ID2016电动车mos驱动芯片-三相直流风机驱动芯片-骊微电子 .pdf

ID2016 Chipown 200V 3-Phase Gate Driver IC General description The ID2016 is a gate driver IC designed for three phase brushless DC motor driver applications. It is capable of driving three half bridges consisting of six N-channel power MOSFETs. iDrivers high-voltage process and common-mode noise canceling technique provide stable operation of high-side drivers under high dv/dt noise circumstances. Internal protection features include dead-time for over-shoot prevention, and VCC, VBS under voltage lockout. Application BLDC Motor ControlsPower toolsE-bikesServo ControlsFeatures Fully operational to 200 V3.3 V and 5 V input logic compatibleVCC voltage range from 5 V to 20 VBuilt-in UVLO protections for all channelsBuilt-in shoot-through prevention circuit for allchannels with 200 ns typical dead timeTypical 1 A/1 A sinking / sourcing output currentTypically -7 V negative Vs bias capabilityPackage/Order Information HIN1HIN2LIN1LIN2LIN3COMLO2ID201620VB1HO1VS1HO2VS2VB3VS3LO119181716151413121110987654321HIN3VCCHO3VB2LO3Order code Package ID2016SDC-R1 TSSOP20 Typical Circuit ID2016CBSHO1,2,3VB1,2,3VS1,2,3LO1,2,3VCCCOMHIN1,2,3LIN1,2,315VMCUUVWUp to 100VDC深圳市骊微电子科技有限公司w w w .s z l w t e ch .co m芯朋微（安趋）代理商ID2016 Chipown Function Timing Diagram HINX/LINXHOX /LOX tR10%90%50%PWIN50%PWOUTtOFFtONtF90%10%50%50%Fig.1 Switching Time Waveform Definitions HINXLINXHOXDTDTLOX90%10%90%10%Fig.2 Dead time Waveform Definitions HIN1,2,3LIN1,2,3HO1,2,3LO1,2,310%10%90%90%MT_tONMT_tOFFFig.3 Matching time Waveform Definitions 深圳市骊微电子科技有限公司w w w .s z l w t e ch .co m芯朋微（安趋）代理商ID2016 Chipown Package Information TSSOP20 Package Outlines and Dimensions 1101120PIN1DEE1ebD1AA1A2A3cLA3A1Size Symbol Min. （mm） Max. （mm） Size Symbol Min. （mm） Max. （mm） A - 1.20 E 6.20 6.60 A1 0.05 0.15 E1 4.30 4.50 A2 0.80 1.05 e 0.65(BSC) b 0.19 0.30 L 0.45 0.75 c 0.14 0.16 0 8 D 6.40 6.60 Top mark Package iDR. ID2016 YWWXXXXX TSSOP20 Note：Y：Year Code；WW：Week Code；XXXXX：Internal Code Notes: 1. This drawing is subjected to change without notice.2. Body dimensions do not include mold flash or protrusion.深圳市骊微电子科技有限公司w w w .s z l w t e ch .co m芯朋微（安趋）代理商ID2016 Chipown TSSOP20 Package PCB Footprint CEXYTSSOP20 PCB Land Pattern Dimensions Symbol Dimension Min Max c 5.50 5.60 E 0.65(BSC) X 1.55 1.60 Y 0.25 0.30 深圳市骊微电子科技有限公司w w w .s z l w t e ch .co m芯朋微（安趋）代理商ID2016 Chipown Important NoticeWuxi Chipown Microelectronics Co. Ltd. reserves the right to make changes without further notice to any products or specifications herein. Wuxi Chipown Microelectronics Co. Ltd. does not assume any responsibility for use of any its products for any particular purpose, nor does Wuxi Chipown Microelectronics Co. Ltd assume any liability arising out of the application or use of any its products or circuits. Wuxi Chipown Microelectronics Co. Ltd does not convey any license under its patent rights or other rights nor the rights of others. 深圳市骊微电子科技有限公司w w w .s z l w t e ch .co m芯朋微（安趋）代理商