电子英语证书考试(PEC)-电子工程术语.doc

电子英语证书考试(PEC)-电子工程术语

A
A
Symbol for ampere.
abstract
To simplify.
ABT
Acronym for Advanced BiCMOS Technology, as in 74ABT245.
ABTE
Acronym for Advanced BiCMOS Technology/Enhanced logic,  as in 74ABTE245.
ABTH
Acronym for Advanced BiCMOS Technology logic with bus-Hold, as in 74ABTH245.
AC
Acronym for Alternating Current.
AC
Acronym for Advanced CMOS logic, as in 74AC245.
accuracy
1.  The extent to which a given measurement, or the average of a set of measurements, agrees with the true value for that measurement. 2.  Agreement between simulation results and lab measurements.
ACL
Acronym for Advanced CMOS Logic, as in 74ACL245.
ACT
Acronym for Advanced CMOS logic with TTL compatible inputs.
AEA
Acronym for American Electronic Association.
AEA
Acronym for American Engineering Association.
AHDL
Acronym for Analog Hardware Description Language.
AMS
Acronym for Analog Mixed-Signal (hardware description language).
analog
Information represented as continuously varying voltage or current rather than in discrete levels as opposed to digital data varying between two discrete levels.
ANOVA
Acronym for Analysis Of Variance
ANSI
Acronym for American National Standards Institute.
AQL
Acronym for Acceptable Quality Level.
ASCII
Acronym for American Standard Code for Information Interchange.
ASIC
Acronym for Application Specific Integrated Circuit.
ASTM
Acronym for American Society for Testing and Materials.
AWE
Acronym for Asymptotic Waveform Evaluation. Model order reduction. Such as reducing a large RC network to a smaller RC network for faster simulation. This modeling method has known frequency limits for accuracy.

B
behavioral model
Provides data on behavior at the input and output ports of a device. What the device consists of internally remains a black (opaque) box. Usually used when scanning a large design for the first time. At that point speed is desired over detail.

behavioral modeling
System-level modeling consisting of a functional specification plus modeling of the timing of an implementation. A behavioral model consists of an HDL description of a device or component, which is expressed at a relatively high level of abstraction (higher than the register-transfer level or gate level). It uses underlying mathematical equations to represent the functional behavior of the component. See alsofunctional modeling.

BEM
Acronym for older Boundary Element Method. Method of numerical computational electromagnetics. Dates from before the 1980s. Requires ground plane.
BER
Acronym for Bit Error Rate.
BGA
Acronym for Ball Grid Array.
BiCMOS
Acronym for Bipolar Complementary Metal Oxide Semiconductor.
BIRD
Acronym for Buffer Issue Resolution Document – IBIS Committee.
BJT
Acronym for Bipolar Junction Transistor.
BNC
Acronym for Bayonet Neill Concelman Connector.
BOM
Acronym for Bill Of Materials.
BSIM
Acronym for Berkeley Short-channel IGFET Model.
BTL
Acronym for Backplane Transceiver Logic, as in 74BTL245.

C
C
1.  Symbol for capacitance. 2.  Abbreviation for degrees Celsius/Centigrade.
CAD
Acronym for Computer Aided Design.
CAE
Acronym for Computer Aided Engineering.
CAM
Acronym for Computer Aided Manufacturing.
CB
Acronym for Complementary Bipolar, as in 74CB245.
CEM
Acronym for Computational Electromagnetics.
characteriza-tion model
Another term for a device’s data sheet. Displays the behavior of various properties over current, frequency, temperature, population spread, etc. Characterize means to describe and depict.
circuit
Interconnection of components to provide an electrical path between two or more components.
CISPR
Acronym for Comité Internationale Spécial des Perturbations Radioelectrotechnique.
CMC
Acronym for Compact Model Council.
CML
Acronym for Current Mode Logic.
CMOS
Acronym for Complimentary Metal Oxide Semiconductor.
CMRR
Acronym for Common Mode Rejection Ratio.
Confidence interval
A statistical range with a specified probability that a given parameter lies within the range.
Confidence level
Example: Suppose an opinion poll predicted that, if the election were held today, the Conservative party would win 60% of the vote. The pollster might attach a 95% confidence level to the interval 60% plus or minus 3%. That is, he thinks it very likely that the Conservative party would get between 57% and 63% of the total vote.
Confidence limit
Either of the two numbers that specify the endpoints of a confidence interval.
correlation
1. How well a set of measurements agrees with a separate set of measurements on the same group of units. One or more attributes may be used. 2. Process of making a quantitative comparison between two sets of data. Also, from the word roots co: together and relation.
correlation metric
A means of quantifying agreement between two sets of data.
COTS
Acronym for Commercial Off-The-Shelf apparatus.
CPD
Acronym for Cumulative Probability Distribution (function).
crosstalk
The amount of signal from one conductor that gets coupled onto an adjacent conductor through the mutual capacitance and inductance between them. The magnitude of the effect is always a fraction of the active, or aggressor, net upon the passive, or victim, net. The amount of coupling depends on the proximity of the nets, the proximity of any ground/power plane, the length of any parallel runs, the risetime of the driving signal and the dielectric medium between them.
current carrier
A current carrier is either a conduction band electron or a conduction band hole.

