目视检验规范.pptx

目視檢驗規范IPC610IPQC RUI_LI2010/1/20目視檢驗規范標准IPC6101.允收標准2.拒收標准 零件本體僅下方有二接觸點的零件(Chip Components/Bottom Only Terminations cont.)偏移(Shift)允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.No side overhang.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件 本體寬邊(C)有75%以上焊接於 錫墊上.零件本體與電路板錫墊間(G)錫 厚至少0.2 mm.Side overhang(A)is allowed if minimum end joint width(C)requirements are met.Minimum is 75%.Minimum thickness(G)is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance.拒收(Nonconforming Defect)零件往錫墊寬邊(A)偏移,且零 件本體小於75%寬邊(C)焊接 於錫墊上.零件往錫墊長邊(B)偏移.Side overhang(A)is allowed if minimum end joint width(C)requirements are met.Minimum is 75%.Minimum thickness(G)is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance.零件本體有1,3,5面矩形金屬焊接點 (Rectangular End Components-1,3or5 side Termination)偏移(Shift)允收(Target Condition)零件金屬部份黏焊於錫墊中 心位置,沒有任何偏移.零件 本體錫墊完全沾錫.No side overhang.Side joint length(D)equals component termination length.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但 零件本體金屬焊墊寬邊(W)75%以上焊接於電路板錫墊上.End joint width(C)is 75%width of component termination area(W)or 75%width of PB land(P),whichever is less.拒收(Nonconforming Defect)零件往錫墊寬邊(A)偏移,但零 件本體不足75%寬邊(C)以上焊 接於電路板錫墊上.零件往錫墊長邊偏移(B).Side overhang(A)causes minimum end joint width(C)requirements not to be met.End overhang(B)is not permitted.零件本體有1,3,5面矩形接觸點(Rectangular End Components-1,3or5 side Termination)偏移(Shift)允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.零件本體錫 墊完全沾錫.No side overhang.允收極限(Acceptable)零件往錫墊寬邊偏移,但零件 之焊接面佔75%以上.End joint width is 75%width of component termination area or 75%width of PB land,whichever is less.拒收(Nonconforming Defect)零件往錫墊長邊偏移.End overhang is not permitted.圓柱體零件(Cylindrical End Cap Termination)偏移(Shift)允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.吃錫面在圓筒零件直徑(W)與板上錫墊長(P)之間.No side overhang.End joint width is equal to or greater than the component width(W)or width of the land(P),whichever is less.允收極限(Acceptable)零件往錫墊寬邊偏移(A),側 邊偏移度允收極限為零件直 徑(W)的25%或錫墊長度(P)的25%.Side overhang(A)is 25%diameter of component width (W)or land with(P).拒收(Nonconforming Defect)零件側邊偏移度(A)超出25%零 件直徑(W)或錫墊長度(P)的25%.零件往錫墊長邊偏移(B).Side overhang(A)is 25%diameter of component width(W)or land with(P).End overhang is not permitted.無導腳零件(Leadless Chip Carriers with Castellated Terminations)偏移(Shift)允收(Target Condition)零件未偏移.零件延伸引腳長等於電路板 上錫墊長.零件立於電路板上錫墊中心.No side overhang.Fillet extension equals land width.Fillet height covers terminal.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移度小於電路板上錫墊面 (W)的25%.Maximum side overhang(A)is 25%W.拒收(Nonconforming Defect)零件偏移向錫墊寬邊之間(A),偏 移度大於電路板上錫墊面(W)的 25%.零件偏移向錫墊長邊之間 (B).Maximum side overhang(A)is 25%W.End overhang(B)is not permitted.允收(Target Condition)零件腳未偏移.No side overhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移小於電路板上錫墊寬度 (W)的 25%或偏移小於0.5mm.Side overhang(A)is 25%W or 0.5 mm.拒收(Nonconforming Defect)零件偏移向錫墊寬邊之間(A),偏移大於電路板上錫墊寬度(W)的 25%或偏移大於0.5mm.不允許任何的零件趾端偏移 如(B).Side overhang(A)is greater than 25%W or 0.5 mm whichever is less.Toe overhang(B)is not specified 平緞腳(L型)/鷗翼腳/圓柱L腳(Flat Ribbon L/Gull Wing leads/Round leads)偏移(Shift)I 腳(“I”Leads)偏移(Shift)允收(Target Condition)零件腳未偏移.No side overhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移大於錫腳寬度(W)的25%仍不允許.不允許任何的偏移.Overhang(A)exceeds 25%lead width(W).No overhang allowed.拒收(Nonconforming Defect)不允許任何的零件趾端偏移 如(B).Toe overhang(B)is not specified.範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳 (Flat Ribbon L/Gull Wing leads/Round leads)允收(Target Condition)允收極限(Acceptable)拒收(Nonconforming Defect)範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳 (Flat Ribbon L/Gull Wing leads/Round leads)拒收(Nonconforming Defect)拒收(Nonconforming Defect)拒收(Nonconforming Defect)範例(Example)-J 腳/I 腳 允收極限(Acceptable)拒收(Nonconforming Defect)拒收(Nonconforming Defect)範例(Example)拒收(Nonconforming Defect)高翹/LIFTED 範例(Example)高翹/LIFTEDOKNG範例(Example)拒收(Nonconforming Defect)折腳/BENT 缺件/MISSING 偏移 /SHIFT 範例(Example)拒收(Nonconforming Defect)破損/DAMAGE 範例(Example)拒收(Nonconforming Defect)撞件/BROKEN 撞件/BROKEN 範例(Example)允收極限(Acceptable)偏移 /SHIFT 錫洞/Solder Hole 範例(Example)ASR1:LED2 反向 /REVERSE 拒收(Nonconforming Defect)缺口端為負極/Nick side is“”5168:SW4 反向 /REVERSE Switch數字與PCBA同向/Number on component same direction with PCBA.範例(Example)折腳 /PIN BENT 包焊 /Poor Solder拒收(Nonconforming Defect)範例(Example)拒收(Nonconforming Defect)NG OK 退PIN Travis M/B DIP component cosmetic 1,整体高翘，且最大不可以超过0.3mm2.后邊、前邊緣高翹不可超過0.2mm 整體高翹單邊高翹Travis M/B DIP component cosmetic 1.1.水平高翘，最大允许限度为水平高翘，最大允许限度为0.3mm.0.3mm.2.2.不允许不允许單單边高翘。边高翘。Travis base sampleRAM RAM 的卡勾不可出现变形等不良。的卡勾不可出现变形等不良。Travis M/B DIP component cosmetic 不能出现任何标记,特别是有铅异物。不能出现任何标记,特别是有铅异物。Travis M/B DIP component cosmetic JUSB 不可出现气泡和明不可出现气泡和明显擦痕显擦痕.Travis base sampleMicrophone 不能失掉海绵，禁止使用双面胶黏贴脱落海绵。Travis M/B solder hole JDOCK 不允許單邊高翹 Travis base sample1.Function Pin 吃锡量不应少于75%.2.固定pin锡量不应少于50%.（以固定住零件为标准）3.折脚 （1）:如果pin 折脚但是有露出，function 測試pass 可以判断为良品。(2)如果pin脚完全没有露出，则要判断为不良。固定固定pinFunction pin Travis base samplepin 脚不可刺穿该处Mylar Travis base sampleSmart card socket Smart card socket 不可出现大幅度凹陷变形。不可出现大幅度凹陷变形。Travis base sampleJSIO,JCRT 等零件不可出现沾锡等不良,PBATT late solder can be accept。THE END