全方位_USB Type-C Presentation(产品简介).ppt

,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,Page,*,/72,www.allbest-,All Best,USB,Type-,C,Connecto,r,2014,_ Rev.,C,内容,Type-C Basic Information,Type-C Product Introduction,Type C,Design Simulation,内容,Type-C Basic Information,Type-C Product Introduction,Type C,Design Simulation,USB Type-C,的定义,The USB Type-C,连接器提供了一个更小，更薄，功能更强大的替代方案,，相对于现有的,USB3.1,连接系统,(Standard&Micro USB cables and connectors).,这个新的解决方案将被使用于更薄的平台，从笔记本电脑到智能手机，而现有的,Standard-A and Micro-A/B,连接器会被认为体积太大，使用不方便，或功能已无法满足现有需求的情况下。,USB Type-C,连接器的设计旨在支持未来的,USB,功能的扩展,，因此，在开发这个解决方案的时候，需考虑频率扩展性能，线路的排配和配置机制。针对未来的,USB,功能扩展的定义，不在本规范的范围,但是将在未来的,USB,规范的升级版本中提供，即除了现有的,USB 3.1,规范,.,USB Type-C,目的是作为相对于现有的,USB 2.0,USB 3.1,和,USB,PD,规范的一个补充,.,USB Type-C,新接口本质上基于,USB 3.1,、,USB 2.0,标准规范，官方称,“,主要面向更轻薄、更纤细的设备，增强可用性，并为未来,USB,版本的性能增强铺好路。,其,兼容未来,USB,标准发展，最高达到,20,Gbit,每秒的传输速度。通过,USB Power Delivery,技术，可用于数码产品充电。支持,1,万次拔插。,其接口、数据线的主要性质有：,高速传输,10 Gbit20 Gbit/s,支持正反插,.,支持更,快速,的充电,3,A5A.,USB Type-C,的特性,Mini PC,智能手机,LCD TV/Monitor Panel,一体机,笔记本电脑,平板,USB Type-C,的应用,穿戴式设备,Type-C,USB,Type-C,将被广泛应用于以下产业,SSD,System side,Cable side,Dock side,Rev.,0.7,草版,发布于,2014.2.20.,最初的,USB3.0,贡献者评估草案。此版本是未被证实核准的,USB3.0,协会草案,可能会发生变化。本文档包括,USB Type-C,定义、特性、应用和初始的规范。,Rev.,0.9,草版,发布于,2014.5.31,.,第二次,USB3.0,协会审查草案，,USB Type-C,工作组成员通过取得自于,0.7,草版中的反馈信息，对,USB Type-C,规范重新整合,&,更新，升级为现有的持续更新的规范。,Rev.,0.9,8,草版,发布于,2014.7.16,.,升級了部份產品形態的,PCB layout(,參考,).,Rev.,1.0,正式版本于,2014.8.11,公布,.,USB,Type-C,规范发布时间,:,USB Type-C,的规范,Micro USB2.0,USB3.0,USB3.1,&Type-C,对比,Description,Micro B USB2.0,Micro B USB3.0,USB3.0 PD,USB3.1,Type-C,Interface,W,*,H,6.90*1.85 mm,12.25*1.85 mm,12.50*5.12 mm,12.50*5.12 mm,8.35*2.56mm,Contact Pitch,0.65,mm,0.65,mm,2.00/2.50,mm,2.00/2.50,mm,0.50mm,Pin No.,5,10,9,9,24,Transfer Speed,480M,bps,5,Gbps,5,Gbps,10,Gbps,20,Gbps,Current Rating,1.,5,A,1.,8,A,5 A,1.,8,A,3A/5,A,R,eversible,N,N,N,N,Y,Compatible,/,Micro USB2.0,USB2.0,USB2.0USB3.0,No compatible,Photo,USB,家族每一代产品规格对比,:,USB Type-C,的规范,8.35mm,2.56,mm,USB Type-C,Pin Define,Pin define,USB Type-C Full-Feature Receptacle Interface,USB Type-C Full-Feature Plug Interface,Reserved for Future Use(RFU),V,CONN,Available as an alternate power source,USB Type-C,的发展趋势,201,3,201,5,201,7,201,9,USB Type C,(,10/,20Gbps,5A),USB 3.0,(5Gbps,1.8A,),USB 2.0,(480Mbps,1.,5,A),USB 3.1(10Gbps,1.8A,),USB PD(35A),Type,未來,現在,過去,DVI,USB 2.0,Thunderbolt 1,USB 1.0,Mini DIN,IEEE 1394,E,-,SATA+,USB,VGA,Display,Port,1.2,HDMI 1.x,USB 3.1,Data I/O,影音介面,DiiVA,USB 3.0,HDMI 2.0,USB PD,產品協會介面,Roadmap,現有,未來,Mini DP,Micro,DP,Mini,USB 2.0,Micro,USB 3.0,Mini,HDMI,Micro,HDMI,STD 3.5mm,Audio Jack,Slim type,Audio Jack,1.,輕薄窄,2.Super speed,Type C,内容,Type-C Basic Information,Type-C Product Introduction,Type C,Design Simulation,Type-C Product Roadmap,Available,To be developed,Mid-Mount,Hybrid,Mid-Mount,Dual SMT,Top-Mount,Hybrid,2014Q4,2015Q1,Super speed+Power,Only Power Delivery,USB2.0+Power,Future,Water,Proof,Type,Top-Mount,Dual SMT,Patent:32 sets,Plug,Rec.,(USB2.0+PD),Rec.,(Full Feature),Mid-Mount,SMT,Top-Mount,SMT,Vertical Type,Series,Type Spec.,Photo,Profile,Receptacle,USB2.0+,Power Delivery,Mid-Mount,SMT,1.D*W*H=9.67*8.95*3.16,2.Sink Height=0.80mm,Top-Mount,SMT,1.D*W*H=9.67*8.95*3.26,USB3.1+PD,(Full feature