SOP封装工艺流程介绍.ppt

,Confidential,单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,SOP封装工艺流程介绍,Contents,Package Instruction,Process Flow,Quality Control,Package Instruction,SOP,SSOP,3.TSSOP,4.MFP,ASE,ASE,Package Instruction,ASY process flow,Wafer Saw,Die Attach,Wire Bond,Wafer Mount,Wafer Grinding,Epoxy Cure,Molding,P,ost,M,old,C,ure,Plating,Trim/Form,Packing,&Shipping,De-junk,Laser Marking,前段制程,后段制程,Wafer,Die(chip),Die,on Lead frame,Epoxy,Lead Frame,Before,After,Laser Marking,Laser Marking,Laser Marking,Laser Marking,Wafer Grinding,LOAD,UNLOAD,GRINGING,Purpose:,Grinding the wafer to Customer required thickness,Wafer Grinding,晶圓,(,未研磨,),研磨機,晶圓,(,研磨後,),晶元背面,Wafer backside,Frame,Mount Tape,Purpose:,Combine the wafer with D,icing,tape,onto the frame,for,die,sawing,Wafer mount Machine,Wafer Mount,Frame,大家应该也有点累了，稍作休息,大家有疑问的，可以询问和交流,Purpose:,To separate,dies from each other,for die attach,Monitor,Load/Unload,Sawing,Cleaning,Machine,Wafer Saw,Before wafer saw:,After wafer saw:,Wafer Saw,Purpose:,Attach the dies with epoxy on substrate for the following,process,Die Attach,Output,Die bond,Substrate load bond,Working flow:,Die Attach,Robber tip,Lead-frame,Epoxy,Purpose:,Solidify the epoxy after D/A,Inside,Oven,Epoxy Cure,Purpose:,Connecting the chip and the exterior circuit,input,input,output,Bond location,Theory:,Use ultrasonic,thermal,force to form,the intermetallic between golden wire,and joint metal(Al,Au,Ag),Wire Bond,Gold wire,lead,Die,Al pad,Capillary,Mold Machine,Molding,Purpose,:,Seal the product with EMC to prevent die,gold wire from being,damaged,contaminated and oxygenic.,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Plunger,Pot,Gate insert,Runner,Compound,Bottom,cull block,Top,cull block,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom,cull block,Top,cull block,Plunger,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom,cull block,Top,cull block,Plunger,Molding,After Mold,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom,cull block,Top,cull block,Plunger,Epoxy,Lead Frame,Purpose,：,Use laser light irradiated by CO2 or YAG to vapour the EMC to,show content on the package,，,such as date,schedule,place of,production and so on.,Laser Marking,laser,EMC vapoured,Before,After,Laser marking,Oven,Inside,Purpose,:,To let EMC react completely so that products can be protected,more effectively,.,Post mold cure,De-junk,Purpose,：,Remove the dem-bar of leadframe.,Working area,Before,After,Laser Marking,Laser Marking,Plating,Purpose,:,To plating Sn on the lead which will mount on board pad.,load,unload,Plating line,Plating,After,Before,投料區,電解去膠,高壓噴洗,酸洗,收料區,活化槽,電鍍槽,中和槽,熱,D.I.,水,烘,乾,SOLDER PLATING (S/P,區,),ELECTRO DEFLASH (E/D,區,),面板操作,Purpose,:,Remove the tie-bar and lead-frame and form products to units from,strips,fill them into tubes and then pass to next process.,Trim Form,Saw work area,unload,Working area,unload,Laser marking,Trim Form,Working area,Laser marking,unload,unload,Lead Cut,Forming,Quality Control,Die Saw,切偏,Chipping,外观检查,划片宽度量测,Rej,Rej,Lead Frame,Epoxy,Die,Quality Control,Die Shear,Epoxy Void Check,Die Attach,Quality Control,Epoxy Thickness&Fillet Height,Die Attach,Die Location,Rej,Quality Control,Wire Bond,外观检查,第二焊点重叠,Rej,Rej,Rej,Rej,第二焊点偏移,线弧不良,Rej,Rej,Die,Quality Control,推球测试,拉力测试,Wire Bond,Quality Control,Wire Bond,验证级工程确认,IMC Coverage,IMC Thickness,Crater Test,1,st,bond,1,st,bond,2,nd,bond,Looping,Quality Control,Mold,Looping,外观检查,上下错位,孔洞,缺角,溢胶,内部气泡,冲线值量测,Rej,Rej,Rej,Rej,Rej,Plating,外观检查,Solderability test,镀层厚度量测,Quality Control,170C,烘烤,8,小时，,9095C,蒸汽老化,10,小时。锡覆盖率,95%,Rej,Rej,Rej,