FPC-中英文对照演示幻灯片.ppt

,*,FPC,名词中英对照,Quality begins with education,and ends up with education.,Manufacture Procedure,制程,Material Preparation,材料准备,Panelization/Shear,下料,Drilling,钻孔,Copper Plating,镀铜,Electroless Copper Plating,化学铜,Black Hole,黒孔,Sensitive Dry Film,干膜贴合,Exposure,曝光,Developing,显像,Etching,蚀刻,DES,Stripping,脱膜,2,Coverlay Tacking,贴保护膜,Abrade,粗化,Lamination,压着,Curing,熟化,Brushing,刷磨,Pre-treatment,前处理,Surface Treatment,表面处理,Dry up,干燥,Micro-etching,微蚀,Acid Cleaning,酸洗,Water Cleaning,水洗,Anti-corrosion Treatment,防锈处理,anti,表示反对，抵抗,3,(Gold,、,Solder,、,Nickel)Plating,电镀（金、锡、镍）,Flash Plating/Strike Plating,闪镀,Pattern Plate,局部电镀,ENIG:Electroless Nickel/Immersion Gold,化学镍金,Printing of Legend,文字印刷,Back Board Lamination,补强板压着,Electrical Test,电测,Laser Cut,镭射切割,Automatic Optical Inspection,（,AOI,）自动光学检验,Surface Mounting Technology,（,SMT,）表面贴装技术,4,Conductor,导体,Conductor,导体,Open,开路,Short,短路,Nick,缺口,Pinhole,针孔,pin,（针）,+hole,（洞）,Extraneous Copper,铜刺,copper,（铜）,+extraneous,（额外的）,Spur,毛边,Nodule,结瘤,5,Etched Concave,表面缺口,concave,（凹的）,Delamination,分层,Discoloration,异色,dis,（否定前缀）,+coloration,Dent,打痕,Scratch,伤痕,Dent on Coverlay/Covercoat,打痕,Scratch on Coverlay/Covercoat,伤痕,Void,缺胶,Misalign,偏移,Coverlay Burr,毛边,6,Foreign Matters,异物,Conductive Foreign Matter,导电性异物,Conductor Conductive,Non-conductive Foreign Matter,非导电性异物,non,（否定前缀）同,dis,Blistering and Delamination,起泡和分层,Squeeze-out of Adhesive of Coverlay,溢胶,Ooze-out of Covercoat,覆盖涂层渗出,Skipping of Covercoat,覆盖涂层跳漏,7,Surface Condition of Plated Metal and Solder,电镀金属或焊锡的表面条件,Gold Plating,镀金,gold,（金）,+plating,（电镀）,Gold Plating Defect,镀金不良,defect,（缺陷、不良）,Tin Plating,镀锡,分解记忆同,Gold Plating,8,Darkened Appearance(Blackening Discoloration),变暗（变黑）,Plated Expose Wetting,电镀露铜,Expose,（暴露）,exposure,（曝光）,Peeled Off,剥离,Plated Wicking,电镀渗入,No Plating,漏镀,Rough,电镀粗糙,Wicking,药水渗入,9,Visual Inspection of Edges of Outlines and Holes,外形和孔边缘,Tear and Nick,撕裂和缺口,Thready Burr,丝状毛刺,Warpage,弯曲、变形,Poor Micro-joint,微连结不良,joint,（连结）,Outline Misalign,外形偏移,No Outline,外形漏冲,Bending Line Misalign,反折偏移,10,Visual Inspection Related to Stiffener Bonding,补强,Foreign Matter FPC,与补强板之间的异物,Void,气泡,Chip-off,缺角,Deformation,变形,11,Affixed Substances on the Surface,表面附着物,Thermosetting Adhesive,热固胶,PSA-Pressure Sensitive Adhesive,压敏胶,Flux Residue,助焊剂残渣,Residue,（残渣）,Residue of Metal Powders,金属粉末残渣,Powder,（粉末）,Residue of Adhesive,粘结剂残渣,12,Marking,标记,Thickness,厚度,Component Hole,元件孔,Via Hole,导通孔,Via Hole Misalign,导通孔偏移,Mounting Hole,组装孔,SMT(S-Surface,；,M-Mounting,；,T-Technology),13,Conductor Width,导体宽度,width,（宽）,length,（长）,height,（高）,thickness,（厚度）,Clearance between Conductors,导体之间的间距,Distance between Hole Centers,孔中心间距,Minimum Distance between Board Edge and Conductor,板边和导体之间的最小距离,minimum,（最小）,maximum,（最大）,Wrong