type),Mid-Mount,Dual SMT,1.D*W*H=12.10*9.15*3.16,2.Sink Height=0.80mm,Mid-Mount,Hybrid,1.D*W*H=12.10*9.15*3.16,2.Sink Height=0.80mm,Top-Mount,Hybrid,1.D*W*H=11.80*9.18*3.28,Top-Mount,Dual SMT,1.D*W*H=11.80*9.18*3.28,Plug,Cable end,(USB2.0+Power),1.W*H=8.25*2.40,Cable end,(Full feature type),1.W*H=8.25*2.40,Cable end,(Only Power),1.W*H=8.25*2.40,USB Type-C Family List,Type 1_ Full Feature,Mid-Mount Dual row SMT Type,ALL BEST P/N,：,A141-52411-2H,Dual SMT,D,W,H,超薄,Schedule,：,Drawing date,:,Available,Sample date,:,2014/9/E,MP date:,2014/11/M,Character,：,Full Feature:24 Pin,D*W*H=12.10*9.15*3.16mm,Center Height:CH=0.68mm,Center Height,可上下浮动,0.40mm.,体长,D,可缩短至,10.70mm.(,已有短体样品,),Auto-Assembly&Steady Quality,Patent protection,CH,Type 2_ Full Feature,Mid-Mount Hybrid Type,ALL BEST P/N,：,A141-62411-2H,DIP+SMT,焊脚,D,W,H,超薄,Schedule,：,Drawing date,:,Available,Sample date,:,2014/12/E,MP date:,2015/Q1,Character,：,Full Feature:24 Pin,D*W*H=12.10*9.15*3.16mm,Center Height:CH=0.68mm,Center Height,可上下浮动,0.40mm.,体长,D,可缩短至,10.70mm.,Auto-Assembly&Steady Quality,Patent protection,CH,Type 3_ Full Feature,Top-Mount Hybrid Type,ALL BEST P/N,：,A141-82411-2H,D,W,H,DIP+SMT,焊脚,Character,：,Full Feature:24 Pin,D*W*H=11.80*9.18*3.28mm,体长,D,可缩短至,10.40mm.,Auto-Assembly&Steady Quality,Patent protection,Schedule,：,Drawing date,:,Available,Sample date,:,2014/12/M,MP date:,2015/Q1,Type 4_ Full Feature,Top-Mount Dual row SMT Type,ALL BEST P/N,：,A141-72411-2H,Dual SMT,焊脚,Character,：,Full Feature:24 Pin,D*W*H=11.80*9.18*3.28mm,体长,D,可缩短至,10.40mm,Auto-Assembly&Steady Quality,Patent protection,Schedule,：,Drawing date,:,Available,Sample date,:,2014/12/M,MP date:,2015/Q1,D,W,H,Type 5_ USB2.0+Power Delivery,Mid-Mount SMT Type,ALL BEST P/N,：,A141-51611-2H,D,W,Character,：,Pin Feature:16 Pin,D*W*H=9.67*8.95*3.16mm,Center Height:CH=0.77mm,Center Height,可上下浮动,0.40mm.,体长,D,可缩短至,8.33mm.,Auto-Assembly&Steady Quality,Patent protection,超薄,Schedule,：,Drawing date,:,Available,Sample date,:,2014/10/E,MP date:,2014/12/M,H,CH,Type 6_ USB2.0+Power Delivery,Top-Mount SMT Type,ALL BEST P/N,：,A141-71611-2H,D,W,Character,：,Full Feature:16 Pin,D*W*H=9.67*8.95*3.26mm,体长,D,可缩短至,8.33mm.,Auto-Assembly&Steady Quality,Patent protection,H,Schedule,：,Drawing date,:,Available,Sample date,:,2014/12/E,MP date:,2015/Q1,Type 7_ Cable end USB2.0+Powe Delivery,USB2.0+Power Delivery,ALL BEST P/N,：,A140-01211-1H,W,H,Character,：,Full Feature:12 Pin,W*H=8.25*2.40mm,Auto-Assembly&Steady Quality,Patent protection,Schedule,：,Drawing date,:,Available,Sample date,:,2014/9/E,MP date:,2014/11/M,配套零件,Type 8_ Cable end Full feature,Full feature,ALL BEST P/N,：,A140-02211-1H,W,H,Schedule,：,Drawing date,:,Available,Sample date,:,2014/9/E,MP date:,2014/11/M,Character,：,Full Feature:22 Pin,W*H=8.25*2.40mm,Auto-Assembly&Steady Quality,Patent protection,配套零件,Type 9_ Cable end only power delivery,Only power delivery,ALL BEST P/N,：,A140-00811-1H,W,H,Character,：,Full Feature:8 Pin,W*H=8.25*2.40mm,Auto-Assembly&Steady Quality,Patent protection,Schedule,：,Drawing date,:,Available,Sample date,:,2014/12/E,MP date:,2015/Q1,配套零件,内容,Type-C Basic Information,Type-C Product Introduction,Type C,Design Simulation,Engineering Analysis,Efficient,computerized,optimized function in the early design stage.,Product