宏茂微电子(上海)有限公司.pdf

宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：1 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.1.0 PURPOSE 目的目的 Define the standard operating procedure of epoxy die bonding,which to be followed by operators.制定银胶上片工程标准作业程序，以供作业人员之依循。2.0 SCOPE 范围范围 Operators of D/A station.上片站作业员。3.0 RESPONSIBILITY 权责权责 Operation MFG Operator 作业执行 制造作业者 M/C maintenance EE 机台维护 设备工程师 Process defining Process.Eng.制定作业 制程工程师 4.0 DIFINITION 名词定义名词定义 NA 5.0 REFERENCE 参考资料参考资料 5.1 RELATION SPEC 关联文件 5.1.1 MAAPCS-0010 PROCESS CONTROL PROCEDURE FOR ASSEMBLY 封装制程管制程序书 5.2 REFERENCE DOCUMENT 参考文件 5.2.1 QABPCS-0005 Environment Control Procedure 生产环境管制程序书 5.2.2 MEAWCS-0010 Epoxy Management and Thawing Working Instruction 银胶管理及回温作业指导书 5.2.3 QBASCS-0002 2nd Optical Inspection Criteria 二目视检查规格 5.2.4 QAAWCS-0003 Process Deviation Management Working Instruction For Assembly 宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：2 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.封装制程异常作业指导书 5.3 RELATION FORM 关联窗体 5.3.1 MEARCS-0004 D/B optical inspection record.D/B 目视检查记录表 5.3.2 MEARCS-0005 Epoxy die bonder parameter check table.Epoxy 上片机参数点检表 5.3.3 MEARCS-0012 Hitachi DB-500 die bonder parameter check table Hitachi DB-500 上片机参数点检表 5.4 REFERENCE FORM 参考窗体 5.4.1 MEARCS-0011 L/F usage control sheet.L/F 用量管制表 5.4.2 MEARCS-0002 Epoxy usage control sheet.银胶使用记录表 6.0 SECURITY/SAFETY 安全性安全性 NA 7.0 CONTENT 作业内容作业内容 7.1 Lead Frame Die Attach operation 导线架上片作业 7.1.1 Equipment 设备 1.ESEC DIE BONDER 2007 2.HITACHI DB-500 3.HITACHI DB-530A 7.1.2 Tool 装置及治工具 1.Microscope 实体显微镜 (850X)with a 4W lamp;inspecting table;material frame for semi-finished products.(850X)附 4W 日光灯；检视桌；半制品材料架。2.Cabinet 储存柜 宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：3 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.Filled with N2 air,flow rate:5l/min at least.使用氮气，流量 5l/min 以上。3.Tweezers 镊子。4.Adjusting pen 调笔。5.Finger cots,ductless gloves,E.S.D.prevention equipment 指套、无尘手套、静电防护装备。6.Magazines and carry trays.盒子及携盘。7.Carve pen.刻笔。8.Vacuum pen.真空吸笔 9.Teeth mirror.牙镜 7.1.3 Material 材料 1.Lead Frame 导线架（L/F）Requested by customers or by type of device.由客户指定使用各机种所需求之规格的导线架。2.Silver paste(epoxy)银胶 ALBEBOND 8355F,8325,8360,Hitachi 4065D,CRM-1076A or other specific request by customers.ALBEBOND 8355F、8325、8360、Hitachi 4065D、CRM-1076A 或其它由客户指定使用。3.Sawed wafer after 2ND optical inspection.二目视检查作业完切割好的晶圆。7.1.4 Preparation(at shift-change)作业前准备工作 1.In operation,must put on finger cots(All fingers but little fingers),and anti-static equipment that passed the test of E.S.D.(Reference“Environment control procedure”QABPCS-0005).If finger cot is polluted by other material,operators need to change finger cots immediately.作业时，须配戴指套（左、右手各四指，小指不戴），并穿戴静电防护装备，且通过 E.S.D 测试。（参照“生产环境管制程序书”QABPCS-0005）。若手指套有沾染任何污染材料，必须立即更换新的手指套。2.Prepare the following material according to the travel card:(A)Bonding diagram(B)Lead frames(C)Epoxy 依流程卡准备：（A）配线图（B）导线架（C）银胶。宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：4 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.3.Usage of L/F L/F 使用作业程序 Operator fills out L/F Usage Control Sheet(MFARCS-0018)according to the run card handler required L/F,quantity submit the control table to D/B material handler.The D/B material handler keeps the L/F in the temporary storage area,and put the required L/F quantity on the L/next to the machine.L/F kept in the temporary area is forbidden to be open.Before using L/F,operator just can take out L/F from package and check four edge sides is there any defect for each bundle.If there are remaining L/F,pack that L/F by original package and put them into N2 cabinet.作业者根据流程卡填写“L/F 用量管制表”（MFARCS-0018）以准备所需之导线架，并将此表交给收发料人员，收发料人员领出 L/F 后放置于 L/F 暂存区内及各机台所需之数量放在各机台旁的材料架上，暂存区内 L/F 严禁开封，于使用前才能将导线架拆封并以目视检查每把 L/F 之四边是否有变形，若未使用完之导线架则使用原包装包好放置氮气柜内。4.Usage and management of epoxy refer to“Epoxy Management and Thawing Working Instruction”(MEAWCS-0010)银胶使用及回温请参阅“银胶管理及回温作业指导书”（MEAWCS-0010）。5.Start M/C and verify corresponding parameters,then check if the bonding diagram,run card and materials are consistent with each other.请设备工程人员开机确认机台各项条件，并核对配线图与流程卡及材料。6.Check the following items 配线图与流程卡材料核对，核对项目 (1)Package type.IC 包装外型。(2)Pin count.IC 脚数。(3)Device no.成品机种。(4)Type no.芯片机种（配合割片单核对）。(5)Metal alias no.and orientation.晶圆光罩号码及其方向。(6)Part No.of L/F and material.导线架料号和材质。(7)Die pad size 芯片座尺寸（需与实体图核对）。(8)Code of special L/F,check the specification of package of L/F 特殊 L/F 代码，核对包装纸的规格。(9)Epoxy type.银胶型号。(10)Rubber tip/size.吸头型号尺寸 (11)Nozzle pattern/size.顶针型式尺寸 宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：5 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.(12)If any one of the above items are not match,stop machine operating and notify the leader immediately and record all items on the“D/B optical inspection record“(MEARCS-0004),and ask leader to sign after checking.以上若有任何一项不符，需立即停机反应当班干部，记录在“D/B 目视检查记录表”（MEARCS-0004），并请干部确认签名。7.If all the items as above are correct,adjust M/C parameters to process 35 strips Stop the M/C and sample 1 strip for the following items check：以上数据检验无误后，待设备工程人员调机完成产生 35 枚半制品后，停机抽取一枚确认下列项目：(1)L/F guide-hole.L/F 圆孔端。(2)Metal alias no.and orientation.光罩号码位置方向。(3)Bonding pad lay out.电极排列形状。(4)L/F lead lay out.导脚排列数量。(5)Die position.芯片位置。(6)Epoxy amount and position.银胶量和银胶位置。(7)Epoxy coverage under chip 银胶覆盖面积。For window flag production,at least 66%epoxy coverage under die area.(Take one strip to X-RAY verification and attach one photo)针对开槽芯片底下区域至少 66%以上银胶覆盖。（X-RAY 确认一条并附照片一张）For conventional flag At least 90%epoxy coverage under die area.(Take one strip to X-RAY verification and attach one photo)针对非开槽芯片底下区域至少 90%以上银胶覆盖。（X-RAY 确认一条并附照片一张）(8)Pin Mark.晶背顶针痕及残胶。(9)Others(refer to section 7.6:Items to be checked during operation).If theres no problem,starting for operation.其它（参考项目 7.6：作业中需点检之项目），上述确认动作皆无问题，则正式生产。8.Clean machine index before operation 作业前必须清洁机台轨道。7.1.5 Operation 作业 宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：6 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.B 版 1.Must work according to condition card requirement if the condition card is valid.