 4. CSP 封装可以让芯片面积与封装面积之比超过 1:1.14 ，已经相当接近 1:1 的理想情况，绝对尺寸也仅有 32 平方毫米，约为普通的 BGA 的 1/3 ，仅仅相当于 TSOP 内存芯片面积的 1/6 。 CSP package allows chip area and packaging area ratio of more than 1:1.14 1:1 is already quite close to the ideal case the absolute size only 32 square millimeters about the ordinary BGA 1 / 3 only the