Design,Virtual Prototyping,Design Verification,Prototype,Production,Testing,Structural Analysis,Functional Simulation,Concurrent Process,Processing Simulation,Stamping Simulation,Mold flow Simulation,NF,evaluation,Insertion,/,extraction force,HFSS,Analysis,The molding condition,is set as,:,Material,:LCP E6808LHF,Melt Temp,:350,Mold Temp,:100,Flow rate,:20cm,3,/s,Packing time:,0.3s,Packing pressure:80%of max.injection pressure,The mold flow meshes are shown as below:,1.Receptacle Upper I/M model and molding conditions,439987,elements,Gate,2,0%,4,0%,6,0%,8,0%,95,%,The max.injection pressure i,s,17.07MPa,so it is acceptable.,1.1.Filling analysis,Max.pressure:17.07MPa,Warpage in,X,-dir.,Key message:,The Max.warpage in X-direction is 0.002mm,The,M,ax.warpage in Y-direction is 0.0,14,mm,.,The,M,ax.warpage in,Z,-direction is 0.0,04,mm,.,The warpage risk is low.,1.2.Warpage analysis,Warpage in,Z,-dir.,Unit:mm,0.002,0.002,Warpage in,Y,-dir.,0.014,0.001,0.004,Air traps,Weld lines,Volumetric shrinkage,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there.,1.3.Sink mark analysis,1.4.Conclusions,The max.injection pressure i,s,17.07MPa,so it is acceptable,.,The max.warpage in X-direction is 0.002mm,The max.warpage in Y-direction is,0.014mm.,The max.warpage in,Z,-direction is,0.004mm,The warpage risk is low,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there,.,Warpage in,Z,-dir.,0.001,0.004,Max.pressure:17.07MPa,The molding condition,is set as,:,Material,:LCP E6808LHF,Melt Temp,:350,Mold Temp,:100,Flow rate,:20cm,3,/s,Packing time:,0.3s,Packing pressure:80%of max.injection pressure,The mold flow meshes are shown as below:,241717,elements,Gate,2.Receptacle Middle I/M model and molding conditions,2,0%,4,0%,6,0%,8,0%,95,%,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,51.3MPa,so it is acceptable.,2.1.Filling analysis,Max.pressure:51.3MPa,Warpage in,X,-dir.,Key message:,The Max.warpage in X-direction is 0.005mm,The,M,ax.warpage in Y-direction is 0.0,02,mm,.,The,M,ax.warpage in,Z,-direction is 0.0,01,mm,.,The warpage risk is low.,2.2.Warpage analysis,0.005,0.002,0.002,Warpage in Y-dir.,Warpage in,Z,-dir.,Unit:mm,0.001,Air traps,Weld lines,Volumetric shrinkage,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there.,2.3.Sink mark analysis,2.4.Conclusions,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,51.3MPa,so it is acceptable,.,The max.warpage in X-direction is 0.005mm,The max.warpage in Y-direction is,0.002mm.,The max.warpage in,Z,-direction is,0.001mm,The warpage risk is low,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there,.,Max.pressure:51.3MPa,0.002,0.002,Warpage in Y-dir.,The molding condition,is set as,:,The mold flow meshes are shown as below:,3.Receptacle Lower I/M model and molding conditions,375299,elements,Gate,Material,:LCP E6808LHF,Melt Temp,:350,Mold Temp,:100,Flow rate,:20cm,3,/s,Packing time:,0.3s,Packing pressure:80%of max.injection pressure,2,0%,4,0%,6,0%,8,0%,95,%,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,29.25MPa,so it is acceptable.,3.1.Filling analysis,Max.pressure:29.25MPa,Warpage in,X,-dir.,Key message:,The Max.warpage in X-direction is 0.004mm,The,M,ax.warpage in Y-direction is 0.0,06,mm,.,The,M,ax.warpage in,Z,-direction