如有条件卡则必须依照条件卡指示作业.2.Check the lot status before mapping operation.(For mapping product)依地图作业前，必须确认该批材料之传输状况。针对地图作业材料 STEP1 步骤 1 Computer power on.将计算机的电源打开。STEP2 步骤 2 Select 8(Auto production)on MAIN MENU.在主画面中选择第 8 项（自动作业）。STEP3 步骤 3 Key in the customer lot no.键入客户批号。STEP4 步骤 4 Check lot status include wafer ID and BARCODE is transfer OK.If displays another messages,inform the leader.确认该批材料传输上是否 OK，若出现其它讯息反应你的干部。STEP5 步骤 5 Sign the operator NO.on lot statistic report.在针测单上（右上角处）记录作业者工号。3.Wafers for mapping production,OP has to check first two rows of every wafer.If units of the wafer are picked up correctly with its map,then OP has to mark a V on the up of tape and goes on production.针对地图作业晶圆，作业员必须确认每一片晶圆的前两排。如果每一芯片均对照地图被正确的吸取，作业员则须在胶膜上方打“?”，然后继续生产。4.Check sample 抽检枚数 1 strip of each L/F cassette(must be first 5 strips).Notes the record on the“D/B Optical Inspection Record”(MEARCS-0004).Take the first strip for each magazine and mark an on the right-down corner of L/F,if any defect is found,as well as record on the“D/B optical inspection record”(MEARCS-0004).每一盒抽检一枚（须为前五枚）。记录抽检结果于“D/B 目视检查记录”（MEARCS-0004）内；抽每盒上片完的第一枚并依抽出的方向在 L/F 之右下角以钻石笔划上“”记号，抽检中检查判定，若不良，记录于“D/B 目视检查记录”（MEARCS-0004）内。5.If any defect is found in sampling,stop working immediately and trace the previous materials until 5 or 20 strips no failure is found continuously.If its major failure that 20 strips are need,the others 5 strips are need.(Refer to section 7.8).After adjustment of machine,OP must confirm 2 strips first,and then sample 2 strips each magazine till the 宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：7 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.end of this lot and no defect is found again.Record the material trace result on the“D/B Optical Inspection Record”(MEARCS-0004).抽检中若发现不良，应立即停机（参考第 7.8 项上片异常停机标准），致命缺点并追溯至 20 条连续无缺点，其它缺点追溯至 5 条连续无缺点。设备人员调机完后须先连续抽 2 枚确认，并每盒抽检增加至 2 枚，待此批完后，未再发现不良为止。并将材料追塑结果记录在“D/B 目视检查记录”（MEARCS-0004）内。6.For disposal of abnormality,see“PROCESS DEVIATION MANAGEMENT WORKING INSTRUCTION FOR ASSEMBLY FAB”(QAAWCS-0003).异常反应，参照“封装厂制程异常作业指导书”（QAAWCS-0003）。7.Write down the die-bonded quantity of each wafer on the probing test record produced by PC.作业中将每枚 Wafer 上片数量记录于生管所打印之针测记录上。8.If machine fails to search target/reference die,operators need to certify target/reference die by manual according to wafer target/reference drawing.假如机器在辨识晶圆目标参考点失败，则由操作员依晶圆目标参考图做手动确认。9.When D/A is finished if each wafer check the pickup quantity and if theres any good die missed pick-up taking the wafer out.Ask the EE to adjust the machine over 5 pcs.Otherwise re-pick up by semi-auto mode or manual mode.每片晶圆上片完后，取出扩张器前，核对数量并以目视检查是否漏失良品晶粒在贴布上，如有 5 颗以上反应设备人员调整，5 颗以内便以半自动操作上片或手动上片。10.For L/F cassette D/A finished products,cover only one side first,then slide L/F out for about one lattice(die pad)and stop with hand to check if theres any L/F overlaps on another or in wrong direction.每盒装完上片后半制品的材料盒，加盖前必须先只盖一边盒盖，然后以手掌档住 L/F 慢慢倒出一个间格（芯片座）的长度，目视检查是否有双层 L/F 或 L/F 放反的情形。