SMT流程图.ppt

按一下以編輯母片標題樣式,按一下以編輯母片本文樣式,第二層,第三層,第四層,第五層,*,*,SMT,製程簡介,SMT PROCESS INTRODUCE,S.M.T.,S,urface,M,ount,T,echnology,定義：是指在恰當材質的表面上焊牢為數極多的表面粘裝電子零件,(,SMDs,),的裝配技術,.,DEFINITION:A technology for mounting electronic components(=,SMDs,)on the surface of suitable substrate.,S.M.D.,S,urface,M,ount,D,evice,SMD,定義:,亦稱為,SMC,是指能夠藉由表面粘著技術焊接在印刷電路板上之有腳或無腳電子零件,.,DEFINITION:(or surface mount component,SMC),It is a lead or leadless electronic component that is capable of being attached to a printed board by surface mounting.,SMT FLOW,領料,Receive Materials,備料,Prepare Materials,錫膏印刷,Printing solder paste,零件置放,Pick&Place,CP7X3,QP3X4,迴焊,Reflow,迴焊,Reflow,零件置放,Pick&Place,CP7X2,GSM2X2,錫膏印刷,Printing solder paste,轉版,Reverse Board,AOI Auto Optical Inspection,AOI Auto Optical Inspection,目檢,Visual Inspection,條碼管理系統,SFIS,入庫,To Enter Warehouse,出貨,Deliver Goods,AOI Auto Optical Inspection,1,OK,NG,下一程序,Next Procedure,修整,Touch Up,目檢,Visual Inspection,OK,NG,修整,Touch Up,下一程序,Next Procedure,目檢,Visual Inspection,2,SMT EQUIPMENT-I,MPM UP 3000-Stencil Printer-,印刷机,FUJI CP 643E-High-Speed Mounter-,高速置件機,(,Small Card),FUJI CP 742E/742ME-High-Speed Mounter-,高速置件機,(,Main board),FUJI QP 341E-Multi-Fun.Mounter-,泛用置件機,UNIVERSAL GSM2-Multi-Fun.Mounter-,泛用置件機,HELLER 1900EXL Reflow-,迴焊爐,ORBOTECH VT.8000X-Auto Optical Inspection For Solder Joint-,焊點自動光學檢查機,ORBOTECH Trin.2240-Auto Optical Inspection For Paste-,錫膏覆蓋自動光學檢查機,EFD 1500XL-Glue Dispenser machine,點膠機,SMT EQUIPMENT-II,HOT PLATE-Solder Ball Test -,錫球試驗儀,MALCOM VISCOMETER PCU-201-Viscosity Test-,粘度測試儀,HIROX-3D Microscope-3,D,顯微鏡,Z-CHECK-Solder Paste Thickness Measurement-,錫膏,厚度量測儀,SMT EQUIPMENT-III,DATAPAQ REFLOW TRACKER-,Reflow Temperature Curve Record-,迴焊爐溫度曲線記錄器,FUJI DT III-,2D Measurement&Feeder Calibration-,座標機,EMC 301A-Stencil Cleaner-,鋼板清洗機,領料,(,GETTING THE MATERIALS),1.,工程目的,(,ENG.PURPOSE)：,領取生產用料,Prepare the production materials.,2.,作業重點,(,OPERATION IMPORTANTS)：,2.1,實物與領料單規格相符,The materials specification must,be the same as your BOM.,2.2,數量正確,Quantity must be correct.,Solder Paste-I SQ-20-27,Non-clean Type-,免洗型,0%,Halogen content-,無鹵化物,20-36,m particle size-,錫球直徑,20-36,m,9.0%Flux content(RMA)-,助焊劑比重,9%,Solder Paste-II SQ-20-27,Incoming material Inspection-,進料檢驗,Solder ball Test-,錫球試驗,Viscosity Test -,粘度試驗,Storage-,儲存條件,010,錫膏印刷,-,I(PRINTING SOLDER PASTE),1.,工程目的,(,ENG.PURPOSE)：,均勻地印刷錫膏,Uniform depositing solder paste .,2.,作業重點,(,OPERATION IMPORTANTS)：,2.1,確認程式名稱,Confirm the correct program.,2.2,確認鋼板名稱與作業標準書相符,Confirm the stencil name by the SOP,2.3,錫膏印刷品質,The printed quality.,錫膏印刷,-,II(PRINTING SOLDER PASTE),STENCIL THICKNESS=0.13 mm-,鋼板厚度,=0.13,mm,Laser cut -,鐳射切割,STENCIL TENSION,30 N/cm-,鋼板張力,30,N/cm,SOLDER PASTE THICKNESS MEASUREMENT,X-R Chart-,錫膏厚度量測,X-R,管制圖,點膠,(,Glue),SOAKOTE IR-010,KOKI JU-21,Matsushita ADE441D-225,1.,工程目的,(,ENG.PURPOSE)：,黏著零件,To stick components,2.,作業重點,(,OPERATION IMPORTANTS),2.1,確認設備壓力,Confirm the machine pressure.,2.2,使用正確的膠水,Using the correct Glue.,2.3,點再正確的位置,Put the Glue on correct location.,1.,工程目的,(,ENG.PURPOSE)：,正確的放置零件,Place the component in the correct location.,2.,作業重點,(,OPERATION IMPORTANTS),2.1,確認程式名稱,Confirm the correct program.,2.2,使用正確的材料,Using the correct materials.,2.3,正確的置放方向性,Place corresponding polarity correctly.,零件置放,-,I(PICK/PLACE),零件置放,-,II(PICK/PLACE),Bartector System-,條碼掃瞄,Component Barcode Label-,元件條碼,Vacuum Package Component Storage-,真空包裝零件儲存,Pick&Place Misplacement Record-,置件偏移記錄,迴焊,(,REFLOW),1.,工程目的,(,ENG.PURPOSE)：,焊接熔接,Soldering,2.,作業重點,(,OPERATION IMPORTANTS)：,2.1,使用正確的程式名稱,Using the correct program,2.2,確認溫度,/,輸送設定與作業標準書相符,Confirm the same temperature&conveyor as,the SOP,2.3,溫度曲線量測,Measuring of,reflow,temperature profile,AOI(Auto Optical Inspection,1.,工程目的,(,ENG.PURPOSE)：,以影像檢查焊點及置件品質,Detect the Solder Joint and Placing Accuracy by Image.,2.,作業重點,(,OPERATION IMPORTANTS)：,2.1,使用正確的程式名稱,Using the correct program.,目檢,(,VISUAL INSPECTION),1.,工程目的,(,ENG.PURPOSE)：,目視檢驗外觀不良,Visual inspection for the unacceptable boards,2.,作業重點,(,OPERATION IMPORTANS)：,2.1PCB,及焊點外觀,PCB and Solder joint appearance,2.2,缺件,/,錯件,/,極反,/,偏移,/,立碑,Miss Parts,Wrong Parts,Opposite Direction,Shift Position,Tombstone,修整,(,TOUCH UP),1.,工程目的,(,ENG.PURPOSE)：,符合外觀工藝標準,Must be pass in the WORKMANSHIP,STANDARD,2.,作業重點,(,OPERATION IMPORTANTS)：,2.1,焊點外觀,Solder joint appearance,2.2,正確的使用烙鐵,Using the solder iron correctly,