D
DARPA
Acronym for Defense Advanced Research Projects Agency.
data sheet
Documentation created after the properties and behavior of a population of devices, from a statistically in-control process, are characterized.
dB
Acronym for decibel. The number of decibels denoting the ratio of the two amounts of power being ten times the logarithm to the base 10 of this ratio. With P1 and P2 designating two amounts of power and n the number of decibels denoting their ratio.(ANSI C63.14 – 1992) N = 10log10 (P1/P2) dB
dBmV/m
Symbol for decibels-micro-Volts per meter. where dBmv = 20 log [Signal (mV)/1mV] Decibels relative to one microvolt across same resistance.
DC
Acronym for Direct Current.
detailed physical model
A device model wherein its internal detail is described as closely as possible. There is usually a close correlation with the physical construction of the device.
device
A component or part.
DFM
Acronym for Design For Manufacturability.
DFT
Acronym for Design For Test.
DIE
Acronym for Die Information Exchange.
dielectric
Dielectric materials are poor conductors of electricity, and are insulators that are used to provide separation between conductors. Dielectric materials can be made to hold an electrostatic charge while dissipating minimal energy in the form of heat. Glass, porcelain, mica, rubber, plastics dry air, vacuums and some liquids and gases are dielectric. For example: air, FR4, and GETEK.
dielectric constant (relative)
An inherent property of dielectric materials that determines the amount of electric charge that can be stored. The higher the constant, E, the higher the energy stored in the material’s capacitance. E is usually measured and reported in formulas relative to air (Er). Air then gets an Er, = 1. FR4 often has a low frequency Er = 4.3 depending on starting materials and processing. In solid dielectrics Er  will fall off starting with high frequencies while signal attenuation increases. Er affects transmission line behavior, particularly characteristic impedance (Zo) and propagation delay (td).  The changes in td with frequency cause decreased delay leading to dispersion, or spreading distortion, of a time domain pulse that is composed of many frequencies.
digital
Data varying between two discrete levels. Electronic signals or switches based on discrete, binary electrical levels (ones and zeros) found in such products as touch-tone telephones and audio compact disk players. These signals are either ON or OFF, HIGH or LOW, YES or NO. The mathematical description in digital products is simple, since it is either ON or OFF.
DIP
Acronym for Dual InLine Package.
discrete
As in discrete component.  Package containing only a single component as opposed to an integrated circuit containing many components in a single package.
dispersion
1. The scattering of values of a measurement around the mean or median of the measurement.2. A distribution.
dispersion, dielectric
A high frequency effect in dielectric materials. At high frequencies the dielectric constant decreases causing an increase in propagation velocity and a dispersion in arrival times of wave frequency components.
DML
Acronym for Device Modeling Language (Cadence) and associated .dml files.
documentation
Reports such as data sheets, process control, product characterization, process characterization, and models. May be produced by either the supplier or customer to describe or depict the semiconductor process.
DOE
Acronym for Design Of Experiments.
doping
The process of adding impurity atoms to intrinsic (pure) silicon or germanium to improve the conductivity of the semiconductor material.
DSP
Acronym for Digital Signal Processing.
DTL
Acronym for Diode-Transistor Logic.
DUT
Acronym for Device Under Test.