11.Epoxy work life 银胶寿命 Refer“Epoxy management and thawing working instruction”(MEAWCS-0010).参考“银胶管理及回温作业指导书”（MEAWCS-0010）。12.L/F after die bonding must be put into over to cure within 5 hrs.上完片的导线架须在 5 小时内放入烤箱烘烤。13.The operating time from wafer mount to die attach(move out)must be less than 48 hours(For BIN 1 only)从 W/M 到 D/A 完成的作业时间必须小于 48 小时（只针对 BIN1 产品）宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：8 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.7.1.6 Self-inspection item 作业中点检事项 1.Amount of epoxy 银胶量 (1)Window flag 开槽导线架 The epoxy wetting at least 50%around the chip,periphery the over flowing height of epoxy should not exceed 3/4 of the chip thickness.The backside overflowing in slot periphery should be allowed in principle.If there is overflowing observed after adjustment which should check the overflowing whether in acceptable range or not,if not need to repair.银胶溢胶至少 50%以上芯片四面溢胶，溢胶溢出高度不可超过芯片厚度 3/4，背面开窗以不溢胶为原则，若经调整后仍有溢出，应检查溢出，符合可接受的范围，如超出规格需 Repair 后才可下线。(2)Conventional flag 非开槽导线架 At least 75%,around all 4 side of chip,height of overflow of epoxy should not exceed 3/4 of the thickness of chip.银胶量至少 75%以上四面溢胶，银胶高度不可超过芯片厚度 3/4。2.Epoxy should not be on the L/F other than the die pad.导线架除粘晶粒区外，不可有银胶附着。3.Die bonding position 上片位置 Follows the bonding diagram(X、Y deviation within4 mil,deviation within4).上片位置依照配线图为基准（X、Y 上下偏移量不可超过 4 mil，角4）。4.Deformation of L/F L/F 变形 Stop the machine immediately any deformation occurred.If it is caused the by the machine,ask the EE to fix.If its the original defects of L/F,report immediately.导线架上翘或下陷及内挤，经发现立即停机。若机台造成，请设备人员维修；若为原厂，反应并开立异常报告。5.Any L/F if it has incomplete silver coating,no silver coating,tarnished leads observed inform operation guide to issue E.D.R.and take action with QE.导脚镀银不良：制造商在制造过程中发生镀银偏移、未镀银、导脚变黄，若发现，反应并开立异常报告与 QE 现场追查。6.Epoxy on chip.芯片沾胶。7.Chip crack.芯片破裂。8.Damage on chip.芯片压伤。宏茂微电子(上海)有限公司 ChipMOS TECHNOLOGIES(Shanghai)LTD.资料名称 TITLE：EPOXY DIE BONDING WORKING INSTRUCTION 银胶上片工程作业指导书 页数 PAGE：9 OF 17 资料号码 SPEC NO MEAWCS-0002 版本 REV.B 本文件为宏茂微电子(上海)有限公司专有之财产，非由书面许可，不准透露或使用本文件，亦不准复制或转变成任何其它 形 式 使 用 THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF ChipMOS TECHNOLOGIES(Shanghai)LTD.AND SHALL NOT BE DISTRIBUTED,REPRODUCED,OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION OF ChipMOS TECHNOLOGIES(Shanghai)LTD.9.Scratch on chip.芯片刮伤。10.Foreign particles on chip.芯片上异物。11.Wrong pick up ink die.误吸红点晶粒。12.For criteria of chip crack,damage on chip,scratch on chip,or foreign particles on chip,refer to the“2nd optical inspection criteria”(QBASCS-0002)for judgment.芯片破裂、芯片压伤、芯片刮伤、芯片上异物之判定根据“二目视检查规格”（QBASCS-0002）作判定。13.Epoxy on the back of die pad.芯片座背面沾胶。14.Micro crack.隐形崩裂。7.1.7 Criteria to suspend wor 上片异常停机标准 1.Major failure.致命缺点 (1)Inspector responses to the leader and notes the EE to deal with the problem.Sample 2 strips of L/F each magazine for two magazines,after adjustment.If no more problem keep operation.由现场抽检员反应干部，并通知设备工程师调整，调整后经现场抽检员或干部连续抽取（2 盒各 2 枚）确认合格后方可继续作业。(2)The leader issue an E.D.R.to EE or other corresponding stations)according to the cri