IBIS模型语法.doc

Appendix A:IBIS Model Syntax6/2/24Roy LeventhalReference IBIS 3.2ContentsTable 1: General Rules9Format9File Names9Reserved Words9POWER9GND9NC9NA9Line Length9Comments9Keywords9Allowed Scaling Factor Prefixes9Tab characters9Temperature9Currents9Table 2: General Properties10IBIS Ver10Comment Char10File Name10File Rev10Date10Source10Notes10Copyright10Disclaimer10Table 3: Component Properties12Component12Si_location12Timing_location12Manufacturer12Voltage Range12Temperature Range12END12Table 4: Package and Pin Properties13Package13R_pkg13L_pkg13C_pkg13Pin13signal_name13model_name13R_pin13L_pin13C_pin13Package Model15Define Package Model15Manufacturer19OEM19Description19Number of Pins19Pin Numbers19Len19L, R, C.19Fork19Endfork19Number Of Sections22Model Data22Resistance Matrix23Inductance Matrix23Banded_matrix23Sparse_matrix23Full_matrix23Capacitance Matrix27Row27Bandwidth27End Model Data27Pin Mapping28pulldown_ref:28pullup_ref:28gnd_clamp_ref:28power_clamp_ref:28Rac30Cac30Rgnd30Rpower30Diff Pin30inv_pin:30vdiff:30tdelay_typ:30tdelay_min:30Tdelay_max:30Series Pin Mapping33pin_2:33model_name:33funtion_table_group:33Series Switch Groups33On, Off33End Package Model33Table 5: V-I Behavioral Properties36Model36Model_type36C_comp: Note 1*.36Polarity36Enable36Vinl36Vinh36On39Off39R Series39L Series39C Series39Rl Series39Rc Series39Lc Series39Series Current39Series MOSFET39Vds39Vol, Voh44Technology44Pulldown44Pullup44GND Clamp44POWER Clamp44Pullup Reference48Pulldown Reference48GND Clamp Reference48POWER Clamp Reference48Model Selector49Model Spec51Vinh51Vinh+51Vinh-51Vinl+51Vinl-51S_overshoot_high51S_overshoot_low51D_overshoot_high51D_overshoot_low51D_overshoot_time51Pulse_high51Pulse_low51Pulse_time51Vmeas51Add Submodel54submodel_name54mode54Submodel54Submodel_type54Submodel Spec54V_trigger_r54V_trigger_f54Off_delay54GND Pulse Table59POWER Pulse Table59TTgnd59TTpower59Table 6: V-T Behavioral Properties63Ramp63dV/dt_r63dV/dt_f63R_load63Vmeas63Cref63Rref63Vref63Rising Waveform &63Falling Waveform63R_fixture63C_fixture63L_fixture63V_fixture63V_fixture_min63V_fixture_max63R_dut63C_dut63L_dut63Driver Schedule67Rise_on_dly67Rise_off_dly67Fall_on_dly67Fall_off_dly67Table 7: Board Properties69Begin Board Description69Manufacturer69Number of Pins69Pin List70Path Description70Len70L, R, C70Fork70Endfork70Pin70Node70Reference Designator Map75End Board Description75End75END75Acknowledgement:The text of the IBIS specification, v3.2, was used verbatim extensively to create this document.Purpose:This document was created to separate out syntax rules, file formatting and examples and make those subjects more accessible to the user. This author has added not much commentary. But, the material of the IBIS spec has been reorganized and reformatted. The IBIS spec is organized around a set of Keywords and (in some cases) their subparameters. I have reorganized those keywords into a set of 7 tables as follows: Table 1: General Rules - reserved words, ASCII characters, etc. Table 2: General Properties - boilerplate. Table 3: Component Properties - supplier, voltage and temperature ranges. Table 4: Package and Pin Properties - connections and parasitics. Table 5: V-I Behavioral Properties - driver voltage-current capabilities, clamping, power bussing, model types, etc. Table 6: V-T Behavioral Properties - slew rates and switching speeds. Table 7: Electrical Board Description - abstracting a board as a component.Most of the above tables are split apart into sections or subtables so as to bring technical notes and examples into close association with the listed keywords and examples.An industry committee created the IBIS specification over a period of years. It is still a work in progress undergoing continuing modification. As this author sees it, the specification is in need of organization and a roadmap to its information since disparate elements are mixed together and separated into unrelated sections and specific information is not easily accessible.This syntax guide is offered in the hope that it will aid the reader in understanding the IBIS specification. This guide is followed by an example of an IBIS model file used with the permission of TI semiconductor.Table 1: General RulesKeywordSyntaxRulesNotesFormatASCII, case sensitive except for reserved words and keywords. No special non-DOS characters allowed.ASCII as defined in ANSI Standard X3.4-1986File NamesAll lower case, ending in .ibs extension for model files, .pkg extension for separate package model files, and .ebd for electrical board description files. 