RoHs豁免权.docx

RoHS 指令豁免清单

RoHS 指令豁免清单
截至2006年5月11日，，，，RoHS 指令所有豁免项如下：：：：
免除2005/95/EC 指令第4（1）条中所要求的铅、汞、镉、六价铬、多溴联苯和多溴二苯醚的应用。
1. 小型日光灯中的汞含量不得超过5 毫克/灯；
2. 一般用途的直管日光灯中的汞含量不得超过：
— 盐磷酸盐10 毫克
— 正常的三磷酸盐5 毫克
— 长效的三磷酸盐8 毫克
3. 特殊用途的直管日光灯中的汞含量；
4. 本附录中未特别提及的其它照明灯中的汞含量；
5. 阴极射线管、电子部件和发光管的玻璃内的铅含量；
6. 钢中合金元素中的铅含量达0.35%、铝合金中的铅含量达0.4%，铜合金中的铅含量达4%；
7. ——高温融化的焊 中的铅（如：铅含量,85%的合金中的铅）；
——以下用途中所使用的焊料中的铅：服务器，存储器、用于交换信号产生和传输的网络基础设施、电信
网络管理设备；
——电子陶瓷零件中（如：压电装置）的铅；
8. 电触头中镉及其化合物的应用，以及根据修改关于限制特定危险物质和预制品销售和使用的第76/769/EEC
号指令的第91/338/EEC 号指令禁止以外的镉电镀。
9. 在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。
9a. 聚合物装置中十溴二苯醚的应用；
9b.铅青铜轴承外壳及其轴衬中铅的应用；
10. 根据在第7（2）条中提及的程序，欧盟委员会应评价以下方面的应用：
——特殊用途的直管日光灯中的汞；
——灯泡。
11. 顺应针联接系统中使用的铅。
12. 热导枪钉模组涂层中所用的铅。
13. 光学玻璃及滤光玻璃中所用的铅及镉。
14. 微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）。
15. 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
16. 线形白炽灯硅酸盐灯管中的铅；
17. 用于专业复印设备的高强度放电灯(HID)中用作激发的卤素铅；
18. 当放电灯被用作含磷的仿日晒灯(sun tanning lamps)，比如含有BSP (BaSi2O5b)，以及用于重氮复印、
平版印刷、捕虫器、光化学和食物加工过程的特种灯，含有磷时，比如SMS ((Sr,Ba)2MgSi2O7b)，放电
灯中的荧光粉触媒剂的铅含量在其重量的1％或以下；
19. 紧凑型节能灯(ESL)中作为主要汞齐合金的特定成分(PbBiSn-Hg和PbinSg-Hg)中的铅以及作为辅助汞合金
PbSn-Hg中的铅；
20. 液晶显示器(LCD)用于连接平面荧光灯前后基片用的玻璃中的氧化铅。
备注：以上译文中，当汉语意义发生歧义时，请以英文原文内容为准。
相关指令：2002/95/EC,2005/717/EC,2005/747/EC, 2006/310/EC
在 2002/95/EC 指令的附录中增加下面的第 21 到27 项：
21．用于硅硼玻璃瓷釉上印刷油墨中的铅和镉。
22．用于光纤通讯系统的稀土铁石榴石法拉第旋转器中的杂质铅。
23．使用铁镍合金或者铜引线框架的细间距元器件（即不大于 0.65mm 的引脚间距）的表面处理中的铅,不包括连接器类。
24．通孔盘状和平面阵列的多层陶瓷电容中焊料里的铅。
25．等离子显示屏和表面传导式电子发射显示器构
26．紫光灯/黑光灯（或叫蓝黑灯）的玻璃壳中的氧化铅。
27．在高性能扬声器（特指连续几小时运作在声功率 125 分 贝 以 上 ） 中 的 传 感 器 上 作 为 焊 料 的 铅 合金。
在 2002/95/EC 指 令 的 附 录 中 增 加 下 面 的 第 28项：
28．2002/96/EC 指令规定的第三类设备（IT 和通讯设备）中，以下金属件表面防腐层中的六价铬：用于防腐和屏蔽电磁干扰的未上漆的金属片和扣件。该豁免项将在 2007 年 7 月 1 日取消。
在 2002/95/EC 指令的附录中增加下面的第 29项：
29． 69/493/EEC 指令附录 I（1，2，3 和 4 类）中限定的水晶玻璃中的铅。（注：1 类 PbO ≥ 30%；2类 PbO ≥ 24%；3 类 ZnO BaO PbO K2O 单个或总和 ≥ 10%；4 类 BaO PbO K2O 单个或总和≥

欧盟5月24日官方公报，发布欧盟委员会决议2008/385/EC，RoHS指令新增3条豁免条款。具体增加内容如下：
30：用于位于音量大于或等于100分贝的大功率扩音器音圈上的电导体的电气或机械焊点的镉合金。
31：用于无汞平面荧光灯（例如：用于液晶显示器、设计或工业照明）的焊料中的铅。
32：用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物。

Official Exemption Items
2002/95/EC, 2005/618/EC, 2005/717/EC, 2005/747/EC , 2006/310/EC, 2006/690/EC, 2006/691/EC, 2006/692/EC, 2008/385/EC
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2. Mercury in straight fluorescent lamps for general purposes not exceeding:
Halo phosphate 10 mg
Triphosphate with normal lifetime 5 mg
Triphosphate with long lifetime 8 mg
3. Mercury in straight fluorescent lamps for special purposes
4. Mercury in other lamps not specifically mentioned in this Annex
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
6. Lead as an alloying element in steel containing up to 0,35% lead by weight, aluminum containing up to 0,4 % lead by weight and as a copper alloy containing up to 4% lead by weight
7. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications
lead in electronic ceramic parts (e.g. piezoelectronic devices)
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators
9a. --
9b. Lead in lead-bronze bearing shells and bushes
10. --
11. Lead used in compliant pin connector systems
12. Lead as a coating material for the thermal conduction module c-ring
13. Lead and cadmium in optical and filter glass
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
16. Lead in linear incandescent lamps with silicate coated tubes

17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications

18. Lead as activator in the fluorescent powder (1％ lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specialty lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr, Ba)2MgSi2O7:Pb)

19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Savings Lamps (ESL)

20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)

21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.

23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.

24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.

26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

28. Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007.

29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of Council Directive 69/493/EEC.

30. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.

31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal
displays, design or industrial lighting).

32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.