is 0.0,02,mm,.,The warpage risk is low.,3.2.Warpage analysis,0.004,0.003,Warpage in Y-dir.,Warpage in,Z,-dir.,Unit:mm,0.006,0.002,0.002,3.3.Sink mark analysis,Air traps,Weld lines,Volumetric shrinkage,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there.,3.4.Conclusions,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,29.25MPa,so it is acceptable,.,The max.warpage in X-direction is 0.004mm,The max.warpage in Y-direction is,0.006mm.,The max.warpage in,Z,-direction is,0.002mm,The warpage risk is low,The volumetric shrinkage in the thickest wall is over 5%may result in sink marks.,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there,.,Max.pressure:29.25MPa,Warpage in,X,-dir.,0.004,0.003,The molding condition,is set as,:,Material,:LCP E6808LHF,Melt Temp,:350,Mold Temp,:100,Flow rate,:20cm,3,/s,Packing time:,0.3s,Packing pressure:80%of max.injection pressure,The mold flow meshes are shown as below:,4.Plug HSG,model and molding conditions,337895,elements,Gate,2,0%,4,0%,6,0%,8,0%,95,%,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,23.89MPa,so it is acceptable.,4.1.Filling analysis,Max.pressure:23.89MPa,Warpage in,X,-dir.,Key message:,The Max.warpage in X-direction is 0.002mm,The,M,ax.warpage in Y-direction is 0.0,1,mm,.,The,M,ax.warpage in,Z,-direction is 0.0,05,mm,.,The warpage risk is low.,4.2.Warpage analysis,Warpage in Y-dir.,Warpage in,Z,-dir.,Unit:mm,0.002,0.002,0.01,0.01,0.005,Air traps,Weld lines,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there.,4.3.Sink mark analysis,4.4.Conclusions,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,23.89MPa,so it is acceptable,.,The max.warpage in X-direction is 0.002mm,The max.warpage in Y-direction is,0.01mm.,The max.warpage in,Z,-direction is,0.005mm,The warpage risk is low,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there,.,0.01,0.01,Warpage in Y-dir.,Max.pressure:23.89MPa,The molding condition,is set as,:,Material,:LCP E6808LHF,Melt Temp,:350,Mold Temp,:100,Flow rate,:20cm,3,/s,Packing time:,0.3s,Packing pressure:80%of max.injection pressure,The mold flow meshes are shown as below:,71967,elements,Gate,5.Plug Center I/M,model and molding conditions,2,0%,4,0%,6,0%,8,0%,95,%,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,10.25MPa,so it is acceptable.,5.1.Filling analysis,Max.pressure:10.25MPa,Warpage in,X,-dir.,Key message:,The Max.warpage in X-direction is 0.001mm,The,M,ax.warpage in Y-direction is 0.0,01,mm,.,The,M,ax.warpage in,Z,-direction is 0.0,02,mm,.,The warpage risk is low.,5.2.Warpage analysis,Warpage in Y-dir.,Warpage in,Z,-dir.,Unit:mm,0.001,0.001,0.001,0.002,0.001,Air traps,Weld lines,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there.,5.3.Sink mark analysis,5.4.Conclusions,As shown in the above figures,t,he filling,processes,are,fluent.,The max.injection pressure i,s,10.25MPa,so it is acceptable,.,The max.warpage in X-direction is 0.001mm,The max.warpage in Y-direction is,0.001mm.,The max.warpage in,Z,-direction is,0.002mm,The warpage risk is low,The,welding lines do not develop in the function or appearance zone,so the welding line risk is low,.,The air traps in green zone as shown in the right above figure.So core partition or air vent is suggested there,.,Max.pr