8 characters max plus extensionReserved WordsPOWERUsed with power supply pinsGNDUsed with ground pinsNCNo-connect pinsNAUsed where data not availableLine Length80 characters maxCommentsDefault are lines that begin with “|” (pipe)KeywordsMust be enclosed with square brackets and begin in column 1Underscores and spaces are equivalent in keywords. Spaces not allowed in subparameter names.Allowed Scaling Factor PrefixesTTeraParser assumes volts, amperes, ohms, farads, henries & seconds if not specifiedGGigaMMegakKilomMilliuMicronNanopPicofFemto1.234e-12scientific notationTab charactersAllowed. But, to be avoidedTemperatureDegrees CelsiusCurrentsPositive when their direction is into the componentTable 2: General PropertiesKeywordSyntaxRulesNotesIBIS VerInforms parser of the IBIS template versionMust be first keyword. Can be preceded by comment linesExample #1Comment CharThe new character to be defined must be followed by the underscore character and the letters char. Ex.: |_char redundantly redefines the comment character to be the pipe character. The new comment character is in effect only following the Comment Char keyword.Following characters MAY NOT be used: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z a b c d e f g h i j k l m n o p q r s t u v w x y z 0 1 2 3 4 5 6 7 8 9 . _ / = + -File NameAll lower case, ending in .ibs extension for model files, .pkg extension for separate package model files, and .ebd for electrical board description files. 8 characters max plus extensionThe file name must be the actual name of the fileExample #2File RevRevision level is set at the discretion of the engineer defining the file. The following are recommended:0.x silicon and file in development1.x pre-silicon file data from silicon model only2.x file correlated to silicon measurements3.x mature product, no more changes likelyExample #3Date40 characters maxLatest file revision dateExample #4SourceOriginator of IBIS fileOptionalNotesParagraph allowedCopyrightDisclaimer#1 IBIS VerIBIS Ver 3.2 | Used for template variations|#2 File NameFile Name ver3_2.ibs|#3 File RevFile Rev 1.0 | Used for .ibs file variations#4 Date/Source/Notes/Disclaimer/CopyrightDate January 15, 1999 | The latest file revision date|Source Put originator and the source of information here. For example: From silicon level SPICE model at Intel. From lab measurement at IEI. Compiled from manufacturers data book at Quad Design, etc.|Notes Use this section for special notes related to the file.|Disclaimer This information is for modeling purposes only and is not guaranteed. | May vary by component|Copyright Copyright 1999, XYZ Corp., All Rights Reserved|Table 3: Component PropertiesKeywordSyntaxRulesNotesComponent40 characters max. Blank characters allowed. NOTE: Blank characters not recommended due to usability issues.In multiple device files each one must begin with its own Component keywordMarks start of IBIS description. Example #5Si_locationMust be Pin or DieExample #5Timing_locationMust be Pin or DieExample #5Manufacturer40 characters max. Blank characters allowed Example #6 Voltage RangeNote 1.Provide actual voltages (not percentages) in the typ, min, max format. If the Voltage Range keyword is not present, then all four of these keywords described below must be present: Pullup Reference, Pulldown Reference, POWER Clamp Reference, and GND Clamp Reference. If the Voltage Range is present, the other keywords are optional and may or may not be used as required. It is legal (although redundant) for an optional keyword to specify the same voltage as specified by the Voltage Range keyword.Example #7Temperature RangeNote 1.List the actual die temperatures (not percentages) in the typ, min, max format. The Temperature Range keyword also describes the temperature range over which the various V/I curves and ramp rates were derived.Example #8ENDDefines the end of the .ibs file.