Marking,标记错误,Unclear Letter,字符不清晰,un,为否定前缀，同,dis,、,non,14,Positional Accuracy,定位精度,Positional Accuracy of Hole,孔的定位精度,Registration of Hole to Land,孔与焊盘的重合性,Registration of Coverlay(or Covercoat)to Land,覆盖层与焊盘的重合性,Registration,重合性,15,Registration of Stiffener to FPC,补强板与,FPC,的重合性,Registration of Hole,孔的重合性,Registration of Outline,外形的重合性,Registration of Punched Outline to Conductor Pattern,冲外形与导体图形的重合性,Punch,冲切,Registration of Pressure Sensitive or Thermosetting Adhesive to FPC and Stiffener,压敏胶或热固胶与,FPC,和补强板的重合性,Pressure Sensitive,压敏胶；,or Thermosetting Adhesive,热固胶,Plating Thickness of Copper Plated-through Hole,镀通孔的镀铜层厚度,16,Board Type,板,Single Sided Flex Board S/S,单面板,Double Access or Back-bared Flex Board,单面双接触板,Double Sided Flex Board D/S,双面板,Rigid-flex Board,软硬结合板,Bare Board,空板,17,Die,模具,Die Drawing,模具图纸,Mass Production Die,量产模具,Mass,（大量的）,Prototype Die,样品模具,Steel Die,钢模,Die,刀模,Top Die,上模,Bottom Die,下模,Wire Cut,线切割,18,Outline Die,外形模具,Pressure Sensitive Adhesive Die,胶纸模具,Stiffener Die,补强模具,Silver Die,银浆模具,Post,导柱,Punch,冲头,Pin,销钉,19,Jig(Fixture),治具,Electrical Test Jig,电测治具,Tacking Jig,假贴治具,Exposure Jig,曝光治具,Screen Printing Frame,丝印网框,20,Hole,孔,Guide Hole for Exposure,曝光定位孔,Guide Hole for Die,模具定位孔,Guide Hole for Tacking,假贴定位孔,Guide Hole for Adhesive,贴合定位孔,Guide Hole for Electrical Test,电测定位孔,Guide Hole for Screen Printing,丝印定位孔,Lifted Land,孔环,Stannize Hole,渗锡孔,Fitting Hole,装配孔,21,Material,原材料,Copper Foil(Cu),铜箔,EDElectro Deposit,电解铜,RARolled Annealed,压延铜,CVLCoverlay,保护胶片,Base Material,基材,FCCLFlexible Copper Clad Laminate,挠性覆铜板,22,PIPolyimide,聚酰亚胺,PETPolyester Film,聚酯,FR4Fiberboard,玻纤板,Sheet Steel,钢片,PSA,（,Pressure Sensitive Adhesive,）压敏胶,Release Paper,离型纸,Stiffener,补强,23,FPC Reliability Test Items,Testing of Electrical Performance,电气性能,SIRSurface Insulation Resistance,表面层绝缘电阻,Dielectric Withstanding Voltage of Surface Layers,表面介质层耐电压强度,Withstanding,承受,Testing of Mechanical Property,机械性能测试,Peel,Strength,剥离强度,24,Pull-out Strength for Plain Holes and Footprints,孔和焊垫的拉脱强度,Footprints,脚印，足迹,Plating Adhesion,镀层附着,力,(Ad)Adhesive,接着剂,Solderability,可焊性,Flexural Endurance,耐弯折性,Environmental Performance,环境性能,Temperature Cycle,温度循环,Humidity Test,湿度测试,Thermal Shock,冷热冲击,25,Migration,迁移性,Chemical Resistance,耐化学性,Cleanliness,清洁度,Flame Resistance,阻燃性,Shear Test,推力测试,Handset Renovate Test,翻盖测试,Window Bend Test,窗口弯折测试,Sliding Test,滑盖测试,Slide,滑动，滑行,26,Pull Strength Test,焊点拉伸强度测试,Pull:,拉,Push,：推,Salt,（盐）,Fog,（雾）,Test,Cross Section,切片检测,Section,区域,Plating Thickness,镀层厚度,Constant Temperature and Humidity,恒温恒湿,Constant,恒定的，常数,Fold Fatigue Test,翻折疲劳测试,Dimensional Stability,尺寸安定性,Ductility,延展性,27,Others,其他,Temperature,温度,Humidity,湿度,Pressure,压力,Line