E
Early effect
A behavior in narrow base BJT transistors named for Dr. J. Early who explained it. The effect is an increase in b due to base narrowing caused by increasing base-collector bias voltage.
EBD
Acronym for Electronic Board Description (IBIS) and the associated .ebd files.
ECL
Acronym for Emitter Coupled Logic.
EDA
Acronym for Electronic Design Automation. EDA software tools or tool suites may display simulator output for analysis (as in waveform analyzers) or which may analyze the reliability, electromagnetic interference, metal migration, signal integrity, or thermal characteristics of a design. The tools in this category may work at any level of abstraction — behavioral, register-transfer-level (RTL), gate-level, or with the physical layout of an IC device or electronic system.
EDIF
Acronym for Electronic Design Interchange Format.
EIA
Acronym for Electronic Industries Association.
EIAJ
Acronym for Electronics Industries Association of Japan.
EKV
Acronym for Enz-Krummenacher-Vittoz model.
ElectroMagnetic Integrity
The technical discipline of designing for ElectroMagnetic Control (EMC) and low ElectroMagnetic Interference (EMI), so that one circuit (or equipment) does not interfere with another circuit (or equipment). The design task begins with designing for good Signal and Power Integrity and adds the concerns of coupling and radiation. The noise energy available to the coupling and radiation mechanisms can be suppressed with good Signal and Power Integrity. The next step is good design control over coupling and radiation mechanisms. These additional actions include controlling: shielding; cabling; leakage; board resonances; enclosure resonances; structural behavior that operates as an antenna.
EM
Acronym for ElectroMagnetic.
EMC
Acronym for ElectroMagnetic Compatibility. The capability of Electrical and Electronic Systems, equipment and devices to operate in their intended electromagnetic environment within a defined margin of safety, and at design levels of performance, without suffering or causing unacceptable degradation as a result of electromagnetic interference (ANSI C63.14 – 1992).
EMI
Acronym Electromagnetic Interference. The electromagnetic disturbances (electronic noise) in an environment that can affect an electronic device, or that which is being produced by an electronic device, or both. EMI analysis tools are used to verify EMC compliance during the design of high-speed PCBs and IC packages. The traditional EMI remedies involve the addition of extra components, metal shields, metal plans, or even redesigning the entire system. Synonym: radio-frequency interference.
EMI/EMC
Acronym for Electromagnetic Interference/Electromagnetic Control.
equation-based model
A model based on equations that describe the behavior of the device, or circuit, modeled. Most importantly, the output as a function of the input.
ESD
Acronym for ElectroStatic Discharge. A transfer of electric charge between bodies of different electrostatic potential in close proximity or through direct contact (ANSI C63.14 – 1992).
ESS
Acronym for Environmental Stress Screening.
eV
Abbreviation for electron-volt.

F
F
Symbol for Farad, measure of capacitance.
f
Abbreviation for frequency.
FACT
Acronym for Fairchild Advanced Cmos Technology, as in 74FACT245.
FAST
Acronym for Fairchild Advanced Schottky TTL, as in 74F245.
FCT
Acronym for Fast Cmos Technology, as in 74FCT245.
FDTD
Acronym for Finite Difference Time Domain modeling.
FEA
Acronym for Finite Element Analysis.
FEM
Acronym for Finite Element Method. Method of numerical computational electromagnetics. Essentially everybody does some form of this for field solvers, such as T-lines.
FET
Acronym for Field Effect Transistor.
FFT
Acronym for Fast Fourier Transform.
FOM
Acronym for Figure Of Merit.
FPGA
Acronym for field programmable gate array.
functional modeling
Modeling by the use of mathematical functions, algorithms and formulas.

G
G
Symbol for giga, as in10+12
GaAs
Acronym for Gallium Arsinide.
GB or Gbit or GBIT
Acronym for GigaBit.
glue logic
Small ICs that level shift and otherwise perform simple functions that enable large blocks of logic (ASICs, microprocessors, memories) to work together. Thus gluing them together.
GND
Acronym for GrouND. A reference connection commonly connected to Earth, whose electric potential is usually equal to zero.
ground bounce
The transient rise or fall in voltage on a ground plane or ground pin from its ideal quiescent value of zero due switching currents on and off through impedance (mostly inductance) in the ground path. A similar effect on the power plane causes power bounce. The result is noise on the signal that can decrease signal to noise ratio in analog circuits or lead to false switching in digital circuits.
GTL
Acronym for Gunning Transceiver Logic, as in 74GTL245.
GTLP
Acronym for Gunning Transceiver Logic Plus, as in 74GTLP245.
guard-banding
The practice of adding safety margin, or extra safety margin, to specification limits or population distributions.

H
H
Abbreviation for Henry, the unit of inductance.
HALT
Acronym for Highly Accelerated Life Test.
HASS
Acronym for Highly Accelerated Stress Screening.
HC
Acronym for High speed Cmos, as in 74HC245.
HCT
Acronym for High speed Cmos with TTL thresholds, as in 74HCT245.
HDL
Acronym Hardware Description Language. One of several specialized high-level languages used by semiconductor designers to describe the features and functionality of chips and systems prior to handoff to the IC layo