#5 ComponentComponent 7403398 MC452|Si_location Pin | Optional subparameters to give measurementTiming_location Die | location positions |#6 ManufacturerManufacturer Quality Semiconductors Ltd.|#7 Voltage Range| variable typ min maxVoltage Range 5.0V 4.5V 5.5V|#8 Temperature Range| variable typ min maxTemperature Range 27.0 -50 130.0Table 4: Package and Pin PropertiesKeywordSyntaxRulesNotes PackageR_pkgNote 1.*Example #9L_pkgC_pkgPin5 characters max1st columnNote 2, Example #10signal_name2nd column, 20 characters maxmodel_name3rd column, 20 characters max: associates I/O Model keyword or GND, POWER, or NC below it.R_pinNote 1.L_pinC_pin(cont.)Assumed: Consistent with IBIS syntax.Note 1Typical must be specified. If data for Min & Max columns is not available that must be noted with NA. Consists of 3 columns (typ-min-max) of 9 characters max each. On each line at least one space must separate each column entry from its neighbor.#9 PackagePackage| variable typ min maxR_pkg 250.0m 225.0m 275.0mL_pkg 15.0nH 12.0nH 18.0nHC_pkg 18.0pF 15.0pF 20.0pF|Note 2Each line must have either 3 or 6 columns. If six are used they are used to override the default package parameters. If NA is used the default package parameters are still used. At least one space must separate each column.#10 PinPin signal_name model_name R_pin L_pin C_pin| 1 RAS0# Buffer1 200.0m 5.0nH 2.0pF 2 RAS1# Buffer2 209.0m NA 2.5pF 3 EN1# Input1 NA 6.3nH NA 4 A0 3-state 5 D0 I/O1 6 RD# Input2 310.0m 3.0nH 2.0pF 7 WR# Input2 8 A1 I/O2 9 D1 I/O2 10 GND GND 297.0m 6.7nH 3.4pF 11 RDY# Input2 12 GND GND 270.0m 5.3nH 4.0pF| .| .| . 18 Vcc3 POWER 19 NC NC 20 Vcc5 POWER 226.0m NA 1.0pF|Table 4 (cont.): Package and Pin PropertiesKeywordSyntaxRulesNotes Package Model40 characters max. Blank characters allowed. Inserted as keyword within Component keyword. The Package Model keyword is optional. If more than the default RLC package model is desired, use the Define Package Model keyword.The simulator will search for a matching package model name as anargument to a Define Package Model keyword in the current IBIS file first. If a match is not found, the simulator will look for a match in an external .pkg file. If the package model is in a separate .pkg file, it must be kept in the same directory as the .ibs file.Note 10, Example #11Define Package Model40 characters max. Blank characters are allowed.If the .pkg file has data for more than one package, each section must begin with a new Define Package Model. For every package model name defined under the Package Model keyword, there must be a matching Define Package ModelExample #12(cont.)Note 10Use the Package Model keyword within a Component to indicate the package model for that part. The specification permits .ibs files to contain the following additional list of package model keywords. Note that the actual package models can be in a separate .pkg file or can exist in the IBIS files between the Define Package Model.End Package Model keywords for each package model that is defined. For reference, these keywords are listed below. Full descriptions follow:Define Package Model Required if the Package Model keyword is usedManufacturer (note a)OEM (note a)Description (note a)Number of Pins (note a)Pin Numbers (note a)Model Data (note a)Resistance Matrix OptionalInductance Matrix (note a)Capacitance Matrix (note a)Bandwidth Required (for Banded_matrix matrices only)Row (note a)End Model Data (note a)End Package Model (note a)(note a) Required when the Define Package Model keyword is usedWhen package model definitions occur within a .ibs file, their scope is local - they are known only within that .ibs file and no other. In addition, within that .ibs file, they override any globally defined package models that have the same name.USAGE RULES FOR THE .PKG FILEPackage mo