Width/Space,线宽,/,线距,Pitch,线路间距,Connector,连接器,(abbr.Conn.,）,Capacitance(C),电容,Capacity,容量,Resistance(R),电阻,Diode,（,D,）二极管,ESDElectro-Static Discharge,静电,28,Shortage,短装,Mixed Packing,混装,AQLAcceptable Quality Level,品质允收标准,Traveler,流程单,Boundary Sample,限度样本,Checklist,检查清单,Tracking List,追踪表,Trend Chart,走势图,Foolproofing/Bakayoke,防呆法,Shielding,屏蔽层,29,常用缩写,质量管理五大工具,APQP:Advanced Product Quality Planning,产品质量先期策划,SPC:Statistical Process Control,统计过程控制,FMEA:Failure Mode and Effect Analysis,失效模式和效果分析,MSA:Measurement System Analysis,测量系统分析,PPAP:Production Part Approval Process,生产件批准程序,30,油墨,1.EMIElectro-Magnetic Interference,电磁屏蔽膜,2.S/R/S/MSolder Resistance/Mask,阻焊油墨,3.PSRPhoto-sensitive Solder Resistance,感光油墨,4.Silver,银浆,31,IC,封装形式,BGABall Grid Array,球栅阵列结构,QFNQuad Flat No-lead Package,方形扁平无引脚封装,QFPPlastic Quad Flat Package,方型扁平式封装技术,CSPChip Scale Package,芯片尺寸封装,TSOPThin Small Outline Package,薄型小尺寸封装,32,RMAReturn Material Authorization,退货授权,MRBMaterial Review Board,材料审查会议,ECNEngineering Change Notice,PCNProcess Change Notice,工序变更通知,CTECoefficient of Thermal Expansion,热膨胀系数,BTOBuild to Order,产品按照客户订单生产,QPAQuality Process Audit,品质过程稽核,QSAQuality System Audit,品质系统稽核,GR&R:Gauge Repeatability/Reproducibility,评价重复性和再现性,33,精益生产八大浪费,DOWNTIME,DDefect,不良品,OOver production,过量生产,WWaiting,等待,NNon-utilize,未使用的,TTransportation,物料运输,IInventory,库存,MMotion,移动,EExtra process,多余步骤,34,英文邮件,1.,格式,Dear Aria,.,Best wishes,/Best regards,Tom.,2.,活用词、句子,FYI.For your information,P.S.Postscript,后记，附言,35,常用语句,1.May I have your attention to sth.,please?,2.There is sth.I need you to pay attention to.,3.Please kindly be informed/advised that.,4.Please note that.,5.I want to inform you that.,6.We would be grateful if you could.,7.It is greatly appreciated if you could.,36,8.I am enclosing.,我附上,.,9.Please find enclosed.,请查阅附件,.,10.Attached hereto.,附件是关于,.,11.If you have any further questions,please feel free to contact me.,如果你有任何问题，请不要客气与我联络,12.Please feel free to contact me at any time,I will continually provide full support.,请随时跟我联络，我会持续地提供全程支援。,37,13.Once confirmed,I will,let you know immediately,；,notice you ASAP(as soon as possible).,一旦确认，我会立刻第一时间通知你。,14.,表示感谢：,Thank you very much.,Thanks a lot.,Many thanks.(,用于关系较亲密的同事、朋友）,38,15.We look forward to hearing from you soon.,我们期待很快能得到您的回复。,16.I look forward to receiving your reply soon.,我期待很快能收到你的回复。,17.Looking forward to receiving your comments in due course.,期待在预期的时间收到你的反馈。,18.Any comments will be much appreciated.,对于您的任何建议，我将非常感激。,39,19.If you have any queries,a.please feel free to contact me;b.please contact me without hesitation;c.please do not hesitate to contact me.,20.Attachment,附件,Please refer to the attached file.,Please take the attachment for reference.,Please review the attached file.,Attached please find.,40,